An electrical assembly includes an electrical connector soldered to a conductive pad disposed on a glass surface by a solder alloy consisting essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy being tin.

A calcium-magnesium-alumino-silicate (CMAS)-reactive thermal barrier coating includes a ceramic coating and a CMAS-reactive overlay coating, wherein the CMAS-reactive overlay coating conforms to a surface of the ceramic coating and comprises a compound that forms a stable high melting point crystalline precipitate when reacted with molten CMAS at a rate that is competitive with CMAS infiltration kinetics into the thermal barrier coating. The ceramic coating phase is stable with the CMAS-reactive overlay coating.

A coated substrate has a substrate and a coating system having one or more ceramic layers. At least a first layer of one of the one or more ceramic layers is a columnar layer having as-deposited columns and intercolumn gaps. The intercolumn gaps have a mean width at least one of: at least 4.0 micrometers; and at least 1.5% of a thickness of said first layer.

A superalloy workpiece includes a superalloy substrate and an interface layer (IF-1) of essentially the same superalloy composition directly on a surface of the superalloy substrate. A transition layer (TL) of essentially the same superalloy and superalloy oxides or a different metal composition and different metal oxides is on the interface layer (IF-1). The oxygen content of the transition layer increases from the interface layer (IF-1) towards a barrier layer (IF-2) of super alloy oxides or of different metal oxides.

A coated substrate includes a coating, wherein the coating includes, starting from the substrate in this order: a. a layer of diamond-like carbon, b. a metallic multi-ply layer, wherein the metallic multi-ply layer contains b1) tin and at least one alloying element for tin, or b2) magnesium and at least one alloying element for magnesium, wherein the metallic multi-ply layer is formed from two, three, or more plies, wherein one or more plies contain tin and one or more plies made of at least one alloying element for tin selected from antimony, copper, lead, silver, indium, gallium and/or germanium, are arranged alternatingly, or wherein one or more plies contain magnesium and one or more plies made of at least one alloying element for magnesium selected from aluminum, bismuth, manganese, copper, cadmium, iron, strontium, zirconium, thorium, lithium, nickel, lead, silver, chromium, silicon, tin, gadolinium, yttrium, calcium and/or antimony, are arranged alternatingly.

An electrical assembly includes an electrical connector soldered to a conductive pad disposed on a glass surface by a solder alloy consisting essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy being tin.

A method for fabricating a substrate provided with a plurality of layers, includes: providing a steel substrate with an oxide layer including metal oxides on the steel substrate; providing a metal coating layer directly on the oxide layer, the metal coating layer including: at least 8% by weight nickel; at least 10% by weight chromium; and a remainder being iron and impurities from a fabrication process; and providing an anti-corrosion coating layer directly on the metal coating layer.

A hot stamped steel includes a base material that is formed of steel, a plated layer that is formed on a surface of the base material, and a phosphate coating that is formed on a surface of the plated layer; chemical composition of the plated layer contains 20.00 to 45.00 mass % of Al, 10.00 to 45.00 mass % of Fe, 4.50 to 15.00 mass % of Mg, 0.10 to 3.00 mass % of Si, 0.05 to 3.00 mass % of Ca, 0 to 0.50 mass % of Sb, 0 to 0.50 mass % of Pb, 0 to 1.00 mass % of Cu, 0 to 1.00 mass % of Sn, 0 to 1.00 mass % of Ti, 0 to 0.50 mass % of Sr, 0 to 1.00 mass % of Cr, 0 to 1.00 mass % of Ni, and 0 to 1.00 mass % of Mn with a remainder of Zn and impurities; the phosphate coating consists of zinc phosphate crystals containing 5.0 to 50.0 mass % of Mg and 0.5 to 5.0 mass % of Ca; and the adhesion amount of the phosphate coating per one surface is in a range of 0.1 to 10.0 g/m.sup.2.

A coated substrate, includes a coating that includes, starting from the substrate in this order: a) a layer of diamond-like carbon (DLC), b) a metallic, single-ply or multi-ply layer, and c) an oxygen barrier layer, wherein the metallic, single-ply or multi-ply layer contains b1) tin or tin and at least one alloying element for tin, which are present unalloyed and/or alloyed, or b2) magnesium and at least one alloying element for magnesium, which are present unalloyed and/or alloyed. The coated substrate protects the DLC layer, as a result of which said layer can be tempered. The coating has good mechanical stability and good aging stability before heat treatment.

An electrical connector includes a first layer having a first coefficient of thermal expansion and a second layer overlaying the first layer having a second coefficient of thermal expansion. A first difference between the first coefficient of thermal expansion and a coefficient of thermal expansion of glass is greater than a second difference between the second coefficient of thermal expansion and the coefficient of thermal expansion of glass. The electrical connector further includes a layer of a solder alloy having about 15% to 28% indium by weight, about 5% to 20% zinc by weight, about 1% to 6% silver by weight, and at least 36% tin by weight. The solder layer is disposed on at least a portion of the second layer.