Variations of this invention provide durable, impact-resistant structural coatings that have both dewetting and anti-icing properties. The coatings in some embodiments possess a self-similar structure that combines a low-cost matrix with two feature sizes that are tuned to affect the wetting of water and freezing of water on the surface. Dewetting and anti-icing performance is simultaneously achieved in a structural coating comprising multiple layers, wherein each layer includes (a) a continuous matrix; (b) discrete templates dispersed that promote surface roughness to inhibit wetting of water; and (c) nanoparticles that inhibit heterogeneous nucleation of water. These structural coatings utilize low-cost, lightweight, and environmentally benign materials that can be rapidly sprayed over large areas using convenient coating processes. The presence of multiple layers means that if the surface is damaged during use, freshly exposed surface will expose a coating identical to that which was removed, for extended lifetime.

A transparent conductive film includes a film base, a cured resin layer formed at one side of the film base, and an indium composite oxide layer laminated at a side of the cured resin layer opposite to the film base. The indium composite oxide layer has a thickness of 20 nm to 50 nm. The cured resin layer has a plurality of spherical particles and a binder resin layer which fixes the plurality of spherical particles to the film base. A difference wd between a mode particle size w and a thickness d of the binder resin layer is greater than zero and less than or equal to 1.2 m, where w is a mode particle size of the spherical particles and d is a thickness of the binder resin layer.

Disclosed herein is a method of manufacturing a bonded substrate, including the steps of: forming a first bonding layer on a surface on one side of a semiconductor substrate; forming a second bonding layer on a surface on one side of a support substrate; adhering the first bonding layer and the second bonding layer to each other; a heat treatment for bonding the first bonding layer and the second bonding layer to each other; and thinning the semiconductor substrate from a surface on the other side of the semiconductor substrate to form a semiconductor layer.

The present invention relates to a cycloolefin resin composition, a molded article of the cycloolefin resin composition, and an optical element, and in particular, to a resin composition containing inorganic particles in a resin, a molded article of the resin composition, and an optical element formed of the molded article.

Variations of this invention provide durable, impact-resistant structural coatings that have both dewetting and anti-icing properties. The coatings in some embodiments possess a self-similar structure that combines a low-cost matrix with two feature sizes that are tuned to affect the wetting of water and freezing of water on the surface. Dewetting and anti-icing performance is simultaneously achieved in a structural coating comprising multiple layers, wherein each layer includes (a) a continuous matrix; (b) discrete templates dispersed that promote surface roughness to inhibit wetting of water; and (c) nanoparticles that inhibit heterogeneous nucleation of water. These structural coatings utilize low-cost, lightweight, and environmentally benign materials that can be rapidly sprayed over large areas using convenient coating processes. The presence of multiple layers means that if the surface is damaged during use, freshly exposed surface will expose a coating identical to that which was removed, for extended lifetime.

A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains SiC particles containing SiC as a main component. A mass fraction of the SiC particles in a total mass of the metal body and the SiC particles is 2.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.