In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

This relates to a process for manufacturing a recovery annealed coated steel substrate for packaging applications and a packaging steel product produced thereby.

The invention relates to a zinc-free spray powder for thermally coating a substrate, in particular for thermally coating a bearing part of a bearing apparatus, which spray powder has the following composition except for unavoidable contaminants: tin=5% to 30% weight percent; aluminum=0.1% to 5% weight percent; iron=at most 1% weight percent, and copper=difference to 100% weight percent. The invention furthermore relates to a layer system applied via thermal spraying, a work piece, particularly a connecting rod, as well as a spray method for manufacturing a spray layer.

It is aimed to provide a plated member and a plated terminal for connector, to which a large current can be applied and which have both a low friction coefficient and high heat resistance, at low cost and provide a method for producing such a plated member and a method for producing such a plated terminal for connector. A silver-tin alloy layer for coating a surface of a base material made of copper or copper alloy and a silver coating layer for coating the silver-tin alloy layer and to be exposed on an outermost surface are simultaneously formed by heating to obtain a plated member after tin and silver plating layers are alternately laminated on the surface of the base material with the outermost surface formed by the silver plating layer.

A soldered product comprising a first component soldered to a second component is provided. The first component comprises a stainless steel substrate, an adhesion promoter layer made of nickel deposited on at least one joining surface of the stainless steel substrate; and a tin layer deposited on the adhesion promoter layer. The tin layer has a layer thickness in the range of 10-30 m. The second component is typically a rare earth magnet.

The invention relates to a method for producing packaging steel consisting of a cold-rolled steel sheet made of unalloyed or low-alloy steel having a carbon content of less than 0.1%. In order to provide high-strength packaging steel that has good formability and high corrosion resistance and can be produced in as energy-saving a manner as possible, the steel sheet according to the invention is first coated with a metallic coating and then annealed in a recrystallizing manner at a heating rate of more than 75 K/s and preferably more than 100 K/s to temperatures of more than 700 C., such that the metallic coating melts. The coated and annealed steel sheet is then quenched to normal temperature at a cooling rate of at least 100 K/s.

A steel sheet for containers that has excellent film adhesion qualities, and has; a chemical conversion coating formed by immersing or subjecting to electrolytic treatment a steel sheet in a solution containing Zr ions, F ions, with adhesion amount of 0.1 to 100 mg/m.sup.2 for metal Zr and no more than 0.1 mg/m.sup.2 for F; and a hydroxyl acid treatment layer formed on the chemical conversion coating, the layer having a C adhesion amount of 0.05 to 50 mg/m.sup.2.

A plated steel sheet (1) includes: a steel sheet (2); a pre-plating layer (3) on at least one surface of the steel sheet (2), the pre-plating layer (3) containing Al, Cu, In, Zn, Sn, or Sb, or any combination thereof; and a plating layer (4) of a ZnNi alloy on the pre-plating layer (3), a Ni content of the ZnNi alloy being 5 mass % to 15 mass %. A coating weight of the pre-plating layer (3) is 0.5 g/m.sup.2 or more, and a coating weight of the plating layer (4) is 5 g/m.sup.2 or more.

There are provided a metal material for electronic component which has low insertability/extractability, low whisker formability, and high durability, and a method for manufacturing the metal material. The metal material 10 for electronic components has a base material 11, an A layer 14 constituting a surface layer on the base material 11 and formed of Sn, In or an alloy thereof, and a B layer 13 constituting a middle layer provided between the base material 11 and the A layer 14 and formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, wherein the surface layer (A layer) 14 has a thickness of 0.002 to 0.2 m, and the middle layer (B layer) 13 has a thickness of 0.001 to 0.3 m.

A composite metal foil and a method of manufacturing the same are provided. The composite metal foil includes at least a first metal layer and a second metal layer. The first metal layer is copper foil, nickel foil, stainless steel foil, or a combination thereof. The second metal layer is disposed on a surface of the first metal layer. A contact angle of a surface of the second metal layer to liquid lithium metal is lower than 90 degrees.