This relates to a process for manufacturing a recovery annealed coated steel substrate for packaging applications and a packaging steel product produced thereby.

A metal conducting structure includes a first metal conducting layer, a second metal conducting layer, and a third metal conducting layer. The first metal conducting layer consists of a first polymer material and first metal particles. The first metal conducting layer is covered by the second metal conducting layer which is a structure with pores, the structure consists of second metal particles. The second metal conducting layer is covered by the third metal conducting layer. The pores of the second metal conducting layer are filled with a metal material of the third metal conducting layer.

[Object] To provide a hot-dip zinc-based plated steel sheet which suppresses excessive production of zinc oxides on an outer layer after hot pressing more conveniently and is excellent in corrosion resistance at an uncoated portion.

[Solution] A hot-dip zinc-based plated steel sheet according to the present invention includes: a base steel sheet that is a metal substrate; a hot-dip zinc-based plating layer provided on the base steel sheet; and a surface treatment layer formed on at least one surface of the hot-dip zinc-based plating layer, in which the surface treatment layer contains more than or equal to 0.1 g/m.sup.2 and less than or equal to 1.2 g/m.sup.2 of granular oxide per one surface on a metal basis in which, in a temperature range of 900 to 1300 K, standard free energy of formation (G.sup.0) of oxide is smaller than standard free energy of formation (G.sup.0.sub.Zn) of zinc oxide and larger than standard free energy of formation (G.sup.0.sub.Al) of aluminum oxide at an identical temperature, and the granular oxide has a particle size of more than or equal to 3 nm and less than or equal to 100 nm.

The present invention relates to light weight composite materials which comprise a metallic layer and a polymeric layer, the polymeric layer containing a filled thermoplastic polymer which includes a thermoplastic polymer and a metallic fiber. The composite materials of the present invention may be formed using conventional stamping equipment at ambient temperatures. Composite materials of the present invention may also be capable of being welded to other metal materials using a resistance welding process such as resistance spot welding.

The invention concerns a substrate with an electron donating surface with metal particles on the surface. The particles comprise palladium and at least one metal selected from the group consisting of gold, ruthenium, rhodium, osmium, iridium, and platinum. The amount of said metal particles is from about 0.001 to about 8 g/cm.sup.2. Examples of coated objects include contact lenses, pacemakers, pacemaker electrodes, stents, dental implants, rupture nets, rupture mesh, blood centrifuge equipment, surgical instruments, gloves, blood bags, artificial heart valves, central venous catheters, peripheral venous catheters, vascular ports, haemodialysis equipment, peritoneal dialysis equipment, plasmapheresis devices, inhalation drug delivery devices, vascular grafts, arterial grafts, cardiac assist devices, wound dressings, intermittent catheters, ECG electrodes, peripheral stents, bone replacing implants, orthopedic implants, orthopedic devices, tissue replacing implants, intraocular lenses, sutures, needles, drug delivery devices, endotracheal tubes, shunts, drains, suction devices, hearing aid devices, urethral medical devices, and artificial blood vessels.

Described herein are methods of preparing nanolaminated brass coatings and components having desirable and useful properties. Also described are nanolaminated brass components and plastic and polymeric substrates coated with nanolaminated brass coatings having desirable and useful properties.

A black-plated steel sheet has a Zn-plating layer containing molten Al and Mg, containing Al in the amount of 1.0-22.0 mass %, containing Mg in the amount of 1.3-10.0 mass %, and having a Zn black oxide distributed in a lamella pattern in the plating layer. The Zn black oxide is a Zn oxide derived from a Zn.sub.2Mg phase. The brightness of the surface of the Zn-plating layer containing the molten Al and Mg has an L* value of 60 or less.

A part assembly (100), comprising: an aluminium part (101); a magnesium part (102), the magnesium part (102) coated in a first coating (104); a bond (103), the bond (103) securing the aluminium part (101) to the coated magnesium part (114); wherein the aluminium part (101), the coated magnesium part (114) and the bond (103) are subjected to an electrophoresis coating process to coat the aluminium part (101) in a second coating (105). By subjecting the aluminium part (101), the coated magnesium part (114) and the bond (103) to an electrophoresis coating process to coat the aluminium part (101) in a second coating (105) this may provide a simpler manufacturing process.

A surface treatment composition for a galvanized steel sheet containing, based on 100 parts by weight of the total solution, 3.0 to 25.0 parts by weight of a silane compound, 0.5 to 5.0 parts by weight of a molybdenum compound, 0.5 to 5.0 parts by weight of a vanadium compound, 0.1 to 3.0 parts by weight of a nickel compound, 0.05 to 1.0 parts by weight of a copper compound, and a remainder of solvent, a surface treatment method for a galvanized steel sheet using the surface treatment composition, and a surface-treated galvanized steel sheet, are provided. Corrosion resistance, blackening resistance, warm water resistance, and conductivity are secured free from concerns regarding the installation of additional equipment for treating chromium, increased manufacturing costs, and environmental pollution.

Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length is 0.2 to 1.0 m, and the ratio L1/D1 of the particle length L1 to the average diameter D1 at the particle bottom is 15 or less. In the copper foil for printed wiring board, when a copper foil for printed wiring having a roughened layer is laminated to a resin and then the copper layer is removed by etching, the sum of areas of holes accounting for the resin roughened surface having unevenness is 20% or more. The present invention involves the development of a copper foil for a semiconductor package substrate that can avoid circuit erosion without causing deterioration in other properties of the copper foil. In particular, an object of the present invention is to provide a copper foil for a printed wiring board and a method of producing the copper foil, in which the adhesion strength between the copper foil and the resin can be enhanced by improvement of the roughened layer of the copper foil.