Provided is a decorative sheet that, due to an asperity profile, creates a highly textured impression, such as a contoured impression, three-dimensional impression, impression of depth, and the like, even after being molded, and that has exceptional surface flatness. This decorative sheet has a layer that includes at least a transparent resin film layer, the layer that includes at least the transparent resin film layer having on one surface thereof an asperity profile having recesses that reach the transparent resin film layer, and includes an area in which the depth (d) of the recesses of the asperity profile, and the thickness T from the start point of the depth (d) to the surface on the opposite side from the surface that has the asperity profile in the layer that includes the transparent resin film layer, satisfy the relationship (d)/T100=5-10, and is intended for use as a decorative resin molded article in which a molding resin is laminated to the surface having the asperity profile.

A bending area structure of a flexible display panel is disclosed and includes a flexible substrate layer, a circuit layer, and at least one organic layer. The circuit layer is disposed on the flexible substrate layer. The at least one organic layer is disposed on the circuit layer. A plurality of protrusions are arranged on an upper surface of the at least one organic layer.

A card includes a layer of deformable material embossed with a three dimensional (3-D) pattern. A first layer is in direct contact with and overlies the embossed deformable layer. A second layer is in direct contact with and underlies the embossed deformable layer. The first layer is of conformable material and extends within the embossed pattern for filling, setting and maintaining the embossed pattern in a fixed condition. The second layer is of conformable material and conforms to the embossed pattern set in the deformable layer.

A window for a display device that includes: a base substrate; a first coating layer disposed on a first surface of the base substrate; and a second coating layer disposed on a second surface that overlaps the first surface of the base substrate, wherein the base substrate further includes a vertical surface perpendicular to the first surface and the second surface, and the first coating layer overlaps the vertical surface. The impact resistance of the window is improved through the first coating layer covering the rear surface and the vertical surface of the base substrate.

Provided is an connection structure (1) with which the adhesive power between an adhesive agent layer (2) and a connector (3) can be increased, and which maintains high waterproof reliability over a long period of use. The connection structure (1) comprises an adhesive agent layer (2), and a connector (3) including an adhesive surface (30) in contact with a layer surface of the adhesive agent layer (2). The adhesive surface (30) includes a surface irregularity portion (31) having a recess (311) and a protrusion (312). A part of the adhesive agent layer (2) is disposed in the recess (311). The connection structure (1) may be configured to include a fibrous material (5) traversing the recess (311). The connector (3) may be configured from an engineering plastic.

The invention includes a method for forming a card with an embedded three dimensional (3-D) image and the resultant card formed by the method. The method includes forming a first assembly which includes a layer of deformable material and an overlying layer of pattern conforming material. An engraved laminating plate is applied to the deformable layer during an engraving and laminating step applied to the first sub-assembly under predetermined pressure and selected temperature conditions for embossing the deformable layer with a well defined and sharp pattern. Then, a second assembly including a pattern conforming layer is laminated with the first assembly to embed and secure the pattern between the two conformable layers.

A subject of present invention is to enable reducing, even in growth at a high C/Si ratio, contamination by different polytypes with respect to a silicon carbide epitaxial wafer having a low off-angle, and to provide the silicon carbide epitaxial wafer which enables forming a reliable high voltage silicon carbide semiconductor element. The silicon carbide epitaxial wafer of the present invention is a silicon carbide epitaxial wafer comprising an epitaxially grown layer disposed on a silicon carbide substrate having an -type crystal structure and an off-angle tilted at an angle of more than 0 and less than 4 from a (0001) Si plane or a (000-1) C plane, wherein a region of a step bunching including five to ten bunched steps of 1 nm in height occupies 90% or more of the surface of the silicon carbide substrate.

An apparatus includes a first thermoset layer that includes a first fibrous material embedded in a first thermoset matrix. The apparatus also includes a second thermoset layer that includes a second fibrous material embedded in a second thermoset matrix. The second thermoset layer is coupled to the first thermoset layer to form a joint. Further, a gap is defined between the first thermoset layer and the second thermoset layer. The apparatus also includes a thermoplastic filler that is made from a thermoplastic material. The thermoplastic filler is positioned within the gap.

The present invention is a laminate sheet having two laminae. The first lamina is a relatively hard material having first and second surfaces. The first surface has a plurality of raised and generally pointed piercing structures, each structure having a tip. The second lamina is graphite foil material, which is mated to the relatively hard material, such that at least some of the piercing structures pierce the graphite foil material. In one embodiment, the first lamina has no performations and is uniformly smooth. In another embodiment, the second surface also has a plurality of piercing structures and a third lamina comprising graphite foil is mated to the second surface.

A protective case for an electronic device includes an elastomeric cover having a single piece of elastomeric material that conforms to the electronic device when the electronic device is installed in the protective case. The cover includes a button actuator to transfer a force applied on an outside surface of the elastomeric cover to a control button of the electronic device inside the elastomeric cover and a front opening in the elastomeric cover that provides access to a touch screen interface of a front of the electronic device. The cover also includes a plurality of recesses formed in at least one interior side surface of the elastomeric cover. The plurality of recesses soften the elastomeric cover in the selected area by reducing an average density of the elastomeric cover in the selected area of the elastomeric cover.