A steel sheet for containers that has excellent film adhesion qualities, and has; a chemical conversion coating formed by immersing or subjecting to electrolytic treatment a steel sheet in a solution containing Zr ions, F ions, with adhesion amount of 0.1 to 100 mg/m.sup.2 for metal Zr and no more than 0.1 mg/m.sup.2 for F; and a hydroxyl acid treatment layer formed on the chemical conversion coating, the layer having a C adhesion amount of 0.05 to 50 mg/m.sup.2.

Disclosed are coating compositions, such as primer compositions, suitable for providing corrosion protection to metal substrates, as well as related coated articles and methods.

A black plated resin part includes a resin base material, an underlying plating layer including a copper plating layer and a nickel plating layer formed in this order on the resin base material, a black chromium plating layer formed on the nickel plating layer, formed of trivalent chromium, and having a film thickness of not less than 015 m, and a corrosion resistant film formed on the black chromium plating layer, formed of chromic phosphate or molybdenum phosphate, and having a film thickness of not less than 7 nm. A brightness of the black chromium plating layer seen through the corrosion resistant film is expressed by an L* value of not more than 54 based on the L*a*b* color system.

A resin-coated copper foil includes: a copper foil layer including a first surface and a second surface, wherein a laser absorptance of the first surface of the copper foil layer is greater than a laser absorptance of the second surface of the copper foil layer, and wherein ribs are formed on the second surface of the copper foil layer; a carrier film disposed on the first surface of the copper foil layer; a primer resin layer disposed on the second surface of the copper foil layer; and a build-up resin layer disposed on the primer resin layer.

An alloy member includes a substrate formed of an alloy containing Mg and Li, a first layer which is disposed on the substrate and contains an inorganic fluoride, and a second layer which is disposed on the first layer and includes a cured product of a resin, the substrate, the first layer, and the second layer being stacked together, in which a surface of the first layer on the side opposite the substrate has an irregular structure.

Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length is 0.2 to 1.0 m, and the ratio L1/D1 of the particle length L1 to the average diameter D1 at the particle bottom is 15 or less. In the copper foil for printed wiring board, when a copper foil for printed wiring having a roughened layer is laminated to a resin and then the copper layer is removed by etching, the sum of areas of holes accounting for the resin roughened surface having unevenness is 20% or more. The present invention involves the development of a copper foil for a semiconductor package substrate that can avoid circuit erosion without causing deterioration in other properties of the copper foil. In particular, an object of the present invention is to provide a copper foil for a printed wiring board and a method of producing the copper foil, in which the adhesion strength between the copper foil and the resin can be enhanced by improvement of the roughened layer of the copper foil.

An electromagnetic wave shielding thin film for shielding from electromagnetic waves generated in an electronic part is provided. The electromagnetic wave shielding thin film includes metal plate which has elastic limit of 1% or more, strength of 1000 MPa or more, and a volume fraction of an amorphous phase of 50% or more.

A part assembly (100), comprising: an aluminium part (101); a magnesium part (102), the magnesium part (102) coated in a first coating (104); a bond (103), the bond (103) securing the aluminium part (101) to the coated magnesium part (114); wherein the aluminium part (101), the coated magnesium part (114) and the bond (103) are subjected to an electrophoresis coating process to coat the aluminium part (101) in a second coating (105). By subjecting the aluminium part (101), the coated magnesium part (114) and the bond (103) to an electrophoresis coating process to coat the aluminium part (101) in a second coating (105) this may provide a simpler manufacturing process.

An alloy ribbon that is an alloy ribbon containing a metal as a main component, and has a recess on at least one principal surface, in which a depth of the recess is 5% or more and 75% or less of an average thickness.

Provided is a thixomolding material including a metal body that contains Mg as a main component, and a coating portion that is adhered to a surface of the metal body via a binder and contains C particles containing C as a main component. A mass fraction of the C particles in a total mass of the metal body and the C particles is 5.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. The C particles may be graphite particles.