Y10T428/1291

Metal foil for electromagnetic shielding, electromagnetic shielding material, and shielding cable

A metal foil for electromagnetic shielding, comprising: a metal foil base having a thickness of exceeding 4 m, an alloy layer having an A element configured of Sn or In and a B element group selected from the group consisting of one or more of Ag, Ni, Fe and Co formed on one or both surfaces of the base, and an underlayer having the B element group formed between the alloy layer and the base, wherein an adhesion amount of the A element is 10 to 300 mol/dm.sup.2, and a total adhesion amount of the B element group is 40 to 900 mol/dm.sup.2.

FRICTION MATERIAL
20200309221 · 2020-10-01 · ·

A friction material comprises an Fe part which contains Fe as a main component, a coating layer formed on a surface of the Fe part, and a friction part formed on a surface of at least a part of the coating layer, and the coating layer comprises a first coating layer and a second coating layer which have a specific average thickness and a specific component in order from Fe part side, and in the second coating layer, in order of positions at which the thickness is 20%, 40%, 60% and 80% of the second coating layer from the side of the first coating layer to the side opposite thereto, a Cu content increases and a Ni content decreases.

Heat sink plate

A heat sink plate having a structure in which two or more kinds of materials are laminated, includes: a core layer in the thickness direction of the heat sink plate; and cover layers covering a top surface and a bottom surface of the core layer; wherein the cover layers comprise a material containing copper, wherein the core layer is formed of a matrix having a first thermal expansion coefficient and a plurality of layers extending in parallel along the thickness direction of the core layer in a lattice form in the matrix, wherein the plurality of layers are made of an alloy having a second thermal expansion coefficient.

Bonding wire for semiconductor device

A bonding wire for a semiconductor device, characterized in that the bonding wire includes a Cu alloy core material and a Pd coating layer formed on a surface of the Cu alloy core material, the bonding wire contains an element that provides bonding reliability in a high-temperature environment, and a strength ratio defined by the following Equation (1) is 1.1 to 1.6:
Strength ratio=ultimate strength/0.2% offset yield strength.(1)

COATED ARTICLES AND METHODS

Coated articles and methods for applying coatings are described. In some cases, the coating can exhibit desirable properties and characteristics such as durability, corrosion resistance, and high conductivity. The articles may be coated, for example, using an electrodeposition process.

METALLIC MATERIAL AND CONNECTION TERMINAL

A metallic material that includes a base material; and a surface layer formed on a surface of the base material and exposed on an outermost surface, wherein the surface layer contains Ag, and In less than the Ag in atomic ratio, and a connection terminal being made of the metallic material, wherein the surface layer is formed on a surface of the base material, at least in a contact portion electrically contacting an opposite electrically conductive member.

High Entropy Alloy Having Composite Microstructure and Method of Manufacturing the Same
20200149144 · 2020-05-14 ·

A method of making a metallic alloy, more particularly, a high-entropy alloy with a composite structure that exhibits high strength and good ductility, and is used as a component material in electromagnetic, chemical, shipbuilding, machinery, and other applications, and in extreme environments, and the like.

USE OF LOW-SPARKING MATERIAL WHEN HANDLING BULK GOODS

The invention relates to an apparatus for handling bulk material which contains fines which can lead to formation of explosive dust/air mixtures, where the apparatus comprises moveable internals in a housing which comes into contact with bulk material, characterized in that the moveable internals and/or the interior of the housing which comes into contact with bulk material consist of aluminum bronzes or are lined and/or coated with the aluminum bronzes.

A COATED METALLIC SUBSTRATE AND FABRICATION METHOD

A coated metallic substrate is provided, including, at least; one layer of oxides, such layer being directly topped by an intermediate coating layer comprising Fe, Ni, Cr and Ti wherein the amount of Ti is above or equal to 5 wt. % and wherein the following equation is satisfied: 8 wt. %<Cr+Ti<40 wt. %, the balance being Fe and Ni, such intermediate coating layer being directly topped by a coating layer being an anticorrosion metallic coating.

Cu core ball, solder joint, solder paste and formed solder

The Cu core ball contains a Cu ball and one or more metal layer for covering a surface of the Cu ball, each layer including one or more element selected from Ni, Co, Fe and Pd. The Cu ball contains at least one element selected from Fe, Ag, and Ni in a total amount of 5.0 or more to 50.0 ppm by mass or lower, S in an amount of 0 ppm by mass or more to 1.0 ppm by mass or lower, P in an amount of 0 ppm by mass or more to less than 3.0 ppm by mass, and remainder of Cu and inevitable impurities. The Cu ball contains purity which is 99.995% by mass or higher and 99.9995% or lower, sphericity which is 0.95 or higher and a diameter of 1 m or more to 1000 m or lower.