A hair-penetrating multi-point spraying apparatus for animals with thick fur according to an embodiment of the present invention comprises: a fluid storage part for storing a fluid; a nozzle part provided so as to spray the fluid in close proximity to the skin of an animal with thick fur by means of a plurality of nozzles; and a spraying tool part for supplying the fluid in the fluid storage part to the nozzle part by pumping, The nozzle part has: a plurality of comb teeth for brushing the fur of an animal with thick fur; and a plurality of comb-teeth end nozzles protruding in the form of comb teeth so as to spray a fluid on the skin beneath the fur of the animal with thick fur.

Disclosed is a mist maker featuring forced airflow to reduce moisture condensation and/or featuring airflow drifting, including: a hollow water-proof housing, a base, a atomizer, and an air blowing device, the base being disposed at the hollow water-proof housing, an accommodation space for accommodating an essential oil water solution, the atomizer being configured to atomize the essential oil water solution to form a mist; the air blowing device produces a forced airflow to push the mist; in further conjunction with a miniaturized landscape zone, a special profile is created; the forced airflow produced by the air blowing device is discharged radially via the air vents in the hollow water-proof housing, thereby carrying the mist overflowing out of the flow zone farther away to avoid mist accumulation around the mist maker and thus avoids water accumulation caused by mist condensation.

Disclosed is a mist maker featuring forced airflow to reduce moisture condensation and/or featuring airflow drifting, including: a hollow water-proof housing, a base, a atomizer, and an air blowing device, the base being disposed at the hollow water-proof housing, an accommodation space for accommodating an essential oil water solution, the atomizer being configured to atomize the essential oil water solution to form a mist; the air blowing device produces a forced airflow to push the mist; in further conjunction with a miniaturized landscape zone, a special profile is created; the forced airflow produced by the air blowing device is discharged radially via the air vents in the hollow water-proof housing, thereby carrying the mist overflowing out of the flow zone farther away to avoid mist accumulation around the mist maker and thus avoids water accumulation caused by mist condensation.

A substrate processing apparatus includes: a rotary holder configured to hold and rotate a substrate; a liquid supplier including a nozzle that ejects a processing liquid; a driver configured to move the nozzle between a center of the substrate and a peripheral portion of the substrate; and a controller configured to: execute a supply control to supply the processing liquid to the surface of the substrate so as to form a supply trajectory in a spiral shape, by ejecting the processing liquid from the nozzle while rotating the substrate and moving the nozzle from the center of the substrate toward the peripheral portion of the substrate; and when executing the supply control, gradually reduce an ejection amount of the processing liquid per unit area on the surface of the substrate, at least in a portion forming an outermost periphery of the supply trajectory.

A substrate processing apparatus includes: a rotary holder configured to hold and rotate a substrate; a liquid supplier including a nozzle that ejects a processing liquid; a driver configured to move the nozzle between a center of the substrate and a peripheral portion of the substrate; and a controller configured to: execute a supply control to supply the processing liquid to the surface of the substrate so as to form a supply trajectory in a spiral shape, by ejecting the processing liquid from the nozzle while rotating the substrate and moving the nozzle from the center of the substrate toward the peripheral portion of the substrate; and when executing the supply control, gradually reduce an ejection amount of the processing liquid per unit area on the surface of the substrate, at least in a portion forming an outermost periphery of the supply trajectory.

According to some illustrative embodiments, an angularly adjustable spray nozzle is employed that includes: a base section having a water flow path extending lengthwise there-through; a head section aligned at an end of the base section and rotatably mounted to the base section; wherein a flow path through the base section is inclined at an angle to a flow path through the head section such that when the head section is rotated a predetermined extent relative to the base section, the spray device is moved between a substantially straight configuration of the head section with respect to the base section and an angular configuration of the head section with respect to the base section; wherein the head section includes a rotatable turret assembly having a plurality of selectable spray type discharge ports and a sleeve to which the rotatable turret assembly is mounted, the rotatable turret assembly including labels on a periphery thereof corresponding to respective ones of the selectable spray type discharge ports, and the sleeve having a plurality of windows through which the labels are viewed when aligned; and wherein the spray device is configured such that when the spray device is oriented in a generally horizontal use position a respective one of the labels corresponding to a selected spray type is displayed within a respective one of the windows that is located at a top side of the sleeve whether the spray device is in the substantially straight configuration or in the angular configuration.

An aperture plate is manufactured by plating metal around a mask of resist columns having a desired size, pitch, and profile, which yields a wafer about 60 μm thickness. This is approximately the full desired target aperture plate thickness. The plating is continued so that the metal overlies the top surfaces of the columns until the desired apertures are achieved. This needs only one masking/plating cycle to achieve the desired plate thickness. Also, the plate has passageways formed beneath the apertures, formed as an integral part of the method, by mask material removal. These are suitable for entrainment of aerosolized droplets exiting the apertures.

An aperture plate is manufactured by plating metal around a mask of resist columns having a desired size, pitch, and profile, which yields a wafer about 60 μm thickness. This is approximately the full desired target aperture plate thickness. The plating is continued so that the metal overlies the top surfaces of the columns until the desired apertures are achieved. This needs only one masking/plating cycle to achieve the desired plate thickness. Also, the plate has passageways formed beneath the apertures, formed as an integral part of the method, by mask material removal. These are suitable for entrainment of aerosolized droplets exiting the apertures.

A system for applying a first coating composition and a second coating composition. The system includes a first high transfer efficiency applicator defining a first nozzle orifice and a second high transfer efficiency applicator defining a second nozzle orifice. The system further includes a substrate defining a target area. The first high transfer efficiency applicator is configured to expel the first coating composition through the first nozzle orifice to the target area of the substrate to form a first coating layer. The second high transfer efficiency applicator is configured to expel the second coating composition through the second nozzle orifice to the first coating layer to form a second coating layer.

A system for applying a first coating composition and a second coating composition. The system includes a first high transfer efficiency applicator defining a first nozzle orifice and a second high transfer efficiency applicator defining a second nozzle orifice. The system further includes a substrate defining a target area. The first high transfer efficiency applicator is configured to expel the first coating composition through the first nozzle orifice to the target area of the substrate to form a first coating layer. The second high transfer efficiency applicator is configured to expel the second coating composition through the second nozzle orifice to the first coating layer to form a second coating layer.