A surface-treated material of the present disclosure has a conductive substrate, and a surface treatment film which includes at least one layer of metal layers and is formed on the conductive substrate. The surface treatment film is a plating film. The surface treatment film is formed on a whole surface or a part of the conductive substrate through a zinc-containing layer that contains zinc as a main component and has a thickness of 50 nm or less, or is formed on the conductive substrate without through the zinc-containing layer. The surface-treated material has a ratio of a contact area to a test area of 85% or more as measured according to a tape test method defined in JIS H 8504: 1999.

The present invention is intended to provide a roll-bonded laminate, in which an ultrathin metal layer is laminated on another metal without generation of wrinkles, cracks and the like. A roll-bonded laminate formed by lamination of at least three layers, which comprises a peelable carrier layer 10, an ultrathin metal layer 20 and a metallic foil 30, wherein the thickness of the ultrathin metal layer 20 is 0.5 ?m or more and 20 ?m or less.

An aluminum-diamond composite that exhibits both high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, and that can suppress the occurrence of swelling, etc., of a surface metal layer portion even in actual use under a high load. An aluminum-diamond composite includes 65-80 vol % of a diamond powder having a roundness of at least 0.94, for which a first peak in a volumetric distribution of grain size lies at 5-25 m, and a second peak lies at 55-195 m, and a ratio between the area of the volumetric distribution of grain sizes of 1-35 m and the area of the volumetric distribution of grain sizes of 45-205 m is from 1:9 to 4:6; the balance being composed of a metal containing aluminum.

A laminate including a metallic base material, a nickel-containing plating film layer formed on the metallic base material, and a gold plating film layer formed on the nickel-containing plating film layer, in which pinholes in the gold plating film layer are sealed with a passive film having a thickness of 15 nm or greater. Also disclosed is a constituent member of a semiconductor production device including the laminate and a method for producing the laminate.

A method for fabricating nanostructures and nanostructures are disclosed, which can include forming a multi-segmented nanowire; and performing a galvanic displacement reaction on the multi-segmented nanowire. The method utilizes template directed electrodeposition to fabricate nanowires with alternating layers of sacrificial/noble metal, enabling a new level of control over particle spacing, aspect ratio, and composition. Moreover, by exploiting the redox potential dependent reaction of galvanic displacement, nanopeapod materials can be extended (semiconductor/metal, p-type/n-type, metal/metal, ferromagnetic/nonmagnetic, etc.) beyond the fundamental metal/metal-oxide nanopeapods synthesized by high temperature techniques. Co/Au and Ni/Au multisegmented nanowires are disclosed, which can be create Te/Au nanopeapods by galvanic displacement, producing Te nanotubes and nanowires with embedded Au particles, respectively.

A coating system for a surface of a superalloy component is provided. The coating system includes a MCrAlY coating on the surface of the superalloy component, where M is Ni, Fe, Co, or a combination thereof. The MCrAlY coating generally has a higher chromium content than the superalloy component. The MCrAlY coating also includes a platinum-group metal aluminide diffusion layer. The MCrAlY coating includes Re, Ta, or a mixture thereof. Methods are also provided for forming a coating system on a surface of a superalloy component.

A device including a protecting material encapsulated metallic beam and a method of encapsulating the metallic beam using the protecting material layer are presented. The device includes a cantilever beam that includes at least about 90 Wt % of a metallic beam material, and 10 Wt % or less of a protecting material. The method of forming an encapsulated metallic beam includes the steps of depositing a first layer of protecting material over a substrate, depositing a second layer of protecting material over the first layer, depositing a metallic beam material over the second layer of protecting material, and encapsulating the beam material with a coating of the protecting material.

A bonding wire includes a Cu alloy core material, and a Pd coating layer formed on the Cu alloy core material. The bonding wire contains at least one element selected from Ni, Zn, Rh, In, Ir, and Pt. A concentration of the elements in total relative to the entire wire is 0.03% by mass or more and 2% by mass or less. When measuring crystal orientations on a cross-section of the core material in a direction perpendicular to a wire axis of the bonding wire, a crystal orientation <100> angled at 15 degrees or less to a wire axis direction has a proportion of 50% or more among crystal orientations in the wire axis direction. An average crystal grain size in the cross-section of the core material in the direction perpendicular to the wire axis of the bonding wire is 0.9 m or more and 1.3 m or less.

Provide is a metal-coated liquid-crystal polymer film that is suitable for microcircuit processing and capable of reducing the transmission loss of circuits. The metal-coated liquid-crystal polymer film comprising: a polymer film comprising a polymer film main body capable of forming an optically anisotropic melt phase; a first metal layer layered on at least one side of the polymer film main body; and a second metal layer layered on the first metal layer, wherein in an analysis of oxygen concentration in a thickness direction using XPS, the average oxygen concentration of the first metal layer is 2.5 atom % or less.

The present invention relates generally to a coated jewelry article or a coated component of a jewelry article, comprising a jewelry article or a component of a jewelry article, a first metallic coating, and a second metallic coating.