An air-solution regeneration device is provided for providing equalization of the vapor pressure of a solution, which exists in a solution chamber, to the vapor pressure of the air which exists in the medium. Accordingly, the subject matter air-solution regeneration device comprises a solution pump for increasing the pressure of the solution which exists in said solution chamber; an air-solution injector which is in venturi type and which has a drive end which receives the solution, having increased pressure, as input, a suction end for realizing air suctioning when there is liquid input, having increased pressure, through the drive end, a spray end where the solution, received from said drive end, and the air, suctioned from said suction end, are sprayed; an electrostatic filter where the air-solution mixture is sprayed; and an air-solution separator which has a centrifuge unit for providing separation of the air-solution mixture, and an output chamber.

An air-solution regeneration device is provided for providing equalization of the vapor pressure of a solution, which exists in a solution chamber, to the vapor pressure of the air which exists in the medium. Accordingly, the subject matter air-solution regeneration device comprises a solution pump for increasing the pressure of the solution which exists in said solution chamber; an air-solution injector which is in venturi type and which has a drive end which receives the solution, having increased pressure, as input, a suction end for realizing air suctioning when there is liquid input, having increased pressure, through the drive end, a spray end where the solution, received from said drive end, and the air, suctioned from said suction end, are sprayed; an electrostatic filter where the air-solution mixture is sprayed; and an air-solution separator which has a centrifuge unit for providing separation of the air-solution mixture, and an output chamber.

Disclosed is a method for the removal of soluble particulate matter from a gas stream, such as urea dust from the off-gas of a finishing section of a urea production plant. The method comprises subjecting the off-gas to at least two quenching stages an aqueous quenching liquid. The quenching liquid used in a first, upstream quench stage, is allowed to have a higher concentration of dissolved particulate matter than the quenching liquid in the second, downstream quench stage. The quenched gas is led through a particle capture zone, typically comprising one or more of a wet scrubber, a Venturi scrubber, and a wet electrostatic precipitator.

Disclosed is a method for the removal of soluble particulate matter from a gas stream, such as urea dust from the off-gas of a finishing section of a urea production plant. The method comprises subjecting the off-gas to at least two quenching stages an aqueous quenching liquid. The quenching liquid used in a first, upstream quench stage, is allowed to have a higher concentration of dissolved particulate matter than the quenching liquid in the second, downstream quench stage. The quenched gas is led through a particle capture zone, typically comprising one or more of a wet scrubber, a Venturi scrubber, and a wet electrostatic precipitator.

A system and method for processing unconditioned syngas first removes solids and semi-volatile organic compounds (SVOC), then removes volatile organic compounds (VOC), and then removes at least one sulfur containing compound from the syngas. Additional processing may be performed depending on such factors as the source of syngas being processed, the products, byproducts and intermediate products desired to be formed, captured or recycled and environmental considerations.

A system and method for processing unconditioned syngas first removes solids and semi-volatile organic compounds (SVOC), then removes volatile organic compounds (VOC), and then removes at least one sulfur containing compound from the syngas. Additional processing may be performed depending on such factors as the source of syngas being processed, the products, byproducts and intermediate products desired to be formed, captured or recycled and environmental considerations.

Disclosed is a method for the removal of soluble particulate matter from a gas stream, such as urea dust from the off-gas of a finishing section of a urea production plant. The method comprises subjecting the off-gas to at least two quenching stages an aqueous quenching liquid. The quenching liquid used in a first, upstream quench stage, is allowed to have a higher concentration of dissolved particulate matter than the quenching liquid in the second, downstream quench stage. The quenched gas is led through a particle capture zone, typically comprising one or more of a wet scrubber, a Venturi scrubber, and a wet electrostatic precipitator.

Disclosed is a method for the removal of soluble particulate matter from a gas stream, such as urea dust from the off-gas of a finishing section of a urea production plant. The method comprises subjecting the off-gas to at least two quenching stages an aqueous quenching liquid. The quenching liquid used in a first, upstream quench stage, is allowed to have a higher concentration of dissolved particulate matter than the quenching liquid in the second, downstream quench stage. The quenched gas is led through a particle capture zone, typically comprising one or more of a wet scrubber, a Venturi scrubber, and a wet electrostatic precipitator.

A semiconductor waste abatement system for a semiconductor processing system includes a vacuum pump, an abatement apparatus having an abatement chamber in fluid communication with a source of semiconductor waste gas from the semiconductor processing chamber, and with the abatement chamber configured to ionize the waste gas and to exhaust ionized gas. The abatement system further includes a filter apparatus with a filter chamber, which forms a liquid reservoir. The inlet of the filter apparatus is in fluid communication with the outlet of the abatement chamber and the liquid reservoir, and the outlet of the filter apparatus is in communication with the inlet of the vacuum pump, wherein the filter chamber is under a vacuum, and wherein semiconductor waste gas is ionized in the abatement chamber and then filtered by the filter apparatus prior to input to the vacuum pump.

A semiconductor waste abatement system for a semiconductor processing system includes a vacuum pump, an abatement apparatus having an abatement chamber in fluid communication with a source of semiconductor waste gas from the semiconductor processing chamber, and with the abatement chamber configured to ionize the waste gas and to exhaust ionized gas. The abatement system further includes a filter apparatus with a filter chamber, which forms a liquid reservoir. The inlet of the filter apparatus is in fluid communication with the outlet of the abatement chamber and the liquid reservoir, and the outlet of the filter apparatus is in communication with the inlet of the vacuum pump, wherein the filter chamber is under a vacuum, and wherein semiconductor waste gas is ionized in the abatement chamber and then filtered by the filter apparatus prior to input to the vacuum pump.