A bonding wire for a semiconductor device, characterized in that the bonding wire includes a Cu alloy core material and a Pd coating layer formed on a surface of the Cu alloy core material, the bonding wire contains an element that provides bonding reliability in a high-temperature environment, and a strength ratio defined by the following Equation (1) is 1.1 to 1.6:
Strength ratio=ultimate strength/0.2% offset yield strength.(1)

Coated articles and methods for applying coatings are described. In some cases, the coating can exhibit desirable properties and characteristics such as durability, corrosion resistance, and high conductivity. The articles may be coated, for example, using an electrodeposition process.

A metallic material that includes a base material; and a surface layer formed on a surface of the base material and exposed on an outermost surface, wherein the surface layer contains Ag, and In less than the Ag in atomic ratio, and a connection terminal being made of the metallic material, wherein the surface layer is formed on a surface of the base material, at least in a contact portion electrically contacting an opposite electrically conductive member.

Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a bond pad of a microfeature workpiece, with the volume of material including a first metallic constituent and the bond pad including a second constituent. The method can further include elevating a temperature of the volume of material while the volume of material is applied to the bond pad to alloy the first metallic constituent and the second metallic constituent so that the first metallic constituent is alloyed generally throughout the volume of material. A thickness of the bond pad can be reduced from an initial thickness T1 to a reduced thickness T2.

A method for surface treatment of a metal material in a powder state is provided, the method including obtaining a powder formed from a plurality of particles of the metal material to be treated; and subjecting the powder to an ion implantation process by directing a beam of singly-charged or multi-charged ions towards an outer surface of the particles, the beam being produced by a source of singly-charged or multi-charged ions, whereby the particles have an overall spherical shape with a radius (R). There is also provided a material in a powder state formed from a plurality of particles having a ceramic outer layer and a metal core, the particles having an overall spherical shape.

There is disclosed a substrate with an electron donating surface, characterized in having metal particles on said surface, said metal particles comprising palladium and at least one metal selected from the group consisting of gold, ruthenium, rhodium, osmium, iridium, and platinum, wherein the amount of said metal particles is from about 0.001 to about 8 g/cm.sup.2. Examples of coated objects include contact lenses, pacemakers, pacemaker electrodes, stents, dental implants, rupture nets, rupture mesh, blood centrifuge equipment, surgical instruments, gloves, blood bags, artificial heart valves, central venous catheters, peripheral venous catheters, vascular ports, haemodialysis equipment, peritoneal dialysis equipment, plasmapheresis devices, inhalation drug delivery devices, vascular grafts, arterial grafts, cardiac assist devices, wound dressings, intermittent catheters, ECG electrodes, peripheral stents, bone replacing implants, orthopaedic implants, orthopaedic devices, tissue replacing implants, intraocular lenses, sutures, needles, drug delivery devices, endotracheal tubes, shunts, drains, suction devices, hearing aid devices, urethral medical devices, and artificial blood vessels.

Provided are a plated material having excellent abrasion resistance, electrical conductivity, sliding performance, and low friction, in which a plating layer does not undergo embrittlement properly; and a method for producing the plated material. The method includes a first step of at least partially removing a reflow tin plating layer from a metallic base material having the reflow layer on at least a part thereof and a reactive layer provided at the interface between the reflow layer and the base material; a second step of at least partially subjecting a region in which the reflow tin plating layer has been removed to a nickel plating treatment; a third step of at least partially subjecting the nickel plating layer to a silver strike plating treatment; and a fourth step of at least partially subjecting a region of the silver strike plating to a silver plating treatment.

This hermetic sealing lid member (10) is made of a clad material (20) including a silver brazing layer (21) that contains Ag and Cu and a first Fe layer (22) bonded onto the silver brazing layer and made of Fe or an Fe alloy. The hermetic sealing lid member is formed in a box shape including a recess portion (13) by bending the clad material.

A wire material for a canted coil spring includes a core wire composed of a steel having a pearlite structure, a copper plating layer covering the outer peripheral surface of the core wire, the copper plating layer being composed of copper or a copper alloy, and a hard layer disposed adjacent to the outer periphery of the copper plating layer, the hard layer having a higher hardness than the copper plating layer. The steel constituting the core wire contains 0.5% or more by mass and 1.0% or less by mass carbon, 0.1% or more by mass and 2.5% or less by mass silicon, and 0.3% or more by mass and 0.9% or less by mass manganese, the balance being iron and unavoidable impurities.

A silver-plated product is produced by forming a surface layer of silver on a base material by electroplating at a liquid temperature of 10 to 35 C. and a current density of 3 to 15 A/dm.sup.2 in a silver plating solution so as to satisfy (32.6x300)y(32.6x+200) assuming that a product of a concentration of potassium cyanide in the silver plating solution and a current density is y (g.Math.A/L.Math.dm.sup.2) and that a liquid temperature of the silver plating solution is x ( C.), the silver plating solution containing 80 to 110 g/L of silver, 70 to 160 g/L of potassium cyanide and 55 to 70 mg/L of selenium.