Patent classifications
Y10T428/12882
METHOD FOR MANUFACTURING CLAD MATERIAL
A clad material includes a first layer made of stainless steel and a second layer made of Cu or a Cu alloy and roll-bonded to the first layer. In the clad material, a grain size of the second layer measured by a comparison method of JIS H 0501 is 0.150 mm or less.
Airfoil with improved coating system
A coating system for a surface of a superalloy component is provided. The coating system includes a MCrAlY coating on the surface of the superalloy component, where M is Ni, Fe, Co, or a combination thereof. The MCrAlY coating generally has a higher chromium content than the superalloy component. The MCrAlY coating also includes a platinum-group metal aluminide diffusion layer. The MCrAlY coating includes Re, Ta, or a mixture thereof. Methods are also provided for forming a coating system on a surface of a superalloy component.
Copper alloy for electronic and electrical equipment, copper alloy thin sheet for electronic and electrical equipment, and conductive component for electronic and electrical equipment, terminal
One aspect of this copper alloy for an electronic and electrical equipment contains: more than 2.0 mass % to 36.5 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.15 mass % to less than 1.00 mass % of Ni; and 0.005 mass % to 0.100 mass % of P, with the balance containing Cu and inevitable impurities, wherein atomic ratios of amounts of elements satisfy 3.00<Ni/P<100.00 and 0.10<Sn/Ni<2.90, and a strength ratio TS.sub.TD/TS.sub.LD of tensile strength TS.sub.TD in a direction perpendicular to a rolling direction to tensile strength TS.sub.LD in a direction parallel to the rolling direction exceeds 1.09.
Silicon steel composite for low denomination coin
An alloy includes: steel; manganese; aluminum; and silicon in an amount such that the alloy has an electrical conductivity from 2% IACS to 6% IACS measured in accordance with ASTM E1004-09 (2009).
Application of metallic glass coating for improving fatigue resistance of aluminum alloys
A Zr-based or ZrCu based metallic glass thin film (MGTF) coated on aluminum alloy substrate and a method of fabricating the metallic glass and MGTF coated on aluminum alloy substrate are disclosed. The Zr-based metallic glass thin film-coated aluminum alloy substrate of the present invention comprises: an aluminum alloy substrate; and a Zr-based metallic glass thin film located on the substrate, in which the Zr-based metallic glass is represented by the formula of (Zr.sub.aCu.sub.bNi.sub.cAl.sub.d).sub.100-xSi.sub.x, wherein 45=<a=<75, 25=<b=<35, 5=<c=<15, 5=<d=<15, 0.1=<x=<10. The ZrCu-based metallic glass thin film coated substrate of the present invention comprises: an aluminum alloy substrate; a ZrCu-based metallic glass thin film located on the aluminum alloy substrate, in which the ZrCu-based metallic glass is represented by the following formula of (Zr.sub.eCu.sub.fAl.sub.gAg.sub.h).sub.100-ySi.sub.y, wherein 35=<e=<55, 35=<f=<55, 5=<g=<15, 5=<h=<15, 0.1=<y=<10.
Bonding wire for semiconductor device
A bonding wire includes a Cu alloy core material, and a Pd coating layer formed on the Cu alloy core material. The bonding wire contains at least one element selected from Ni, Zn, Rh, In, Ir, and Pt. A concentration of the elements in total relative to the entire wire is 0.03% by mass or more and 2% by mass or less. When measuring crystal orientations on a cross-section of the core material in a direction perpendicular to a wire axis of the bonding wire, a crystal orientation <100> angled at 15 degrees or less to a wire axis direction has a proportion of 50% or more among crystal orientations in the wire axis direction. An average crystal grain size in the cross-section of the core material in the direction perpendicular to the wire axis of the bonding wire is 0.9 m or more and 1.3 m or less.
LAMINATE AND METHOD OF MANUFACTURING LAMINATE
A laminate includes: an insulating substrate; an intermediate layer formed on a surface of the substrate and containing a metal or an alloy as a main component; and a metal film formed of a copper powder having a hydrogen content of 0.002% by mass or less and laminated on the intermediate layer. An interface between the intermediate layer and the metal film is plastically deformed.
Gold or silver metallized plastic product free of any gold and silver element and method for manufacturing it
The invention relates to a method for manufacturing a metallized plastic product with a gold or silver hue, comprising the steps: galvanization of a surface of the plastic body for forming a galvanized chromium layer; deposition by evaporation of a metal layer directly on the galvanized chromium layer, the metal being copper, a mixture of metals comprising at least 70% by weight of copper, a copper alloy comprising at least 70% by weight of copper, or aluminum. The invention also relates to a metallized plastic product (1) with a gold or silver hue, comprising a plastic body (2), a galvanized chromium layer (3, 4, 5, 6), and a metal layer (7), the metal being copper, a mixture of metals comprising at least 70% by weight of copper, an alloy containing copper in an amount of at least 70% by weight, or aluminum.
Metal-coated liquid-crystal polymer film
Provide is a metal-coated liquid-crystal polymer film that is suitable for microcircuit processing and capable of reducing the transmission loss of circuits. The metal-coated liquid-crystal polymer film comprising: a polymer film comprising a polymer film main body capable of forming an optically anisotropic melt phase; a first metal layer layered on at least one side of the polymer film main body; and a second metal layer layered on the first metal layer, wherein in an analysis of oxygen concentration in a thickness direction using XPS, the average oxygen concentration of the first metal layer is 2.5 atom % or less.
Black plated resin part and method for manufacturing the same
A black plated resin part includes a resin base material, an underlying plating layer including a copper plating layer and a nickel plating layer formed in this order on the resin base material, a black chromium plating layer formed on the nickel plating layer, formed of trivalent chromium, and having a film thickness of not less than 0.15 m, and a corrosion resistant film formed on the black chromium plating layer, formed of chromic phosphate or molybdenum phosphate, and having a film thickness of not less than 7 nm. A brightness of the black chromium plating layer seen through the corrosion resistant film is expressed by an L* value of not more than 54 based on the L*a*b* color system.