An article of manufacture includes a part structure formed via a first additive manufacturing process and a floating structure within the part structure which is mechanically decoupled from the part structure. The floating structure is formed concurrently with the part structure via the first additive manufacturing process.

A composite is obtained by press-molding a mixed powder comprising 20-50 vol % of a metal powder and 50-80 vol % of a diamond powder for which a first peak in a volumetric distribution of particle size lies at 5-25 m, and a second peak lies at 55-195 m, and a ratio between the area of a volumetric distribution of particle sizes of 1-35 m and the area of a volumetric distribution of particle sizes of 45-205 m is from 1:9 to 4:6, thereby obtaining a composite having a high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, which is easy to mold into a prescribed shape.

An aluminum-diamond composite that exhibits both high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, and that can suppress the occurrence of swelling, etc., of a surface metal layer portion even in actual use under a high load. An aluminum-diamond composite includes 65-80 vol % of a diamond powder having a roundness of at least 0.94, for which a first peak in a volumetric distribution of grain size lies at 5-25 m, and a second peak lies at 55-195 m, and a ratio between the area of the volumetric distribution of grain sizes of 1-35 m and the area of the volumetric distribution of grain sizes of 45-205 m is from 1:9 to 4:6; the balance being composed of a metal containing aluminum.

An article of manufacture includes a part structure formed via a first additive manufacturing process and a floating structure within the part structure which is mechanically decoupled from the part structure. The floating structure is formed concurrently with the part structure via the first additive manufacturing process.

A metal foil including: a steel layer whose thickness is 10 to 200 m; an Al-containing metal layer arranged on the steel layer; and plural granular alloys which exist in an interface between the steel layer and the Al-containing metal layer, wherein, when a cutting-plane line of a surface of the Al-containing metal layer is defined as a contour curve and an approximation straight line of the contour curve is defined as a contour average straight line, a maximum point, whose distance from the contour average straight line is more than 10 m, is absent on the contour curve, and wherein, when an equivalent sphere diameter of the granular alloys is x in units of m and a thickness of the Al-containing metal layer is T in units of m, the granular alloys satisfy x0.5T.

A composite is obtained by press-molding a mixed powder comprising 20-50 vol % of a metal powder and 50-80 vol % of a diamond powder for which a first peak in a volumetric distribution of particle size lies at 5-25 m, and a second peak lies at 55-195 m, and a ratio between the area of a volumetric distribution of particle sizes of 1-35 m and the area of a volumetric distribution of particle sizes of 45-205 m is from 1:9 to 4:6, thereby obtaining a composite having a high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, which is easy to mold into a prescribed shape.

A monofilament (1) for the production of a superconducting wire (20) has a powder core (3) that contains at least Sn and Cu, an inner tube (2), made of Nb or an alloy containing Nb, that encloses the powder core (3), and an outer tube (4) in which the inner tube (2) is arranged. The outer side of the inner tube (2) is in contact with the inner side of the outer tube (4) and the outer tube (4) is produced from Nb or from an alloy containing Nb. The outer tube is disposed in a cladding tube. The superconducting current carrying capacity of the superconducting wire is thereby improved.

The present invention is directed to a process for tin coating a metallic substrate, and a process for hardening a tin layer and wire having a tin coating The invention relates in particular to a process for tin coating a wire. In the process, firstly a tin layer is applied, and a metal layer made of a metal different to tin is applied thereto. Then, the layers are subjected to a diffusion annealing operation.

An aluminum-diamond composite that exhibits both high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, and that can suppress the occurrence of swelling, etc., of a surface metal layer portion even in actual use under a high load. An aluminum-diamond composite includes 65-80 vol % of a diamond powder having a roundness of at least 0.94, for which a first peak in a volumetric distribution of grain size lies at 5-25 m, and a second peak lies at 55-195 m, and a ratio between the area of the volumetric distribution of grain sizes of 1-35 m and the area of the volumetric distribution of grain sizes of 45-205 m is from 1:9 to 4:6; the balance being composed of a metal containing aluminum.