Packaging and a method of making the packaging is disclosed. The packaging includes a substrate with an asymmetrical coextrusion attached there to. The coextrusion includes an ethylene vinyl alcohol layer that is disposed toward the substrate.

The present subject matter provides an adhesive article having a release agent or liner that is free of silicon-containing and fluorine-containing material, and related methods of adhering a backing material of the adhesive article to a substrate. The adhesive article utilizes an amorphous polyvinyl alcohol layer that facilitates removal of an optional release liner from an adhesive layer. Upon removal of the release liner, the amorphous polyvinyl alcohol layer remains disposed on the adhesive layer. A method of adhering the backing material to a substrate includes dissolving the amorphous polyvinyl alcohol layer and disposing the backing material to a substrate. During dissolution of the amorphous polyvinyl alcohol layer, a weak, temporary bond is formed between the substrate and the backing material. When the amorphous polyvinyl alcohol layer substantially dissolves and dries, the adhesive layer is exposed and forms a permanent bond with the substrate.

Protection barriers, such as floor protection barriers, and methods for making and using same. The protection barrier can include a base sheet and an energy absorbing layer. The base sheet can have two or more paperboard layers and one or more sizing layers. A first paperboard layer can form a first surface of the base sheet, a second paperboard layer can form a second surface of the base sheet, and the one or more sizing layers can be disposed between the first and second paperboard layers. The energy absorbing layer can be secured to the second paperboard layer.

The present subject matter provides a shrink film free of silicon-containing material, fluorine-containing material, and solvent-formed seams. The shrink film utilizes a water soluble layer covering an adhesive layer. The water soluble layer is in dry form and non-tacky, allowing processing of the shrink film subsequent to adhesive application to the shrink film. When the water soluble layer is dissolved, the adhesive layer is exposed and is capable of forming a permanent bond. The adhesive can be used to form a seam in the film and/or can be used to form a bond between the film and a substrate. The water soluble layer facilitates removal of an optional release liner from the adhesive. A substrate with the shrink film attached thereto and a related method of attaching a heat shrinkable film to a substrate are also disclosed.

The present subject matter provides a shrink film free of silicon-containing material, fluorine-containing material, and solvent-formed seams. The shrink film utilizes a water soluble layer covering an adhesive layer. The water soluble layer is in dry form and non-tacky, allowing processing of the shrink film subsequent to adhesive application to the shrink film. When the water soluble layer is dissolved, the adhesive layer is exposed and is capable of forming a permanent bond. The adhesive can be used to form a seam in the film and/or can be used to form a bond between the film and a substrate. The water soluble layer facilitates removal of an optional release liner from the adhesive. A substrate with the shrink film attached thereto and a related method of attaching a heat shrinkable film to a substrate are also disclosed.

Two-component adhesion composition suitable for extrusion coating paper substrates which comprises: a) from 70 to 98 wt % of high melt strength polypropylene (A) with a branching index g of 0.9 or less; and b) from 2 to 30 wt % of a component (B) selected from the group consisting of: (i) maleic anhydride-modified polypropylene (MAPP); (ii) maleic anhydride-modified polypropylene wax; (iii) polypropylene homopolymer with high melt flow rate; or (iv) ethylene-vinyl acetate-based hot melt adhesive,
and its use.

A vacuum skin packaging film produced by the hot blown film method and comprising a polyester having a melting point of more than 200C.