An example hydraulic system component of a machine includes a protective coating deposited by high velocity air fuel (HVAF) thermal spray, exhibiting high adhesion strengths and surface morphologies that promote lubricant adhesion and reduce the leakage of oil and/or hydraulic fluid from the hydraulic system. The coating may have surface roughness with Rz values less than 2 μm and hardness of 1000 Vickers or greater. The HVAF coating may be thinner than conventional coatings with thicknesses less than 100 μm. The HVAF coating may be deposited on a variety of steel components with adhesion strengths greater than those achieved by high velocity oxygen fuel (HVOF). The HVAF coating may be formed without time consuming roughening and/or post-grind operations, resulting in cost savings compared to conventional coatings. The coatings may have operational lifetimes of 1000 hours or more.

A process for producing a thermal barrier coating having an excellent thermal barrier effect and superior durability to thermal cycling. Also, a turbine member having a thermal barrier coating that has been formed using the production process, and a gas turbine. The process for producing a thermal barrier coating includes: forming a metal bonding layer (12) on a heat-resistant alloy substrate (11), and forming a ceramic layer (13) on the metal bonding layer (12) by thermal spraying of thermal spray particles having a particle size distribution in which the 10% cumulative particle size is not less than 30 μm and not more than 100 μm.

The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 μg/dm.sup.2 of Ni and said Cr layer containing 10-100 μg/dm.sup.2 of Cr is provided.

A method to increase the damping of a substrate using a face-centered cubic ferromagnetic damping material.

A tin-plated copper alloy terminal material in which an Sn-based surface layer is formed on a surface of a base material that is made of copper or a copper alloy, and a Cu—Sn alloy layer and an Ni layer or an Ni alloy layer are sequentially formed between the Sn-based surface layer and the base material from the Sn-based surface layer side: the Cu—Sn alloy layer is a layer that is formed only of an intermetallic compound alloy which is obtained by substituting some of Cu in Cu.sub.6Sn.sub.5 alloy with Ni; and parts of the Cu—Sn alloy layer are exposed from the Sn-based surface layer, thereby forming a plurality of exposed portions; an average thickness of the Sn-based surface layer is from 0.2 μm to 0.6 μm (inclusive); and an area rate of the exposed portions of the Cu—Sn alloy layer relative to a surface area of is 1% to 40% (inclusive).

An object of the invention is to provide: a two-phase alloy as a metal material that can be preferably utilized under circumstances of a temperature range and a high corrosion as in an oil well, the two-phase alloy having a high corrosion resistance and good mechanical properties that are equivalent or more than those of conventional ones, and saving a cost; a product of the two-phase alloy; and a method for producing the product. There is provided a two-phase alloy containing Cr as a major component and including two phases of an austenite phase and a ferrite phase in a mixed state. The alloy has a chemical composition containing: 34-70 mass % of Cr; 17-45 mass % of Ni; 10-35 mass % of Fe; 0.1-2 mass % of Mn; 0.1-1 mass % of Si; and impurities. The total content of the Ni and the Fe is 30-65 mass %.

A metallic alloy, more particularly, a high-entropy alloy with a composite structure exhibits high strength and good ductility, and is used as a component material in electromagnetic, chemical, shipbuilding, machinery, and other applications, and in extreme environments, and the like.

A process of fabricating a shield, a process of preparing a component, and an erosion shield are disclosed. The process of fabricating the shield includes forming a near-net shape shield. The near-net shape shield includes a nickel-based layer and an erosion-resistant alloy layer. The nickel-based layer is configured to facilitate secure attachment of the near-net shaped to a component. The process of preparing the component includes securing a near-net shape shield to a substrate of a component.

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

To provide a copper-clad laminate which maintains adhesion between a resin film and a conductor layer and which suppresses the occurrence of wrinkles. A copper-clad laminate has a base film containing a thermoplastic resin, an underlying metal layer film-formed on a surface of the base film by a dry plating method, and a copper layer film-formed on a surface of the underlying metal layer. The underlying metal layer has a mean thickness of 0.3 to 1.9 nm. Since the underlying metal layer has a mean thickness of 0.3 nm or more, it is possible to maintain adhesion between the base film and a conductor layer. Since the underlying metal layer has a mean thickness of 1.9 nm or less, it is possible to suppress an increase in the temperature of a film during film-forming of the underlying metal layer, and it is possible to suppress the occurrence of wrinkles.