A laminate including a metallic base material, a nickel-containing plating film layer formed on the metallic base material, and a gold plating film layer formed on the nickel-containing plating film layer, in which pinholes in the gold plating film layer are sealed with a passive film having a thickness of 15 nm or greater. Also disclosed is a constituent member of a semiconductor production device including the laminate and a method for producing the laminate.

A coating-substrate combination includes: a Ni-based superalloy substrate comprising, by weight percent: 2.0-5.1 Cr; 0.9-3.3 Mo; 3.9-9.8 W; 2.2-6.8 Ta; 5.4-6.5 Al; 1.8-12.8 Co; 2.8-5.8 Re; 2.8-7.2 Ru; and a coating comprising, exclusive of Pt group elements, by weight percent: Ni as a largest content; 5.8-9.3 Al; 4.4-25 Cr; 3.0-13.5 Co; up to 6.0 Ta, if any; up to 6.2 W, if any; up to 2.4 Mo, if any; 0.3-0.6 Hf; 0.1-0.4 Si; up to 0.6 Y, if any; up to 0.4 Zr, if any; up to 1.0 Re, if any.

The present invention relates to a protective layer against CMAS, to a CMAS-resistant article comprising the protective layer according to the invention, and to a process for preparing a corresponding article.

A method to increase the damping of a substrate using a face-centered cubic damping material foil containing voids.

A coating system for a surface of a superalloy component is provided. The coating system includes a MCrAlY coating on the surface of the superalloy component, where M is Ni, Fe, Co, or a combination thereof. The MCrAlY coating generally has a higher chromium content than the superalloy component. The MCrAlY coating also includes a platinum-group metal aluminide diffusion layer. The MCrAlY coating includes Re, Ta, or a mixture thereof. Methods are also provided for forming a coating system on a surface of a superalloy component.

An alloy includes: steel; manganese; aluminum; and silicon in an amount such that the alloy has an electrical conductivity from 2% IACS to 6% IACS measured in accordance with ASTM E1004-09 (2009).

In some examples, an article including a substrate and a multi-layered coating on at least a portion of the substrate. The multi-layered coating including at least one nano-crystalline layer comprising a metal or a metal alloy and a corrosion resistant layer on the at least one nano-crystalline layer. The nano-crystalline layer defining an average grain size of less than 50 nanometers (nm) and the corrosion resistant layer including at least one of nickel metal, tin metal, zinc metal, cadmium metal, chromium metal, nickel-phosphorus alloy, nickel-sulfur alloy, nickel-boron alloy, nickel-cadmium alloy, nickel-zinc alloy, and tin-zinc alloy.

A steel sheet for a container includes a steel sheet, a Sn coated layer which is provided as an upper layer of the steel sheet and contains Sn in an amount of 560 to 5600 mg/m.sup.2 in terms of Sn metal, and a chemical treatment layer which is provided as an upper layer of the Sn coated layer and contains a Zr compound in an amount of 3.0 to 30.0 mg/m.sup.2 in terms of Zr metal and a Mg compound in an amount of 0.50 to 5.00 mg/m.sup.2 in terms of Mg metal.

The present invention accurately distinguishes a soldering material less likely to oxidize. A Cu core ball has a Cu ball having a predetermined size, and a solder layer coating the Cu ball. The Cu ball provides a space between a semiconductor package and a printed circuit board. The Cu core ball has the soldering material having lightness greater than or equal to 62.5 in L*a*b* color space subsequent to a heating storage test performed for 72 hours in a temperature-controlled bath at 150 C. with a temperature of 25 C. and 40% humidity, and the soldering material, prior to the heating storage test, having lightness greater than or equal to 65 in the L*a*b* color space and yellowness less than or equal to 7.0 in the L*a*b* color space.

The invention relates to a method for manufacturing a metallized plastic product with a gold or silver hue, comprising the steps: galvanization of a surface of the plastic body for forming a galvanized chromium layer; deposition by evaporation of a metal layer directly on the galvanized chromium layer, the metal being copper, a mixture of metals comprising at least 70% by weight of copper, a copper alloy comprising at least 70% by weight of copper, or aluminum. The invention also relates to a metallized plastic product (1) with a gold or silver hue, comprising a plastic body (2), a galvanized chromium layer (3, 4, 5, 6), and a metal layer (7), the metal being copper, a mixture of metals comprising at least 70% by weight of copper, an alloy containing copper in an amount of at least 70% by weight, or aluminum.