An electrical assembly includes an electrical connector soldered to a conductive pad disposed on a glass surface by a solder alloy consisting essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy being tin.

A soldered product comprising a first component soldered to a second component is provided. The first component comprises a stainless steel substrate, an adhesion promoter layer made of nickel deposited on at least one joining surface of the stainless steel substrate; and a tin layer deposited on the adhesion promoter layer. The tin layer has a layer thickness in the range of 10-30 μm. The second component is typically a rare earth magnet.

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

A method of extending the corrosion resistance of a ground anchoring region of a steel or alloy fence or trellis post already having a sacrificial coating or non-sacrificial coating along an entire length of the fence or trellis post, said method including the step of applying at least one additional coating to the ground anchoring region so as to extend the corrosion resistance of the ground anchoring region. The at least one additional coating can be a sacrificial coating and/or non-sacrificial coating.

A method for plating a stainless steel substrate is provided. According to one embodiment, the method comprises sandblasting at least one joint surface of a stainless steel substrate and treating the joint surface of the stainless steel substrate with an aqueous solution (acid bath) which contains sulfuric acid, nitric acid and hydrofluoric acid. The stainless steel substrate is then rinsed with hydrochloric acid. The method further includes galvanic deposition of a nickel plating on the joining surface of the stainless steel substrate and the subsequent deposition of a tin layer on the nickel-coated joining surface of the stainless steel substrate.

An electrical connector includes a first layer having a first coefficient of thermal expansion and a second layer overlaying the first layer having a second coefficient of thermal expansion. A first difference between the first coefficient of thermal expansion and a coefficient of thermal expansion of glass is greater than a second difference between the second coefficient of thermal expansion and the coefficient of thermal expansion of glass. The electrical connector further includes a layer of a solder alloy having about 15% to 28% indium by weight, about 5% to 20% zinc by weight, about 1% to 6% silver by weight, and at least 36% tin by weight. The solder layer is disposed on at least a portion of the second layer.

A slide member is provided with a base material, a plated slide layer and an intermediate plated layer. The plated slide layer contains a solid lubricant. The intermediate plated layer is disposed between the base material and the plated slide layer, the intermediate plated layer increasing cohesion of the base material and the plated slide layer. The plated slide layer has a content of the solid lubricant in a range from 30 to 70 vol %, inclusive.

An electrical connector includes a first layer having a first coefficient of thermal expansion and a second layer overlaying the first layer having a second coefficient of thermal expansion. A first difference between the first coefficient of thermal expansion and a coefficient of thermal expansion of glass is greater than a second difference between the second coefficient of thermal expansion and the coefficient of thermal expansion of glass. The electrical connector further includes a layer of a solder alloy having about 15% to 28% indium by weight, about 5% to 20% zinc by weight, about 1% to 6% silver by weight, and at least 36% tin by weight. The solder layer is disposed on at least a portion of the second layer.

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

Steel sheet for cans high in strength and excellent in formability and appearance comprising C: 0.0010 to 0.0035%, Si: 0.050% or less, Mn: 0.10 to 0.50%, P: 0.040% or less, S: 0.040% or less, Al: less than 0.005%, N: 0.0050% or less and a balance of Fe and unavoidable impurities, wherein an average value of a ratio of length of crystal grains in a sheet thickness direction to length in a sheet width direction is 0.70 or more, a yield strength is 500 MPa or more, and, in a range of 0 to 90° of the rolling direction, a minimum value of an r-value is 1.50 or more, an average value of the r-value is 1.70 or more, and a difference of the maximum value and minimum value of the r-value is 0.50 or less.