Embodiments generally relate to chips containing one or more hermetically sealed chambers that may be dismantled under controlled conditions using a release technique. In one embodiment a chip comprises a first hermetic seal bonding first and second elements to create a first chamber and a second hermetic seal bonding third and fourth elements to create a second chamber encompassing the first chamber. The first hermetic seal may be broken open independently of the second hermetic seal by the application of a mechanical or thermal technique.

Methods, systems and devices to divide a layer of a first material from another material, to which is attached, are provided. Particularly, for the separation of the PVC from a modular carpet. By the use of a parallel blades mechanism that through an opposite counterpart apply at least a shear stress over the material of the modular carpet to tear the PVC layer and divide it. The carpet is preheated to facilitate the process of division and reuse of said PVC.

A method includes: a first step of disposing the superposed substrate at a position where the superposed substrate is not in contact with a first holding unit and a second holding unit in a space between the first holding unit and the second holding unit, and supplying an inert gas into the space; a second step of thereafter relatively moving the first holding unit and the second holding unit in the vertical direction, and holding the processing target substrate by the first holding unit and holding the supporting substrate by the second holding unit; and a third step of thereafter relatively moving the first holding unit and the second holding unit in the horizontal direction while heating the processing target substrate held by the first holding unit and the supporting substrate held by the second holding unit, to separate the processing target substrate and the supporting substrate from each other.

A peeling device for peeling off a substrate to be processed and a support substrate from an overlapped substrate, the overlapped substrate being formed by bonding the substrate to be processed and the support substrate by an adhesive, which includes: a first holding unit configured to heat the substrate to be processed and configured to hold the substrate to be processed; a second holding unit configured to heat the support substrate and configured to hold the support substrate; a moving mechanism configured to horizontally move at least one of the first holding unit and the second holding unit relative to each other; and an inert gas supply mechanism configured to supply an inert gas onto a bonding surface of the substrate to be processed or a bonding surface of the support substrate.

Methods, systems and devices to divide a layer of a first material from another material, to which is attached, are provided. Particularly, for the separation of the PVC from a modular carpet. By the use of a parallel blades mechanism that through an opposite counterpart apply at least a shear stress over the material of the modular carpet to tear the PVC layer and divide it. The carpet is preheated to facilitate the process of division and reuse of said PVC.

Methods, systems and devices to divide a layer of a first material from another material, to which is attached, are provided. Particularly, for the separation of the PVC from a modular carpet. By the use of a parallel blades mechanism that through an opposite counterpart apply at least a shear stress over the material of the modular carpet to tear the PVC layer and divide it. The carpet is preheated to facilitate the process of division and reuse of said PVC.

A method and device for detaching a first substrate, which is connected to a second substrate by an interconnect layer, from the second substrate by embrittlement of the interconnect layer. A method for bonding of a first substrate to a second substrate with an interconnect layer which can be embrittled by cooling. A use of a material which can be embrittled for producing an interconnect layer between first and second substrate for forming a substrate stack. A substrate stack, formed from a first substrate, a second substrate and an interconnect layer located therebetween, the interconnect layer formed from a material which can be embrittled. A wafer chuck for holding a first substrate when the first substrate is being detached from a second substrate with fixing means which can be activated by lowering the temperature.

Exfoliation of graphene from graphite using multilayer coextrusion is generally disclosed. In some example embodiments, graphite may be dispersed within a first processing material, and the first processing material and a second processing material may be co-extruded through a plurality of series coupled layer multiplication dies to exfoliate graphene from the graphite. The graphene may be separated from the resulting multi-layered material. In some example embodiments, graphite flake and/or expanded graphite may be dispersed within the first processing material.

Automatic separation of substrates from spacers within a substrate/spacer stack or laminate for use during a hard disk recording media fabrication process. In one example, a delamination apparatus includes a roller or brush configured to rotate while pressing against a flat surface of a substrate at one end of the laminate to peel the substrate from the laminate to expose an adjacent spacer and to then rotate against a flat surface of the spacer to peel the spacer from the laminate to expose another substrate of the laminate. The apparatus also includes a pusher bar configured to push against the opposite end of the laminate to push the laminate against the roller. The pusher bar may be offset from a central longitudinal axis of the laminate. A bath may be provided for submerging the laminate, the pusher, and the roller in a lubricating liquid. Method embodiments are also described.