A terminal material for connectors, which is obtained by sequentially laminating on a substrate that is formed of copper or a copper alloy, a nickel or nickel alloy layer, a copper-tin alloy layer and a tin layer in this order, and: the tin layer has an average thickness of from 0.2 m to 1.2 m (inclusive); the copper-tin alloy layer is a compound alloy layer that is mainly composed of Cu.sub.6Sn.sub.5, with some of the copper in the Cu.sub.6Sn.sub.5 being substituted by nickel, and has an average crystal grain diameter of from 0.2 m to 1.5 m (inclusive); a part of the copper-tin alloy layer is exposed from the surface of the tin layer, with the exposure area ratio being from 1% to 60% (inclusive); the nickel or nickel alloy layer has an average thickness of from 0.05 m to 1.0 m (inclusive) and an average crystal grain diameter of from 0.01 m to 0.5 m (inclusive).

A technique capable of reducing the possibility of generation of a CuSb compound in an overlay and the possibility of delamination between layers. A sliding member includes: an overlay including an alloy plating film of Bi and Sb; a lining including an Al alloy; a first intermediate layer including Cu as a main component, and laminated on the lining; and a second intermediate layer including Ag as a main component, and connecting the first intermediate layer and the overlay.

A slide member is provided with a base material and a slide layer. The slide layer is disposed on at least a portion of the base material. The slide layer contains a solid lubricant and a plurality of hard particles, the hard particles being harder than the solid lubricant.

A ceramic electronic component includes a body including dielectric layers and a plurality of internal electrodes disposed to face each other while having each of the dielectric layers interposed therebetween; and external electrodes including a connection portion disposed on end surfaces of the body opposing each other and band portions extending onto portions of upper and lower surfaces of the body from the connection portion, wherein the external electrodes include electrode layers connected to the plurality of internal electrodes, conductive resin layers disposed on the electrode layers, Ni plating layers disposed on the conductive resin layers, and Sn plating layers disposed on the Ni plating layers, and tc1 is 0.5 m or more and tc2/tc1 is 1.2 or less, in which a thickness of the Ni plating layer in the connection portion is tc1 and a thickness of the Ni plating layer in the band portion is tc2.

The present invention provides a wiring board having a conductor portion on which mounting is suitably possible and a method for manufacturing the wiring board. Since an initial Cu plated layer is formed by plating so as to cover the surface of a metallized layer and then the initial Cu plated layer is heated to be softened or melted, copper in the softened or melted initial Cu plated layer enters into open pore portions of the metallized layer. In addition, during the heating, components of the metallized layer and components of the initial Cu plated layer are mutually thermally diffused. Consequently, when solidified later (that is, when the initial Cu plated layer becomes a lower Cu plated layer), the adhesiveness between the metallized layer and the lower Cu plated layer is improved due to, for example, an anchoring effect and a mutual thermal diffusion effect, and therefore mountability is improved.

A surface-treated material of the present disclosure has a conductive substrate, and a surface treatment film which includes at least one layer of metal layers and is formed on the conductive substrate. The surface treatment film is a plating film. The surface treatment film is formed on a whole surface or a part of the conductive substrate through a zinc-containing layer that contains zinc as a main component and has a thickness of 50 nm or less, or is formed on the conductive substrate without through the zinc-containing layer. The surface-treated material has a ratio of a contact area to a test area of 85% or more as measured according to a tape test method defined in JIS H 8504: 1999.

The present invention is intended to provide a roll-bonded laminate, in which an ultrathin metal layer is laminated on another metal without generation of wrinkles, cracks and the like. A roll-bonded laminate formed by lamination of at least three layers, which comprises a peelable carrier layer 10, an ultrathin metal layer 20 and a metallic foil 30, wherein the thickness of the ultrathin metal layer 20 is 0.5 ?m or more and 20 ?m or less.

Golden bronze appearance article, multiple-layer substrate, related methods and uses thereof, particularly for coinage blanks. Methods of producing an article having a golden bronze appearance include annealing a multiple-layer substrate at an annealing temperature for an annealing residence time. The multiple-layer substrate includes a core, contiguous to a copper layer and subsequent tin layer. The annealing temperature and annealing residence time are controlled in accordance with each other for allowing diffusion of the tin layer into the copper layer and producing an annealed substrate comprising an inter-diffused outer bronze layer having a golden appearance. The tin layer thickness is in accordance to the copper layer thickness such that the inter-diffused outer bronze layer has a tin content between about 8% wt. and about 15.8% wt. The core has a sufficiently low content of nickel to reduce or prevent formation of intermetallic compound comprising tin and nickel proximate to the core during annealing.

An electrical connector includes a first layer formed of a copper based material and a second layer formed of an iron-nickel alloy. The second layer has a thickness of 8% to 30% of the thickness of the electrical connector. The electrical connector also includes a third layer which is formed of a solder alloy that consists essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy that is tin.

One aspect of this copper alloy for an electronic and electrical equipment contains: more than 2.0 mass % to 36.5 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.15 mass % to less than 1.00 mass % of Ni; and 0.005 mass % to 0.100 mass % of P, with the balance containing Cu and inevitable impurities, wherein atomic ratios of amounts of elements satisfy 3.00<Ni/P<100.00 and 0.10<Sn/Ni<2.90, and a strength ratio TS.sub.TD/TS.sub.LD of tensile strength TS.sub.TD in a direction perpendicular to a rolling direction to tensile strength TS.sub.LD in a direction parallel to the rolling direction exceeds 1.09.