There are provided an electronic component metal material having low insertability/extractability, low whisker formability and high durability, and a method for manufacturing the electronic component metal material. The electronic component metal material 10 includes a base material 11, an A layer 14 constituting an outermost surface layer on the base material 11 and formed of Sn, In or an alloy thereof, and a B layer 13 constituting a middle layer provided between the base material 11 and the A layer 14 and formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, wherein the outermost surface layer (A layer) 14 has a thickness larger than 0.2 m, and the middle layer (B layer) 13 has a thickness of 0.001 m or larger.

A multi-layer preform sheet having at least a first layer and a second layer, the first layer being composed of a solder material that contains an intermetallic compound, and the second layer containing a first metal having a melting point of 300 C. or above, and a second metal capable of forming an intermetallic compound with the first metal.

A steel sheet for a container includes: a steel sheet; a coated layer which contains Ni and is provided as an upper layer of the steel sheet; and a chemical treatment layer which is provided as an upper layer of the coated layer, and contains a Zr compound in an amount of 3.0 to 30.0 mg/m.sup.2 in terms of Zr metal, and a Mg compound in an amount of 0.50 to 5.00 mg/m.sup.2 in terms of Mg metal, in which the coated layer is one of the group consisting of a Ni coated layer which contains Ni in amount of 10 to 1000 mg/m.sup.2 in terms of Ni metal, and a composite coated layer which contains Ni in an amount of 5 to 150 mg/m.sup.2 in terms of Ni metal and Sn in an amount of 300 to 3000 mg/m.sup.2 in terms of Sn metal, and has an island-shaped Sn coated layer formed on an FeNiSn alloy layer.

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

The invention relates to a zinc-free spray powder for thermally coating a substrate, in particular for thermally coating a bearing part of a bearing apparatus, which spray powder has the following composition except for unavoidable contaminants: tin=5% to 30% weight percent; aluminum=0.1% to 5% weight percent; iron=at most 1% weight percent, and copper=difference to 100% weight percent. The invention furthermore relates to a layer system applied via thermal spraying, a work piece, particularly a connecting rod, as well as a spray method for manufacturing a spray layer.

It is aimed to provide a plated member and a plated terminal for connector, to which a large current can be applied and which have both a low friction coefficient and high heat resistance, at low cost and provide a method for producing such a plated member and a method for producing such a plated terminal for connector. A silver-tin alloy layer for coating a surface of a base material made of copper or copper alloy and a silver coating layer for coating the silver-tin alloy layer and to be exposed on an outermost surface are simultaneously formed by heating to obtain a plated member after tin and silver plating layers are alternately laminated on the surface of the base material with the outermost surface formed by the silver plating layer.

The present invention relates to a copper alloy for electric and electronic device, a copper alloy sheet for electric and electronic device, a conductive component for electric and electronic device, and a terminal. The copper alloy for electric and electronic device includes more than 2.0 mass % to 15.0 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.05 mass % to less than 1.00 mass % of Ni; 0.001 mass % to less than 0.100 mass % of Fe; 0.005 mass % to 0.100 mass % of P; and a remainder comprising Cu and unavoidable impurities, in which 0.002Fe/Ni<1.500, 3.0<(Ni+Fe)/P<100.0, and 0.10<Sn/(Ni+Fe)<5.00 were satisfied by atomic ratio, and a yield ratio YS/TS is more than 90% which is calculated from a strength TS and a 0.2% yield strength YS when a tensile test is performed in a direction parallel to a rolling direction.

Tin-plated copper-alloy material for terminal in which: a Sn-based surface layer is formed on a surface of a substrate made of Cu alloy, and a CuSn alloy layer is formed between the Sn-based surface layer and the substrate; the CuSn alloy layer is an alloy layer containing Cu.sub.6Sn.sub.5 as a major proportion and having a compound in which a part of Cu in the Cu.sub.6Sn.sub.5 is substituted by Ni and Si in the vicinity of a boundary face at the substrate side; an average thickness of the Sn-based surface layer is 0.2 m or more and 0.6 m or less; an oil-sump depth Rvk of the CuSn alloy layer is 0.2 m or more; an area rate of the CuSn alloy layer exposed at a surface of the Sn-based surface layer is 10% or more and 40% or less; and dynamic friction coefficient is 0.3 or less.

An electrical contact material (10) having: a conductive substrate (1) formed from copper or a copper alloy; a first intermediate layer (2) provided on the conductive substrate (1); a second intermediate layer (3) provided on the first intermediate layer (2); and an outermost layer (4) formed from tin or a tin alloy and provided on the second intermediate layer (3), wherein the first intermediate layer (2) is constructed as one layer of grains extending from the conductive substrate (1) side to the second intermediate layer (3) side, and wherein, in the first intermediate layer (2), the density of grain boundaries (5b) extending in a direction in which the angle formed by the grain boundary in interest and the interface between the conductive substrate and the first intermediate layer is 45 or greater, is 4 m/m.sup.2 or less; a method of producing the same; and a terminal.

There are provided a metal material for electronic component which has low insertability/extractability, low whisker formability, and high durability, and a method for manufacturing the metal material. The metal material 10 for electronic components has a base material 11, an A layer 14 constituting a surface layer on the base material 11 and formed of Sn, In or an alloy thereof, and a B layer 13 constituting a middle layer provided between the base material 11 and the A layer 14 and formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, wherein the surface layer (A layer) 14 has a thickness of 0.002 to 0.2 m, and the middle layer (B layer) 13 has a thickness of 0.001 to 0.3 m.