Hot-stamped steel includes: a base metal that is steel including a tempered portion having hardness corresponding to 85% or less of the highest quenching hardness, the highest quenching hardness being defined as a Vickers hardness at a depth position spaced away from a surface by times a sheet thickness in a case of performing water quenching after heating at a temperature equal to or higher than an A.sub.c3 point and retention for 30 minutes; and a Zn coating layer that is formed on the tempered portion of the base metal. The Zn coating layer includes a solid-solution layer including a solid-solution phase that contains Fe and Zn that is solid-soluted in Fe, and a lamella layer that includes the solid-solution phase and a capital gamma phase. An area ratio of the lamella layer in the Zn coating layer is 20% or less.

Provided is a technique in which a reduction annealing method is used to efficiently produce a high-strength hot-dip galvanizing substrate or high-strength hot-dip galvannealing substrate, which is useful as a raw material for producing a high-strength plated steel sheet suppressed in the occurrence of bare spot. The substrate for hot-dip galvanizing or hot-dip galvannealing of the present invention satisfies the following condition: when the mapping intensity of Fe, which is obtained by using an electron probe microanalyser in a measurement field of view of 33.6 m 41.4 M on the surface after reduction annealing, of 0 to 240 is divided into 16 parts at an interval of 15, the area occupied by a mapping intensity of 195 or more has 70% or more.

Substrate provided with a plurality of layers, at least one of which includes metal oxides and is topped directly by a metal coating layer that contains at least 8% by weight nickel and at least 10% by weight chromium, the remainder being iron, additional elements and the impurities resulting from the fabrication process, wherein this metal coating layer is topped directly by an anticorrosion coating layer. A corresponding fabrication method is also provided.

A method for depositing nickel-metal layers for colouring surfaces, and a bath for depositing such a layer. This is made possible by depositing a nickel-metal layer from a bath for the electroless deposition of nickel which contains at least one further metal compound, a voltage being additionally applied enable the metal of the metal compound to be incorporated while forming a nickel-metal layer.

The present invention relates generally to jewelry articles comprising a substrate and a metallic, external coating.

Disclosed herein is a high-strength galvannealed steel sheet having a galvannealed layer on a surface of a base steel sheet and containing predetermined steel components. The steel sheet sequentially has, from the interface of the base steel sheet and the galvannealed layer, towards the base steel sheet: an internal oxide layer and containing at least one oxide selected from the group consisting of Si and Mn; a soft layer including the internal oxide layer, and satisfying a predetermined Vickers hardness; and a hard layer made up of a structure mainly composed of martensite. The average depth D of the soft layer is 20 m or greater, and the average depth d of the internal oxide layer is 4 m or greater and smaller than D. A coefficient of variation of KAM of the base steel sheet at the portion t/4 is 0.66 or less.

A metal sheet including a substrate having at least one face coated by a metallic coating is provided. The metallic coating has an aluminum content by weight t.sub.Al of between 3.6 and 3.8% a magnesium content by weight t.sub.Mg of between 2.7 and 3.3%. The coating has a microstructure comprising a lamellar matrix of eutectic ternary Zn/Al/MgZn.sub.2 and possibly: dendrites of Zn with an accumulated surface content exceeding 5.0%, flowers of binary eutectic of Zn/MgZn.sub.2 with an accumulated surface content less than or equal to 15.0%, dendrites of binary eutectic Zn/Al surface with an accumulated surface content of less than 1.0% islets of MgZn.sub.2 with an accumulated surface content below 1.0%.

A method for producing a hot-pressed member includes heating a coated steel sheet, which includes, on a surface thereof, a ZnNi alloy coating layer containing 10% by mass or more and less than 13% by mass of Ni at a coating weight of over 50 g/m.sup.2 per side of the steel sheet, in a temperature region of an Ac.sub.3 transformation point to 1200 C. at an average heating rate of 12 C./second or more, and then hot-pressing the steel sheet.

A resin-coated copper foil includes: a copper foil layer including a first surface and a second surface, wherein a laser absorptance of the first surface of the copper foil layer is greater than a laser absorptance of the second surface of the copper foil layer, and wherein ribs are formed on the second surface of the copper foil layer; a carrier film disposed on the first surface of the copper foil layer; a primer resin layer disposed on the second surface of the copper foil layer; and a build-up resin layer disposed on the primer resin layer.

Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length is 0.2 to 1.0 m, and the ratio L1/D1 of the particle length L1 to the average diameter D1 at the particle bottom is 15 or less. In the copper foil for printed wiring board, when a copper foil for printed wiring having a roughened layer is laminated to a resin and then the copper layer is removed by etching, the sum of areas of holes accounting for the resin roughened surface having unevenness is 20% or more. The present invention involves the development of a copper foil for a semiconductor package substrate that can avoid circuit erosion without causing deterioration in other properties of the copper foil. In particular, an object of the present invention is to provide a copper foil for a printed wiring board and a method of producing the copper foil, in which the adhesion strength between the copper foil and the resin can be enhanced by improvement of the roughened layer of the copper foil.