Exemplary modular gas blocks may include a body having inlet and outlet ends. The body may define a portion of a first gas path along a length of the body and may define a second gas path along a width of the body. The first gas path may include channel segments defined within the body. The inlet end may define a gas inlet that is coupled with the first gas path. The body may define first fluid ports that are coupled with the first gas path. A fluid port of the first fluid ports may be coupled with the gas inlet. The first fluid ports may be coupled with one another via a respective channel segment. An upper surface may define a lateral fluid port that is spaced apart from a first fluid port along the width and is coupled with the first fluid port via the second gas path.

A chemical liquid exchange method includes: recovering, by a first recycling tank, a first portion of a first chemical liquid that was previously used in a chamber; recovering, by a second recycling tank, a second portion of the first chemical liquid that was previously used in the chamber; supplying, from the first recycling tank, the first portion of the first chemical liquid to a first sub-tank; draining, from the second recycling tank, the second portion of the first chemical liquid; supplying, from the first sub-tank, the first portion of the first chemical liquid to a main tank; and receiving, by a second sub-tank, a second chemical liquid from an outside; and supplying, from the second sub-tank, the second chemical liquid to the main tank.

A liquid delivering system for wafer cleaning equipment includes an acid scouring tank, a sulfuric acid supplying source, a hydrogen peroxide supplying source, a first mixing device, a second mixing device and a feedback-control panel. The first mixing device and the second mixing device both includes a mixing duct, a multi-section mixing screw rod arranged inside the mixing duct and a heater wrapped around the mixing duct. By ways of adopting the above-mentioned technical solution, it is possible to realize fully mixing sulfuric acid with hydrogen peroxide in a mode of mixing in multi-stages, achieve precise control to temperature, and enable mixed liquid to fully react, thereby ensuring that the mixed liquid coming into the acid scouring tank meets cleaning requirements, and improving quality and efficiency of cleaning wafers.

A liquid delivering system for wafer cleaning equipment includes an acid scouring tank, a sulfuric acid supplying source, a hydrogen peroxide supplying source, a first mixing device, a second mixing device and a feedback-control panel. The first mixing device and the second mixing device both includes a mixing duct, a multi-section mixing screw rod arranged inside the mixing duct and a heater wrapped around the mixing duct. By ways of adopting the above-mentioned technical solution, it is possible to realize fully mixing sulfuric acid with hydrogen peroxide in a mode of mixing in multi-stages, achieve precise control to temperature, and enable mixed liquid to fully react, thereby ensuring that the mixed liquid coming into the acid scouring tank meets cleaning requirements, and improving quality and efficiency of cleaning wafers.

A chemical liquid preparation method of preparing a TMAH-containing chemical liquid, including, a correspondence relationship preparing step of preparing a correspondence relationship between a supply flow rate ratio between an oxygen-containing gas and an inert-gas-containing gas and a convergent dissolved oxygen concentration in the TMAH-containing chemical liquid that is converged to when the oxygen-containing gas and the inert-gas-containing gas are supplied into the TMAH-containing chemical liquid; a concentration setting step of setting a target dissolved oxygen concentration in the TMAH-containing chemical liquid; a supply-flow-rate-ratio acquiring step of acquiring the supply flow rate ratio between the oxygen-containing gas and the inert-gas-containing gas corresponding to the target dissolved oxygen concentration in accordance with the correspondence relationship prepared in the correspondence relationship preparing step; and a gas supplying step of supplying the oxygen-containing gas and the inert-gas-containing gas with the supply flow rate ratio acquired in the supply-flow-rate-ratio acquiring step.

Exemplary modular gas blocks may include a body having inlet and outlet ends. The body may define a portion of a first gas path along a length of the body and may define a second gas path along a width of the body. The first gas path may include channel segments defined within the body. The inlet end may define a gas inlet that is coupled with the first gas path. The body may define first fluid ports that are coupled with the first gas path. A fluid port of the first fluid ports may be coupled with the gas inlet. The first fluid ports may be coupled with one another via a respective channel segment. An upper surface may define a lateral fluid port that is spaced apart from a first fluid port along the width and is coupled with the first fluid port via the second gas path.

A substrate cleaning method, including a step of transporting a substrate after the substrate has been polished; a step of holding the substrate substantially horizontally by a substrate holding portion; a step of scrub cleaning a lower surface of the substrate while rotating the substrate; a first step of, after the step of scrub cleaning is performed, supplying a chemical solution from a first nozzle to the lower surface of the substrate while rotating the substrate; and a second step of, after the first step is performed, supplying a bubble-containing pure water from a second nozzle to the lower surface of the substrate while rotating the substrate, wherein bubbles contained in the bubble-containing pure water have bubble diameters of 1 m or more and 500 m or less.

Dilute chemical solution production device (1) has a plunger pump and a chemical solution supply pipe (3) that supply a chemical solution S from a chemical solution reservoir. The end of the chemical solution supply pipe (3) serves as an injection point 11 for the chemical solution (S). The chemical solution supply pipe (3) is inserted to an approximately central position in the radial direction of an ultrapure water passage (12), which is a first pipe, via a bore-through joint (13). Conductivity meter (14) as a conductivity measuring meter is provided on the downstream side of the bore-through joint (13), which serves as the injection point (11), and is connected to a controller so that the plunger pump (4) can be controlled in accordance with the measured value of the conductivity meter (14).

The present disclosure relates to systems and methods for gas injected chemistry for single wafer processing. An example method includes generating, by a gas generator, a gas. The method also includes mixing, in a mixing tank, a gas-enriched chemical mixture comprising the gas and a chemical mixture. The method also includes dispensing, via a sample chamber, a dispensed volume of the gas-enriched chemical mixture onto the substrate. The method also includes returning a spent volume of the gas-enriched chemical mixture to the mixing tank.

The present disclosure is directed to various methods and systems for monitoring real time efficiency of filters as well as testing the filters with tests that are similar to real world use of the filters to update technical specifications of the filters. The methods and systems monitoring the real time efficiency of the filters may utilize one or more particle counters to monitor their efficiency in real time. The data collected by the particle counters may be utilized to determine whether respective ones of the filters need to be replaced or regenerated by a backwash regeneration process. The updated technical specifications from the real world testing of the filters may be utilized in determining whether respective ones of the filters need to be replaced or regenerated. These real world testing and real time monitoring reduces the likelihood that workpieces are exposed to contaminant particles reducing scrap costs.