A resin-coated copper foil includes: a copper foil layer including a first surface and a second surface, wherein a laser absorptance of the first surface of the copper foil layer is greater than a laser absorptance of the second surface of the copper foil layer, and wherein ribs are formed on the second surface of the copper foil layer; a carrier film disposed on the first surface of the copper foil layer; a primer resin layer disposed on the second surface of the copper foil layer; and a build-up resin layer disposed on the primer resin layer.

A composite metal foil and a method of manufacturing the same are provided. The composite metal foil includes at least a first metal layer and a second metal layer. The first metal layer is copper foil, nickel foil, stainless steel foil, or a combination thereof. The second metal layer is disposed on a surface of the first metal layer. A contact angle of a surface of the second metal layer to liquid lithium metal is lower than 90 degrees.

The present invention relates to a hybrid base plate and a manufacturing method therefor. Metal sheets of different materials having excellent thermal conductivity can be joined to have a thickness favorable for heat dissipation, and by arranging a metal sheet of a material with a low coefficient of thermal expansion between metal sheets with a high coefficient of thermal expansion, there is an effect of preventing warpage when manufacturing a large-area heat sink.

A method of manufacturing a composite metal foil includes providing a first metal layer and forming a second metal layer on a surface of the first metal layer through electroplating. The first metal layer is copper foil, nickel foil, stainless steel foil, or a combination thereof. A contact angle of a surface of the second metal layer to liquid lithium metal is lower than 90 degrees.

A multilayer coating including an adhesion layer; and a protective coating is disclosed. The multilayer coating can be applied to a portion of at least one of a base and a tip of an interface cone. A method of making a coated interface cone is also disclosed.

A surface-treated copper foil which maintains peel strength against the resin substrate of the surface-treated copper foil and achieves desired low transmission loss even at high frequencies includes an electrolytic copper foil, at least one roughened layer that covers one surface of the electrolytic copper foil, an anti-rust layer that covers the at least one roughened layer, and a silane coupling agent-treated layer that covers the anti-rust layer, in which a surface of the surface-treated copper foil on a side of the layers has a developed interfacial area ratio Sdr of 40% or less, an arithmetic mean peak curvature Spc of 200 mm-1 or less and a root mean square gradient Sdq of 0.30 to 0.90, or particles on the surface to be bonded of the surface-treated copper foil have an average particle size of 0.50 m or less and an average particle length of 0.40 to 0.70 m.

A decorative component includes a plurality of metal finish layers deposited over a substrate and a plurality of sub-layers. The outermost metal finish layer is selectively deposited or removed to define one or more recesses to create different appearances of the component. The outer metal layer may undergo laser ablation to remove at least a portion of the outer layer while still exposing the outer layer in the area of removed material. The recess may extend fully through the outer layer to expose the underlying metal finish layer, and/or the recess may have a sloped bottom surface to define a gradient appearance. The outer layer may be applied over a mask that is applied to the underlying layer, such that the outer layer is selectively applied. The outer layer may be removed to expose the underlying finish layer without exposing a nickel sublayer and without requiring a top coat.

Disclosed are surface-treated copper foils having at least one treated surface that exhibit high conductivity and a set of surface properties. Also provided are flexible copper-clad laminates and printed circuits made therefrom. The present printed circuits exhibit low insertion loss and are suitable for use in high speed/high frequency applications.

Disclosed are surface-treated copper foils having at least one treated surface that exhibit high conductivity and a set of surface properties. Also provided are flexible copper-clad laminates and printed circuits made therefrom. The present printed circuits exhibit low insertion loss and are suitable for use in high speed/high frequency applications.

A precious metallic laminate may include a first transparent substrate, a transparent transition layer deposited on the first transparent substrate, and a metallic layer deposited on the transparent transition layer. The metallic layer may include a precious metal. The laminate may include a second transparent substrate covering the metallic layer.