A sheet bonding device includes a pressurization mold which is constituted of an upper mold and a lower mold and performs sealing through heating by sandwiching a sealing target portion of a bag main body and a sealing target portion of a gas barrier function sheet with pressurization surfaces; a plurality of support pins which are provided in the lower mold so as to be retractable and position the gas barrier function sheet with respect to one surface of the bag main body by penetrating the sealing target portions of the bag main body and the gas barrier function sheet; and gas spray means for making the gas barrier function sheet float by spraying inert gas to an area-enlarged portion, which does not overlap the bag main body, of the gas barrier function sheet supported by the support pins.

Disclosed is an assembly arrangement system, comprising a feeding unit, a conveyor unit and an assembling unit. The feeding unit comprises a supplying part and a cutting part. The supplying part is provided with a prepreg and configured to supply the prepreg to the cutting part. The cutting part cuts the prepreg to continuously form one or more prepreg sheets. The conveyor unit receives and conveys the prepreg sheet. The assembling unit comprises a metal foil supplying part, a first assembling part and a second assembling part. The second assembling part assembles a plate and a metal foil from the metal foil supplying part with the prepreg sheet from the conveyor unit into an assembly, and the first assembling part bears the assembly. Also provided is an assembly manufacturing method.

An automated labeling method and apparatus includes a label web-severing mechanism and a label-applying assembly, the web-severing mechanism configured to synchronously sever a plurality of labels from a self-wound label web, and the label-applying assembly configured to synchronously apply the plurality of severed labels to a corresponding plurality of articles to be labeled.

An apparatus for bonding semiconductor chips may comprise transfer rails configured to transfer substrates, loading members configured to load the substrates onto the transfer rails, unloading members configured to unload the substrates from the transfer rails, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates. An apparatus for bonding semiconductor chips may comprise a transfer rail configured to transfer substrates, loading members configured to load the substrates onto the transfer rail, unloading members configured to unload the substrates from the transfer rail, a buffer member at a side of the transfer rail configured to temporarily receive the substrates loaded by the loading members, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates.

An apparatus for bonding semiconductor chips may comprise transfer rails configured to transfer substrates, loading members configured to load the substrates onto the transfer rails, unloading members configured to unload the substrates from the transfer rails, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates. An apparatus for bonding semiconductor chips may comprise a transfer rail configured to transfer substrates, loading members configured to load the substrates onto the transfer rail, unloading members configured to unload the substrates from the transfer rail, a buffer member at a side of the transfer rail configured to temporarily receive the substrates loaded by the loading members, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates.