Disclosed is a bonding structure that includes an intermetallic compound crystal composed of Sn and Cu, and, an Sn alloy matrix composed of Sn and Cu, being intended for bonding a metal body or an alloy body, the intermetallic compound crystal forming an endotaxial junction with the Sn alloy matrix, and the Sn alloy matrix and/or the intermetallic compound crystal forming an epitaxial junction with the metal body or the alloy body.

A heat dissipation component for a semiconductor element includes: a composite part containing 50-80 vol % diamond powder with the remainder having metal including aluminum, the diamond powder having a particle diameter volume distribution first peak at 5-25 μm and a second peak at 55-195 μm. A ratio between a volume distribution area at particle diameters of 1-35 μm and a volume distribution area at particle diameters of 45-205 μm is 1:9 to 4:6; surface layers on both composite part principal surfaces, each of the surface layers containing 80 vol % or more metal including aluminum and having a film thickness of 0.03-0.2 mm; and a crystalline Ni layer and an Au layer on at least one of the surface layers, the crystalline Ni layer having a film thickness of 0.5-6.5 μm, and the Au layer having a film thickness of 0.05 μm or larger.

Methods for forming particulates that are highly consistent with regard to shape, size, and content are described. Particulates are suitable for use as reference materials. Methods can incorporate actinides and/or lanthanides, e.g., uranium, and can be used for forming certified reference materials for use in the nuclear industry. Methods include formation of an aerosol from an oxalate salt solution, in-line diagnostics, and collection of particles of the aerosol either in a liquid impinger or on a solid surface.

A joined body of a joining base material and a metal layer which, when the metal layer is joined to the base material, adhesion of the metal layer is high, variation in adhesion is small, and the joining can be performed inexpensively. The metal layer is joined to the joining base material via an intermediate layer coating formed on a joint surface of the base material. The intermediate layer coating is fused to the joint surface of the base material, and an anchor forming material that joins the metal layer by an anchor effect is dispersed and embedded in the intermediate layer coating; the anchor forming material partially protrudes outward from the intermediate layer coating, and is fused to the intermediate layer coating; and the metal layer is joined to a surface of the intermediate layer coating and a surface of the anchor forming material protruding outward from the intermediate layer coating.

A silver film for die attachment in the field of microelectronics, wherein the silver film is a multilayer structure comprising a reinforcing silver foil layer between two layers of sinterable particles. Each layer of sinterable particles comprises a mixture of sinterable silver particles and reinforcing particles. The reinforcing particles comprise glass and/or carbon and/or graphite particles. A method for die attachment using a silver film.

Described are porous sintered metal bodies, methods of making and using the porous sintered metal bodies, and methods of using the porous sintered metal bodies for commercial applications that include filtering a fluid, including in applications requiring high efficiency (high LRV) filtration.

Embodiments of the invention relate to polycrystalline diamond compacts (“PDCs”) and methods of fabricating polycrystalline diamond tables and PDCs in a manner that facilitates removal of metal-solvent catalyst used in the manufacture of polycrystalline diamond tables of such PDCs.

A ceramic structure includes a ceramic base member having a main face; a hole extending from the main face into the ceramic base member; a metal electrode layer embedded in the ceramic base member; a conductive member embedded in the ceramic base member so as to be electrically connected to the metal electrode layer and form a bottom of the hole; a first metal member joined to the conductive member by a brazing material and having an average linear expansion coefficient not less than the average linear expansion coefficient of the conductive member; one or a plurality of second metal members having a greater average linear expansion coefficient than the first metal member; and a metal terminal joined to the one or the plurality of second metal members and having a greater average linear expansion coefficient than each second metal member.

The invention is a metallic coating comprising a first metal, a second metal, phosphorus, and carbon nanoparticles, wherein the carbon is in the form of graphene. In one example, the carbon nanoparticles are selected from a group consisting of graphene nanoplatelets, graphene oxide, and carbon nanotubes. The first metal may preferably be nickel and the second metal may preferably be a refractory metal. The refractory metal may be selected from a group consisting of tungsten, rhenium, molybdenum, niobium, tantalum, and mixtures thereof, and may preferably be tungsten. The metallic coating may include crystallites having a columnar structure. Crystallites comprising the columnar structure precipitate to form grain structures that improve the mechanical strength of the coating through heat treatment.

Described are porous sintered metal bodies, methods of making and using the porous sintered metal bodies, and methods of using the porous sintered metal bodies for commercial applications that include filtering a fluid, including in applications requiring high efficiency (high LRV) filtration.