The present disclosure provides an exhaust system for discharging from semiconductor manufacturing equipment a hazardous gas. The exhaust system includes: a main exhaust pipe having a top surface and a bottom surface; a first branch pipe including an upstream end coupled to a source of a gas mixture containing the hazardous gas and a downstream end connected to the main exhaust pipe through the top surface; a second branch pipe including a downstream end connected to the main exhaust pipe through the bottom surface; and a detector configured to detect presence of the hazardous gas in the second branch pipe.

Various embodiments of the present disclosure can include a system for filtering of contaminated fluid. The system can include a fiber manufacturing plant. The system can include a filter system which utilizes a fiber filter produced in the fiber manufacturing plant to clean and recycle a contaminated fluid.

To adsorb a substance to be treated in a fluid (7) with a higher adsorption capacity and lower pressure loss, an adsorptive sintered compact (20) includes powder adsorbent materials (1a, 1b), and resin structures (2) in which voids (3) are formed in a three-dimensional network. The powder adsorbent materials (1a, 1b) include free adsorbent materials (1a) free-movably contained in the voids (3) between the resin structures (2), and fixed adsorbent materials (1b) fixed to a surface (2a) of the resin structure (2) and/or at least partly embedded inside the resin structure (2), and the powder adsorbent materials (1a, 1b) are at least one of powdered activated carbon, powdered activated clay, and zeolite.

An adsorbent composition comprises a bismuth material, a promoter and optionally a support. The adsorbent composition is suitable for adsorbing an arsenic material, such as arsine, from a process stream.

A system for treating ethylene oxide-containing sterilization exhaust gas comprises a reaction column further comprising a column body, and an inner cavity configured to contain a liquid substrate for catalyzing ethylene oxide in ethylene oxide-containing sterilization exhaust gas; wherein the column body comprises a bottom portion having a gas inlet pipe and a liquid outlet pipe, the gas inlet pipe configured to inject the ethylene oxide-containing sterilization exhaust gas into the inner cavity and the liquid outlet pipe configured to discharge the liquid substrate from the inner cavity; and wherein, the column body comprises a top portion comprising a gas outlet pipe having a gas inlet above a liquid level of the liquid substrate; and at least one gas distributor configured to disperse the ethylene oxide-containing sterilization exhaust gas injected from the gas inlet pipe into the inner cavity.

Embodiments of the present disclosure include methods and systems of circulating air in an enclosed environment. In such embodiments, the system may comprise an air handling unit (AHU), the AHU including an indoor air inlet to receive an indoor airflow from the enclosed environment and an indoor air outlet to expel the indoor airflow, a conditioning element arranged between the inlet and the outlet configured to at least heat or cool the indoor airflow as it flows thereover, one or more fan units arranged between the inlet and the outlet configured to provide velocity to the indoor airflow, and an air treatment assembly (ATA) arranged within or proximate the AHD, the ATA including an air inlet configured to receive a portion of the indoor airflow received by the AHU indoor air inlet.

An air treatment unit may include an air inlet to receive a flow of input air for treatment and a reaction reservoir configured to hold an aqueous air treatment solution. The air treatment unit may also include an air dispersing element flow connected with the air inlet, wherein the air dispersing element is configured to convert at least a portion of the flow of input air into a plurality of microbubbles for introduction into the aqueous air treatment solution, such that an amount of one or more target gas species contained within the plurality of microbubbles is reduced through reaction with the aqueous air treatment solution. The unit may include an air outlet configured to output treated air from the reaction reservoir.

A method of adsorbing a highly reactive gas onto an adsorbent material comprising adsorbing the highly reactive gas to the adsorbent material. The absorbent material comprises at least one Lewis basic functional group, or pores of a size to hold a single molecule of the highly reactive gas, or inert moieties which are provided to the adsorbent material at the same time at the same time as the highly reactive gas, prior to adsorbing the highly reactive gas or after adsorbing the highly reactive gas, or the highly reactive gas reacts with moieties of the adsorbent material resulting in passivation of the adsorbent material. A rate of decomposition of the adsorbed highly reactive gas is lower than a rate of decomposition for the neat gas at equal volumetric loadings and equal temperatures for both the adsorbed highly reactive gas and the neat gas.

The present disclosure provides an exhaust system for discharging from semiconductor manufacturing equipment a hazardous gas. The exhaust system includes: a main exhaust pipe having a top surface and a bottom surface; a first branch pipe including an upstream end coupled to a source of a gas mixture containing the hazardous gas and a downstream end connected to the main exhaust pipe through the top surface; a second branch pipe including a downstream end connected to the main exhaust pipe through the bottom surface; and a detector configured to detect presence of the hazardous gas in the second branch pipe.

A gas trap system for metal organic chemical vapor deposition (MOCVD) exhaust abatement operations is provided. The gas trap system may include a housing including an inlet configured to receive exhaust gas and an outlet. The gas trap system may also include a conical inlet shield positioned within the housing. The conical inlet shield may form a first path between the housing and the conical inlet shield, wherein the first path receives the exhaust gas from the inlet. The conical inlet shield may also cool the exhaust gas and cause the exhaust gas to be uniformly distributed in the first path. The gas trap system may also include a filter configured to receive the exhaust gas from the first path and to filter the exhaust gas, wherein the filtered gas exhaust is provided to the outlet.