A composite metal porous body according to an aspect of the present invention has a framework of a three-dimensional network structure. The framework includes a porous base material and a metal film coated on the surface of the porous base material. The metal film contains titanium metal or titanium alloy as the main component.

A wire material for a canted coil spring includes a core wire composed of a steel having a pearlite structure, a copper plating layer covering the outer peripheral surface of the core wire, the copper plating layer being composed of copper or a copper alloy, and a hard layer disposed adjacent to the outer periphery of the copper plating layer, the hard layer having a higher hardness than the copper plating layer. The steel constituting the core wire contains 0.5% or more by mass and 1.0% or less by mass carbon, 0.1% or more by mass and 2.5% or less by mass silicon, and 0.3% or more by mass and 0.9% or less by mass manganese, the balance being iron and unavoidable impurities.

A coating system for a surface of a superalloy component is provided. The coating system includes a MCrAlY coating on the surface of the superalloy component, where M is Ni, Fe, Co, or a combination thereof. The MCrAlY coating generally has a higher chromium content than the superalloy component. The MCrAlY coating also includes a platinum-group metal aluminide diffusion layer. The MCrAlY coating includes Re, Ta, or a mixture thereof. Methods are also provided for forming a coating system on a surface of a superalloy component.

The present disclosure provides a copper-phosphorus-tin brazing wire and a preparation method thereof, relates to the technical field of brazing materials. The copper-phosphorus-tin brazing wire is of a three-layer structure, the inner layer is Cu, the middle layer is Cu-14P alloy, and the outer layer is Sn, wherein the mass percentage of Sn is over 7%. The present disclosure solves the technical problems in the prior art that the copper-phosphorus-silver brazing filler metal is prone to produce defects such as pores and inclusions when brazing copper alloys, which leads to the decline of the mechanical properties of the joint, and simultaneously provides the preparation method of the copper-phosphorus-tin brazing wire, such that the technical problem that it is difficult to obtain copper-phosphorus-tin brazing wire with a wire diameter below 0.5 mm under the condition of high Sn content is solved.

A plated product includes a component and an overall layer plated on a surface of the component. The overall layer includes a copper layer, a nickel layer, a nickel-tungsten layer, an inner golden layer, a palladium layer, an outer golden layer and a rhodium-ruthenium layer. The copper layer is plated on a surface of the component. The nickel layer, the nickel-tungsten layer, the inner golden layer, the palladium layer, the outer golden layer and the rhodium-ruthenium layer are plated on a surface of the copper layer in sequence.

The present invention provides a titanium copper foil having improved adhesion to solder and higher resistance to discoloration due to a high temperature and high humidity environment, an acid solution or an alkaline solution, and as well as having improved etching processability. The present invention provides a titanium copper foil comprising a base metal, the base metal having a composition containing Ti of from 1.5 to 5.0% by mass, the balance being copper and inevitable impurities, and having a thickness of from 0.018 to 0.1 mm, wherein the titanium copper foil has an Sn plated layer on a surface of the base metal, and has an adhesive strength of 0.5 N or more as measured by a solder adhesive strength test according to the definition in the specification.

A metallic foil for lightning strike protection in a composite aerospace structure having a length, a width, and a thickness of not more than 30 microns. There are a plurality of pores of a predefined geometric shape extending through the thickness of the metallic foil and being distributed across a surface area defined by the length and the width of the metallic foil. The plurality of pores in the aggregate define an open area of not more than 40% of the surface area and the metallic foil has a weight of not more than 115 g/m.sup.2. The metallic foil has a weight to conductivity ratio of not more than 0.40 gram-ohms per square.

A technique capable of reducing the possibility of generation of a CuSb compound in an overlay and the possibility of delamination between layers. A sliding member includes: an overlay including an alloy plating film of Bi and Sb; a lining including an Al alloy; a first intermediate layer including Cu as a main component, and laminated on the lining; and a second intermediate layer including Ag as a main component, and connecting the first intermediate layer and the overlay.

A sputtering target is provided for forming a protective film which is used for forming a protective film on a single surface or both surfaces of a Cu wiring film, the sputtering target including 5 to 15 mass % of Ni or Ni and Al in total (where the Ni content is 0.5 mass % or higher); 0.1 to 5.0 mass % of Mn; 0.5 to 7.0 mass % of Fe; and a balance including Cu and inevitable impurities.

A multiple layer metallic laminate including a metallic layer of high heat dispersion characteristics and a thermal barrier material interlaid within the metallic layer. The laminate can include multiple metallic layers having either high heat dispersion characteristics or lesser heat dispersion characteristics. The thermal barrier material can separate portions of the high heat dispersion metallic layers from one another to minimize heat dispersion into isolated portions.