Cobalt-based alloy compositions are described herein having properties compatible with thermal spray and sintering techniques. Such alloy compositions can provide claddings to a variety of metallic substrates having complex geometries, wherein the claddings exhibit desirable density, hardness, wear resistance and corrosion resistance. Briefly, an alloy composition described herein comprises 15-25 wt. % chromium, 15-20 wt. % molybdenum, 0-15 wt. % tungsten, 10-20 wt. % nickel, 2.5-3.5 wt. % boron, 2.5-4.5 wt. % silicon, 1-2 wt. % carbon and the balance cobalt, wherein a ratio of boron to silicon (B/Si) in the alloy composition ranges from 0.5 to 1.0.

A process for producing a titanium load-bearing structure, which comprises cold-gas dynamic spraying of titanium particles on to a suitably shaped support member, and a titanium load bearing structure so-produced.

A composite is obtained by press-molding a mixed powder comprising 20-50 vol % of a metal powder and 50-80 vol % of a diamond powder for which a first peak in a volumetric distribution of particle size lies at 5-25 m, and a second peak lies at 55-195 m, and a ratio between the area of a volumetric distribution of particle sizes of 1-35 m and the area of a volumetric distribution of particle sizes of 45-205 m is from 1:9 to 4:6, thereby obtaining a composite having a high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, which is easy to mold into a prescribed shape.

An aluminum-diamond composite that exhibits both high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, and that can suppress the occurrence of swelling, etc., of a surface metal layer portion even in actual use under a high load. An aluminum-diamond composite includes 65-80 vol % of a diamond powder having a roundness of at least 0.94, for which a first peak in a volumetric distribution of grain size lies at 5-25 m, and a second peak lies at 55-195 m, and a ratio between the area of the volumetric distribution of grain sizes of 1-35 m and the area of the volumetric distribution of grain sizes of 45-205 m is from 1:9 to 4:6; the balance being composed of a metal containing aluminum.

The substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties, and a metal layer stacked on at least one surface of the base film, in which the base film includes a portion where a transition metal in group 10 of the periodic table is present. The transition metal in group 10 is preferably nickel or palladium. The portion where the transition metal in group 10 is present preferably includes a region having an average thickness of 500 nm and extending from an interface with the metal layer.

The present invention discloses a novel and inventive transparent conductive film Differing from conventional metal mesh substrates are mainly constituted by silver nanowires (AgNW), the present invention particularly designs a nano metal wire consisting of a metallic core wire, a transition layer and a protection layer, and further develops a transparent conductive film consisting of a substrate and a metal mesh layer; wherein the metal mesh layer is constituted by the said nano metal wires. It is worth describing that, a variety of experimental data prove that the thermal resistance of this novel transparent conductive film is up to 400 C.; moreover, experimental data also exhibit that the transparent conductive film can filter part of blue light portion out of a white light by 20-30%.

A sliding engine component may include a substrate having a surface coated with a first electroplated metallic layer and a second electroplated metallic layer. The first metallic layer may be disposed between the substrate and the second metallic layer. The first metallic layer and the second metallic layer may have a grained structure. The grained structure of each of the first metallic layer and the second metallic layer may have an aspect ratio between a mean grain size perpendicular to the substrate surface and a mean grain size parallel to the substrate surface. The aspect ratio of the second metallic layer may be less than the aspect ratio of the first metallic layer.

An article of manufacture includes a part structure formed via a first additive manufacturing process and a floating structure within the part structure which is mechanically decoupled from the part structure. The floating structure is formed concurrently with the part structure via the first additive manufacturing process.

A method of surface coating a metallic object, including removing substantially all of the existing silver sulfide tarnish if present, ultrasonically cleaning the object with immersion in a solvent, uniformly dispersing selected nanoparticles over the surface of the object by sonicating the object in an ultrasonic bath containing the selected nanoparticles. The invention further includes quickly rinsing the object with solvent upon removal from the ultrasonic bath to inhibit formation of large agglomerates, drying the object with a flow of gas, optically inspecting the object for the presence of agglomeration and applying a barrier layer conformal coating and a protective layer conformal coating.

Provided is a sliding member comprising: a steel back metal layer; and a sliding layer including a porous sintered layer and a resin composition. The porous sintered layer includes Fe or Fe alloy granules and a NiP alloy part functioning as a binder for binding the Fe or Fe alloy granules with one another and/or for binding the Fe or Fe alloy granules with the steel back metal layer. The steel back metal layer is made of a carbon steel including 0.05 to 0.3 mass % of carbon, and includes: a non-austenite-containing portion having a structure of a ferrite phase and perlite formed in a central portion in a thickness direction of the steel back metal layer; and an austenite-containing portion having a structure of a ferrite phase, perlite and an austenite phase formed in a surface portion of the steel back metal layer facing the sliding layer.