Y10T428/12618

Component and semiconductor manufacturing device

A component includes a film containing polycrystalline yttrium oxide. In an X-ray diffraction pattern of the film, a ratio I.sub.m/I.sub.c of a maximum intensity I.sub.m of a peak attributed to monoclinic yttrium oxide to a maximum intensity I.sub.c of a peak attributed to cubic yttrium oxide satisfies an expression: 0≤I.sub.m/I.sub.c≤0.002.

Alloy, protective layer and component

Known protective layers having a high Cr content and additionally a silicon form brittle phases which additionally become brittle under the influence of carbon during use. The protective layer hereof has a composition 22% to 24% cobalt (Co), 10.5% to 11.5% aluminum (AI), 0.2% to 0.4% yttrium (Y) and/or at least one equivalent metal from the group comprising scandium and the rare earth elements, 14% to 16% chrome (Cr), optionally 0.3% to 0.9% tantalum, the remainder nickel (Ni).

Alloy, protective layer and component

Known protective layers having a high Cr-content and a silicone in addition, form brittle phases that embrittle further under the influence of carbon during use. The protective layer according to the invention is composed of 22% to 26% cobalt (Co), 10.5% to 12% aluminum (Al), 0.2% to 0.4% Yttrium (Y) and/or at least one equivalent metal from the group comprising Scandium and the rare earth elements, 15% to 16% chrome (Cr), optionally 0.3% to 1.5% tantal, the remainder nickel (Ni).

Substrate for flexible device and method for producing the same

A substrate for flexible device. The substrate has a nickel-plated metal sheet having a nickel-plating layer formed on at least one surface of a metal sheet or a nickel-based sheet, and a glass layer of an electrically-insulating layered bismuth-based glass on a surface of the nickel-plating layer or the nickel-based sheet. An oxide layer having a roughened surface is formed on the surface of the nickel-plating layer or the surface of the nickel-based sheet, and the bismuth-based glass contains 70 to 84% by weight of Bi.sub.2O.sub.3, 10 to 12% by weight of ZnO, and 6 to 12% by weight of B.sub.2O.sub.3. Also disclosed is a method for producing the substrate for flexible device, a substrate for an organic EL device, a sheet used as a substrate for flexible device, a method for producing the sheet and a bismuth-based lead-free glass composition.

ENVIRONMENTAL BARRIER COATING WITH OXYGEN-SCAVENGING PARTICLES HAVING BARRIER SHELL
20210172328 · 2021-06-10 ·

A gas turbine engine article includes a substrate and an environmental barrier coating disposed on the substrate. The environmental barrier coating includes oxygen-scavenging particles. Each oxygen-scavenging particle includes a silicon-containing core particle encased in an oxygen barrier shell.

HOT-DIP Sn-Zn-BASED ALLOY-PLATED STEEL SHEET AND METHOD OF MANUFACTURING THE SAME

A hot-dip Sn—Zn-based alloy-plated steel sheet according to an aspect of the present invention includes: a steel sheet having a predetermined chemical composition; a diffusion alloy layer provided on one surface or both surfaces of the steel sheet; and a Sn—Zn-plated layer provided on the diffusion alloy layer, in which the diffusion alloy layer contains Fe, Sn, Zn, Cr, and Ni, an area ratio of a Sn—Fe—Cr—Zn phase to a Sn—Fe—Ni—Zn phase in the diffusion alloy layer is 0.01 or more and less than 2.5, the diffusion alloy layer has a coverage of 98% or more with respect to the one surface, the Sn—Zn-plated layer contains 1% to 20% of Zn by mass % and a remainder consisting of Sn and impurities, and an adhesion amount of the Sn—Zn-plated layer is 10 to 80 g/m.sup.2 per one surface.

Hot-dip zinc-based plated steel sheet

A hot-dip zinc-based plated steel sheet includes: a base steel sheet that is a metal substrate; a hot-dip zinc-based plating layer provided on the base steel sheet; and a surface treatment layer formed on at least one surface of the hot-dip zinc-based plating layer, in which the surface treatment layer contains more than or equal to 0.1 g/m.sup.2 and less than or equal to 1.2 g/m.sup.2 of granular oxide per one surface on a metal basis in which, in a temperature range of 900 to 1300 K, standard free energy of formation (ΔG.sup.0) of oxide is smaller than standard free energy of formation (ΔG.sup.0.sub.Zn) of zinc oxide and larger than standard free energy of formation (ΔG.sup.0.sub.Al) of aluminum oxide at an identical temperature, and the granular oxide has a particle size of more than or equal to 3 nm and less than or equal to 100 nm.

COMPOSITE PANEL COMPRISING A PERFORATED METALLIC FOIL FOR LIGHTNING STRIKE PROTECTION AND A PERFORATED METALLIC FOIL

A composite panel having a plurality of carbon plies, a perforated metallic foil comprising several apertures and being secured to the plurality of carbon plies, and a protective layer made from resin secured to the metallic foil. The perforated metallic foil is embedded in the protective layer through its apertures. A free surface of the protective layer forms a top side of the composite panel. The thickness of the protective layer between the top side of the composite panel and the perforated metallic foil is at least 15 micrometers and the perforated metallic foil has a thickness of not more than 30 micrometers. The plurality of apertures in the aggregate defines an open area of not more than 40% of the surface area and a maximum distance between two opposed points in a perimeter of an aperture is equal to or less than 3 mm

HOT-STAMPED BODY

There is provided a hot-stamped body including: a steel base metal; and a metallic layer formed on a surface of the steel base metal, wherein the metallic layer includes: an interface layer that contains, in mass %, Al: 30.0 to 36.0%, has a thickness of 100 nm to 15 m, and is located in an interface between the metallic layer and the steel base metal; and a principal layer that includes coexisting Zn phases and insular FeAl.sub.2 phases, is located on the interface layer, and has a thickness of 1 m to 40 m. This hot-stamped body is excellent in fatigue properties, corrosion resistance, and chipping resistance.

COPPER FOIL WITH CARRIER

An extremely thin copper foil with a carrier is provided that can keep stable releasability even after being heated for a prolonged time at a high temperature of 350 C. or more. The extremely thin copper foil with a carrier includes a carrier composed of a glass or ceramic material; an intermediate layer provided on the carrier and composed of at least one metal selected from the group consisting of Cu, Ti, Al, Nb, Zr, Cr, W, Ta, Co, Ag, Ni, In, Sn, Zn, Ga, and Mo; a release layer provided on the intermediate layer and including a carbon sublayer and a metal oxide sublayer or containing metal oxide and carbon; and an extremely thin copper layer provided on the release layer.