Y10T428/12924

Method for manufacturing clad material
10953630 · 2021-03-23 · ·

A clad material includes a first layer made of stainless steel and a second layer made of Cu or a Cu alloy and roll-bonded to the first layer. In the clad material, a grain size of the second layer measured by a comparison method of JIS H 0501 is 0.150 mm or less.

Methods and systems for slurry coating

The present disclosure provides systems and methods that employ slurries to form layers adjacent to substrates. Such layers can include, for example, one or more of iron, chromium, nickel, silicon, vanadium, titanium, boron, tungsten, aluminum, molybdenum, cobalt, manganese, zirconium, and niobium, oxides thereof, nitrides thereof, sulfides thereof, or combinations thereof. In some examples, such layers are stainless steel layers.

METAL COMPOSITE WIRE

The present invention discloses a metal composite wire capable of increasing a tightness degree of copper-aluminum bonding. The metal composite wire includes a metal core rod. Continuous spiral grooves are formed in a surface of the core rod The core rod is cladded with a metal cladding layer with higher electrical conductivity than the core rod. An average depth of the continuous spiral grooves 1/10 of a thickness of the metal cladding layer. By setting the thickness of the metal cladding layer as t.sub.1, a specific gravity of the metal cladding layer as.sub.1, a diameter of the core rod as R, the average depth of the continuous spiral grooves as h, and a specific gravity of the core rod as .sub.2,

[00001] t 1 = ( R - h ) 2 1 + k ( R - h ) 2 2 - k ( R - h ) 2 1 ( 1 - k ) 1 + h - R .Math. .Math. and 0.2 k 0.7 .

The metal composite wire of the present invention can be widely applied to cable conductors and cable shielding braiding layers.

Metal foil for electromagnetic shielding, electromagnetic shielding material, and shielding cable

A metal foil for electromagnetic shielding, comprising: a metal foil base having a thickness of exceeding 4 m, an alloy layer having an A element configured of Sn or In and a B element group selected from the group consisting of one or more of Ag, Ni, Fe and Co formed on one or both surfaces of the base, and an underlayer having the B element group formed between the alloy layer and the base, wherein an adhesion amount of the A element is 10 to 300 mol/dm.sup.2, and a total adhesion amount of the B element group is 40 to 900 mol/dm.sup.2.

FRICTION MATERIAL
20200309221 · 2020-10-01 · ·

A friction material comprises an Fe part which contains Fe as a main component, a coating layer formed on a surface of the Fe part, and a friction part formed on a surface of at least a part of the coating layer, and the coating layer comprises a first coating layer and a second coating layer which have a specific average thickness and a specific component in order from Fe part side, and in the second coating layer, in order of positions at which the thickness is 20%, 40%, 60% and 80% of the second coating layer from the side of the first coating layer to the side opposite thereto, a Cu content increases and a Ni content decreases.

Low nickel, multiple layer laminate system

A multiple layer metallic laminate having more desirable electrical properties as compared to known embodiments includes multiple layers of metallic sheets clad together. The multiple layer laminate composite includes at least a first metallic layer having good soldering properties, such as commercially available nickel or nickel alloys, a second metallic layer having good resistance welding properties, such as commercial available steels or stainless steels, a third metallic layer having low electrical resistivity properties, such as commercially available copper and copper alloys, a fourth metallic layer have good resistance welding properties, such as commercially available steels or stainless steels, and a fifth metallic layer having good soldering properties, such as commercially available nickel or nickel alloys.

FABRICATION METHOD FOR A MULTI-LAYER SUBSTRATE

A method for fabricating a substrate provided with a plurality of layers, includes: providing a steel substrate with an oxide layer including metal oxides on the steel substrate; providing a metal coating layer directly on the oxide layer, the metal coating layer including: at least 8% by weight nickel; at least 10% by weight chromium; and a remainder being iron and impurities from a fabrication process; and providing an anti-corrosion coating layer directly on the metal coating layer.

Methods for the production of clad steel products

Billets and methods for manufacturing them are disclosed. The billets include a cladding member including an alloy selected from the group including stainless steel, nickel-chrome, nickel-copper, and copper-nickel alloys, and a steel body that is positioned so that it has an interface with the cladding member, the steel body having a formation in which the scavenging metal is located and elements being provided for separating the scavenging metal from the cladding member at the interface.

A COATED METALLIC SUBSTRATE AND FABRICATION METHOD

A coated metallic substrate is provided, including, at least; one layer of oxides, such layer being directly topped by an intermediate coating layer comprising Fe, Ni, Cr and Ti wherein the amount of Ti is above or equal to 5 wt. % and wherein the following equation is satisfied: 8 wt. %<Cr+Ti<40 wt. %, the balance being Fe and Ni, such intermediate coating layer being directly topped by a coating layer being an anticorrosion metallic coating.

Cu core ball, solder joint, solder paste and formed solder

The Cu core ball contains a Cu ball and one or more metal layer for covering a surface of the Cu ball, each layer including one or more element selected from Ni, Co, Fe and Pd. The Cu ball contains at least one element selected from Fe, Ag, and Ni in a total amount of 5.0 or more to 50.0 ppm by mass or lower, S in an amount of 0 ppm by mass or more to 1.0 ppm by mass or lower, P in an amount of 0 ppm by mass or more to less than 3.0 ppm by mass, and remainder of Cu and inevitable impurities. The Cu ball contains purity which is 99.995% by mass or higher and 99.9995% or lower, sphericity which is 0.95 or higher and a diameter of 1 m or more to 1000 m or lower.