An aluminum-diamond composite that exhibits both high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, and that can suppress the occurrence of swelling, etc., of a surface metal layer portion even in actual use under a high load. An aluminum-diamond composite includes 65-80 vol % of a diamond powder having a roundness of at least 0.94, for which a first peak in a volumetric distribution of grain size lies at 5-25 m, and a second peak lies at 55-195 m, and a ratio between the area of the volumetric distribution of grain sizes of 1-35 m and the area of the volumetric distribution of grain sizes of 45-205 m is from 1:9 to 4:6; the balance being composed of a metal containing aluminum.

A multilayer, wear- and corrosion-resistant coating on a metal substrate comprising a first metal coating layer comprising a composite carbide material; a second metal coating layer over the first metal coating layer comprising at least about 50 wt % of a metal selected from the group consisting of Co, Ni, and Fe; and a surface metal coating layer comprising a cemented carbide material having a third-layer carbide material and a third-layer Co-based or Ni-based binder material.

A hybrid transparent conductive film, and methods for fabricating such hybrid transparent conductive films, involving the assembly of two-dimensional graphene-based materials with one-dimensional silver and/or copper nanowires with high optical transmittance and good electrical conductivity. The hybrid films are characterized by a good degree of control of the architecture at the nanoscale level, where the weakness(es) of each component are offset by the strengths of the other components. By rational design of the structure and using simple and locate-cost fabrication methods, hybrid films with sheet resistance of 26 ohm/sq and optical transmittance (at =550 nm) of 83% for reduced graphene oxide/silver nanowire films, and 64 ohm/sq and optical transmittance of 93.6% for monolayer graphene/silver nanowire films have been fabricated. These values are comparable to transparent conductive films based on indium tin oxide but are now able to be used in flexible electronics due to their good mechanical properties.

A cutting tool includes a cemented carbide substrate. The cemented carbide consists of hard constituents in a metallic binder. The hard constituents include WC. The WC content in the cemented carbide is 80-93 wt %. The cemented carbide has Ni and Al, and a Ni content of 3-13 wt %, a weight ratio of Co/Ni<0.33, a weight ratio of Fe/Ni<0.25, a weight ratio of Cr/Ni<0.25 and a weight ratio of 0.02<Al/(Ni+Co+Fe)<0.1. The crack resistance W is defined as the ratio of the load applied on a Vickers hardness indentation and the total crack length of the cracks formed at the corners of the Vickers hardness indentation. The product of the hardness H(rake) at the rake face and the crack resistance W(rake) at the rake face is H(rake)*W(rake)>5000 HV100*N/m.

The use of Atomic Layer Deposition (ALD) and Molecular Layer Deposition (MLD) applied to powders and intermediates of the MLCC fabrication process can provide significant advantages. Coating metal particles within a defined range of ALD cycles is shown to provide enhanced oxidation resistance. Surprisingly, a very thin ALD layer was found to substantially increase sintering temperature.