The Sn-plated steel sheet of the disclosure is an Sn-plated steel sheet including: a steel sheet; an Sn plating layer formed on at least one side of the steel sheet and containing, based on % by mass, from 0.1 g/m.sup.2 to 15 g/m.sup.2 of metal Sn; and a coating layer formed on the surface of the Sn plating layer and containing zirconium oxide and tin oxide; in which the content of the zirconium oxide in the coating layer is from 0.2 mg/m.sup.2 to 50 mg/m.sup.2 in terms of metal Zr amount, and the peak position of binding energy of Sn3d.sub.5/2 according to X-ray photoelectron spectroscopy of the tin oxide in the coating layer is 1.6 eV or higher than the peak position of binding energy of the metal Sn.

The Sn-based alloy plated steel sheet of this disclosure includes: a steel sheet; a composite plating layer formed on at least one side of the steel sheet and including an FeNiSn alloy layer and an island-shaped Sn layer located on the FeNiSn alloy layer; and a coating layer formed on the surface of the composite plating layer and containing zirconium oxide and tin oxide, and the composite plating layer contains a predetermined amount of Ni and a predetermined amount of Sn, a content of the zirconium oxide in the coating layer is from 0.2 mg/m.sup.2 to 50 mg/m.sup.2 in terms of metal Zr amount, and a peak position of binding energy of Sn3d.sub.5/2 according to X-ray photoelectron spectroscopy of the tin oxide in the coating layer is 1.6 eV or higher than a peak position of binding energy of the metal Sn.

A ceramic electronic component includes a body including dielectric layers and a plurality of internal electrodes disposed to face each other while having each of the dielectric layers interposed therebetween; and external electrodes including a connection portion disposed on end surfaces of the body opposing each other and band portions extending onto portions of upper and lower surfaces of the body from the connection portion, wherein the external electrodes include electrode layers connected to the plurality of internal electrodes, conductive resin layers disposed on the electrode layers, Ni plating layers disposed on the conductive resin layers, and Sn plating layers disposed on the Ni plating layers, and tc1 is 0.5 m or more and tc2/tc1 is 1.2 or less, in which a thickness of the Ni plating layer in the connection portion is tc1 and a thickness of the Ni plating layer in the band portion is tc2.

The present invention provides a wiring board having a conductor portion on which mounting is suitably possible and a method for manufacturing the wiring board. Since an initial Cu plated layer is formed by plating so as to cover the surface of a metallized layer and then the initial Cu plated layer is heated to be softened or melted, copper in the softened or melted initial Cu plated layer enters into open pore portions of the metallized layer. In addition, during the heating, components of the metallized layer and components of the initial Cu plated layer are mutually thermally diffused. Consequently, when solidified later (that is, when the initial Cu plated layer becomes a lower Cu plated layer), the adhesiveness between the metallized layer and the lower Cu plated layer is improved due to, for example, an anchoring effect and a mutual thermal diffusion effect, and therefore mountability is improved.

A surface-treated material of the present disclosure has a conductive substrate, and a surface treatment film which includes at least one layer of metal layers and is formed on the conductive substrate. The surface treatment film is a plating film. The surface treatment film is formed on a whole surface or a part of the conductive substrate through a zinc-containing layer that contains zinc as a main component and has a thickness of 50 nm or less, or is formed on the conductive substrate without through the zinc-containing layer. The surface-treated material has a ratio of a contact area to a test area of 85% or more as measured according to a tape test method defined in JIS H 8504: 1999.

The present invention is intended to provide a roll-bonded laminate, in which an ultrathin metal layer is laminated on another metal without generation of wrinkles, cracks and the like. A roll-bonded laminate formed by lamination of at least three layers, which comprises a peelable carrier layer 10, an ultrathin metal layer 20 and a metallic foil 30, wherein the thickness of the ultrathin metal layer 20 is 0.5 ?m or more and 20 ?m or less.

An electrical connector includes a first layer formed of a copper based material and a second layer formed of an iron-nickel alloy. The second layer has a thickness of 8% to 30% of the thickness of the electrical connector. The electrical connector also includes a third layer which is formed of a solder alloy that consists essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy that is tin.

In some examples, an article including a substrate and a multi-layered coating on at least a portion of the substrate. The multi-layered coating including at least one nano-crystalline layer comprising a metal or a metal alloy and a corrosion resistant layer on the at least one nano-crystalline layer. The nano-crystalline layer defining an average grain size of less than 50 nanometers (nm) and the corrosion resistant layer including at least one of nickel metal, tin metal, zinc metal, cadmium metal, chromium metal, nickel-phosphorus alloy, nickel-sulfur alloy, nickel-boron alloy, nickel-cadmium alloy, nickel-zinc alloy, and tin-zinc alloy.

A steel sheet for a container includes a steel sheet, a Sn coated layer which is provided as an upper layer of the steel sheet and contains Sn in an amount of 560 to 5600 mg/m.sup.2 in terms of Sn metal, and a chemical treatment layer which is provided as an upper layer of the Sn coated layer and contains a Zr compound in an amount of 3.0 to 30.0 mg/m.sup.2 in terms of Zr metal and a Mg compound in an amount of 0.50 to 5.00 mg/m.sup.2 in terms of Mg metal.

The present invention accurately distinguishes a soldering material less likely to oxidize. A Cu core ball has a Cu ball having a predetermined size, and a solder layer coating the Cu ball. The Cu ball provides a space between a semiconductor package and a printed circuit board. The Cu core ball has the soldering material having lightness greater than or equal to 62.5 in L*a*b* color space subsequent to a heating storage test performed for 72 hours in a temperature-controlled bath at 150 C. with a temperature of 25 C. and 40% humidity, and the soldering material, prior to the heating storage test, having lightness greater than or equal to 65 in the L*a*b* color space and yellowness less than or equal to 7.0 in the L*a*b* color space.