Patent classifications
Y10T428/12903
INTERMETALLIC METALLIC COMPOSITE, METHOD OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME
Disclosed herein is an article comprising a plurality of domains fused together; wherein the domains comprise a core comprising a first metal; and a first layer disposed upon the core; the first layer comprising a second metal; the first metal being chemically different the second metal. Disclosed herein too is a method comprising rolling a sheet in a roll mill; the sheet comprising a first metal and having disposed upon each opposing face of the sheet a first layer that comprises a second metal; the second metal being chemically different from the first metal; cutting the sheet into a plurality of sheets; stacking the plurality of sheets; and rolling the stacked sheets in the roll mill to form a blank.
COATED ARTICLES AND METHODS
Coated articles and methods for applying coatings are described. In some cases, the coating can exhibit desirable properties and characteristics such as durability, corrosion resistance, and high conductivity. The articles may be coated, for example, using an electrodeposition process.
METALLIC MATERIAL AND CONNECTION TERMINAL
A metallic material that includes a base material; and a surface layer formed on a surface of the base material and exposed on an outermost surface, wherein the surface layer contains Ag, and In less than the Ag in atomic ratio, and a connection terminal being made of the metallic material, wherein the surface layer is formed on a surface of the base material, at least in a contact portion electrically contacting an opposite electrically conductive member.
MICROFEATURE WORKPIECES HAVING ALLOYED CONDUCTIVE STRUCTURES, AND ASSOCIATED METHODS
Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a bond pad of a microfeature workpiece, with the volume of material including a first metallic constituent and the bond pad including a second constituent. The method can further include elevating a temperature of the volume of material while the volume of material is applied to the bond pad to alloy the first metallic constituent and the second metallic constituent so that the first metallic constituent is alloyed generally throughout the volume of material. A thickness of the bond pad can be reduced from an initial thickness T1 to a reduced thickness T2.
Intermetallic metallic composite, method of manufacture thereof and articles comprising the same
Disclosed herein is an article comprising a plurality of domains fused together; wherein the domains comprise a core comprising a first metal; and a first layer disposed upon the core; the first layer comprising a second metal; the first metal being chemically different the second metal. Disclosed herein too is a method comprising rolling a sheet in a roll mill; the sheet comprising a first metal and having disposed upon each opposing face of the sheet a first layer that comprises a second metal; the second metal being chemically different from the first metal; cutting the sheet into a plurality of sheets; stacking the plurality of sheets; and rolling the stacked sheets in the roll mill to form a blank.
COMPOSITE METAL POROUS BODY AND METHOD FOR PRODUCING COMPOSITE METAL POROUS BODY
A composite metal porous body according to an aspect of the present invention has a framework of a three-dimensional network structure. The framework includes a porous base material and a metal film coated on the surface of the porous base material. The metal film contains titanium metal or titanium alloy as the main component.
Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar
A copper alloy for an electronic and electric device is provided. The copper alloy includes: Mg in a range of 0.15 mass % or more and less than 0.35 mass %; and a Cu balance including inevitable impurities, wherein the electrical conductivity of the copper alloy is more than 75% IACS, and a strength ratio TS.sub.TD/TS.sub.LD, which is calculated from strength TS.sub.TD obtained in a tensile test performed in a direction perpendicular to a rolling direction and strength TS.sub.LD obtained in a tensile test performed in a direction parallel to a rolling direction, is more than 0.9 and less than 1.1. The copper alloy may further include P in a range of 0.0005 mass % or more and less than 0.01 mass %.
High Entropy Alloy Having Composite Microstructure and Method of Manufacturing the Same
A method of making a metallic alloy, more particularly, a high-entropy alloy with a composite structure that exhibits high strength and good ductility, and is used as a component material in electromagnetic, chemical, shipbuilding, machinery, and other applications, and in extreme environments, and the like.
A COATED METALLIC SUBSTRATE AND FABRICATION METHOD
A coated metallic substrate is provided, including, at least; one layer of oxides, such layer being directly topped by an intermediate coating layer comprising Fe, Ni, Cr and Ti wherein the amount of Ti is above or equal to 5 wt. % and wherein the following equation is satisfied: 8 wt. %<Cr+Ti<40 wt. %, the balance being Fe and Ni, such intermediate coating layer being directly topped by a coating layer being an anticorrosion metallic coating.
Cu core ball, solder joint, solder paste and formed solder
The Cu core ball contains a Cu ball and one or more metal layer for covering a surface of the Cu ball, each layer including one or more element selected from Ni, Co, Fe and Pd. The Cu ball contains at least one element selected from Fe, Ag, and Ni in a total amount of 5.0 or more to 50.0 ppm by mass or lower, S in an amount of 0 ppm by mass or more to 1.0 ppm by mass or lower, P in an amount of 0 ppm by mass or more to less than 3.0 ppm by mass, and remainder of Cu and inevitable impurities. The Cu ball contains purity which is 99.995% by mass or higher and 99.9995% or lower, sphericity which is 0.95 or higher and a diameter of 1 m or more to 1000 m or lower.