An embodiment relates to a cladded composite comprising a cladding layer of a bulk metallic glass and a substrate; wherein the bulk metallic glass comprises approximately 0% crystallinity, approximately 0% porosity, less than 50 MPa thermal stress, approximately 0% distortion, approximately 0 inch heat affected zone, approximately 0% dilution, and a strength of about 2,000-3,500 MPa.

A Zn—Mg alloy plated steel material having excellent adhesion to plating and corrosion resistance comprises base steel and a plating layer formed on the surface of the base steel, wherein the plating layer comprises a Zn single phase, a Mg single phase, an MgZn.sub.2 alloy phase, and an Mg.sub.2Zn.sub.11 alloy phase, the Zn single phase is contained in the plating layer at a proportion of 15 to 19 volume %, and the proportion of the Zn single phase in a lower t/2 area of the plating layer adjacent to the base steel may be greater than the proportion of the Zn single phase in an upper t/2 area of the plating layer on the surface layer side of the plating layer. (Here, t means the thickness (μm) of the plating layer).

A glass sealing system includes a glass portion and a first adhesive layer disposed along an exterior surface of the glass portion. The glass sealing system also includes a cover with a first surface secured to the first adhesive layer and a second surface opposing the first surface. The glass sealing system includes a second adhesive layer disposed on the second surface and configured to secure the cover to a support structure. The cover obscures the second adhesive layer from view of a user looking through the glass portion toward the support structure.

A steel sheet includes a hot-dip galvanized layer or a galvannealed layer on a surface of the steel sheet, the steel sheet including: in mass %, C: 0.06% or more and 0.22% or less; Si: 0.50% or more and 2.00% or less; Mn: 1.50% or more and 2.80% or less; Al: 0.02% or more and 1.00% or less; P: 0.001% or more and 0.100% or less; S: 0.0005% or more and 0.0100% or less; N: 0.0005% or more and 0.0100% or less; and a balance: Fe and impurities.

Provided is a low-density clad steel sheet having excellent formability and fatigue properties, including a base material; and cladding materials provided on both side surfaces of the base material, wherein the base material is a lightweight steel sheet including, by weight, C: 0.3 to 1.0%, Mn: 4.0 to 16.0%, Al: 4.5 to 9.0%, and a remainder of Fe and inevitable impurities, and each of the cladding materials is martensitic carbon steel including, by weight, C: 0.1 to 0.45%, Mn: 1.0 to 3.0%, and a remainder of Fe and inevitable impurities.

To provide a copper-clad laminate which maintains adhesion between a resin film and a conductor layer and which suppresses the occurrence of wrinkles. A copper-clad laminate has a base film containing a thermoplastic resin, an underlying metal layer film-formed on a surface of the base film by a dry plating method, and a copper layer film-formed on a surface of the underlying metal layer. The underlying metal layer has a mean thickness of 0.3 to 1.9 nm. Since the underlying metal layer has a mean thickness of 0.3 nm or more, it is possible to maintain adhesion between the base film and a conductor layer. Since the underlying metal layer has a mean thickness of 1.9 nm or less, it is possible to suppress an increase in the temperature of a film during film-forming of the underlying metal layer, and it is possible to suppress the occurrence of wrinkles.

A pressure-sensitive adhesive tape X of the present invention is a pressure-sensitive adhesive tape for a wire harness, for bundling or fixing a wire harness, and includes a substrate 10, and a pressure-sensitive adhesive layer 20 disposed at one side in a thickness direction of the substrate 10. The substrate 10 has a thickness of 85 μm or less. The pressure-sensitive adhesive layer 20 has a thickness of 55 μm or more.

Provided is a masking pressure-sensitive adhesive tape to be used in formation of a metal layer by a vacuum film formation method on part of a surface of an electronic part, which may prevent formation of a metal layer, by the vacuum film formation method, on a surface masked by the masking pressure-sensitive adhesive tape. The masking pressure-sensitive adhesive tape includes: a base material; and a pressure-sensitive adhesive layer arranged on one side of the base material, in which the pressure-sensitive adhesive layer has a thickness of 5 m or more, and the masking pressure-sensitive adhesive tape has a 180 peeling adhesive strength at 23 C. with respect to a stainless-steel plate of 0.4 N/20 mm or more.

Provided is a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance Therefore, the multi-layered anisotropic conductive adhesive has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. Also provided is a method of producing the multi-layered anisotropic conductive adhesive.

A steel sheet includes a hot-dip galvanized layer or a galvannealed layer on a surface of the steel sheet, the steel sheet including: in mass %, C: 0.06% or more and 0.22% or less; Si: 0.50% or more and 2.00% or less; Mn: 1.50% or more and 2.80% or less; Al: 0.02% or more and 1.00% or less; P: 0.001% or more and 0.100% or less; S: 0.0005% or more and 0.0100% or less; N: 0.0005% or more and 0.0100% or less; and a balance: Fe and impurities.