Provided is a titanium cast product made of commercially pure titanium, the titanium cast product being produced by electron-beam remelting or plasma arc melting, comprising: a melted and resolidified layer in a range of 1 mm or more in depth at a surface serving as a surface to be rolled, the melted and resolidified layer being obtained by adding one or more kinds of stabilizer elements to the surface and melting and resolidifying the surface. An average value of stabilizer element(s) concentration in a range of within 1 mm in depth is higher than stabilizer element(s) concentration in a base material by, in mass %, equal to or more than 0.08 mass % and equal to or less than 1.50 mass %. As the material containing the stabilizer element, powder, a chip, wire, or foil is used. As means for melting a surface layer, electron-beam heating and plasma arc heating are used.

Disclosed are pretreatment compositions and associated methods for treating metal substrates with pretreatment compositions, including ferrous substrates, such as cold rolled steel and electrogalvanized steel. The pretreatment composition includes: a Group IIIB and/or IVB metal; free fluoride; and molybdenum. The methods include contacting the metal substrates with the pretreatment composition.

An electromagnetic wave shielding thin film for shielding from electromagnetic waves generated in an electronic part is provided. The electromagnetic wave shielding thin film includes metal plate which has elastic limit of 1% or more, strength of 1000 MPa or more, and a volume fraction of an amorphous phase of 50% or more.

A Zr-based or ZrCu based metallic glass thin film (MGTF) coated on aluminum alloy substrate and a method of fabricating the metallic glass and MGTF coated on aluminum alloy substrate are disclosed. The Zr-based metallic glass thin film-coated aluminum alloy substrate of the present invention comprises: an aluminum alloy substrate; and a Zr-based metallic glass thin film located on the substrate, in which the Zr-based metallic glass is represented by the formula of (Zr.sub.aCu.sub.bNi.sub.cAl.sub.d).sub.100-xSi.sub.x, wherein 45=<a=<75, 25=<b=<35, 5=<c=<15, 5=<d=<15, 0.1=<x=<10. The ZrCu-based metallic glass thin film coated substrate of the present invention comprises: an aluminum alloy substrate; a ZrCu-based metallic glass thin film located on the aluminum alloy substrate, in which the ZrCu-based metallic glass is represented by the following formula of (Zr.sub.eCu.sub.fAl.sub.gAg.sub.h).sub.100-ySi.sub.y, wherein 35=<e=<55, 35=<f=<55, 5=<g=<15, 5=<h=<15, 0.1=<y=<10.

Disclosed are pretreatment compositions and associated methods for treating metal substrates with pretreatment compositions, including ferrous substrates, such as cold rolled steel and electrogalvanized steel. The pretreatment composition includes: a Group IIIB and/or IVB metal; free fluoride; and molybdenum. The methods include contacting the metal substrates with the pretreatment composition.

A bi-layer protective coating for a metal component, the bi-layer protective coating comprising a bond coating that is metallurgically fused to a substrate of the metal component, wherein the bond coating comprises one or more rare metals and a top coating that is mechanically bonded to the bond coating, wherein the top coating comprises one or more metal oxides, or one or more metal carbides.

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

Methods of enhancing the corrosion resistance of an oxidizable material exposed to a supercritical fluid is disclosed One method includes placing a surface layer on an oxidizable material, and choosing a buffered supercritical fluid containing a reducing agent with the composition of the buffered supercritical fluid containing the reducing agent chosen to avoid the corrosion of the surface layer or reduce the rate of corrosion of the surface layer and avoid the corrosion of the oxidizable material or reduce the rate of corrosion of the oxidizable material at a temperature above the supercritical temperature and supercritical pressure of the supercritical fluid.

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

An electromagnetic wave shielding thin film for shielding from electromagnetic waves generated in an electronic part is provided. The electromagnetic wave shielding thin film includes metal plate which has elastic limit of 1% or more, strength of 1000 MPa or more, and a volume fraction of an amorphous phase of 50% or more.