A substrate processing apparatus includes a cover member placed to surround a substrate held by a rotary holder; a collecting member placed in an exhaust path formed between the cover member and the rotary holder; and a solvent supply placed above the collecting member and configured to supply a solvent to the collecting member. The solvent supply includes an inner storage space surrounding the substrate; an outer storage space surrounding the inner storage space; and a partition wall extending along a circumferential direction to partition the inner storage space and the outer storage space. Multiple communication holes are extended to penetrate the partition wall such that the solvent introduced into the outer storage space flows to the inner storage space. Multiple dripping holes are extended to penetrate a bottom wall of the inner storage space such that the solvent within the inner storage space drops toward the collecting member.

The invention provides a sanitization booth 10 has side walls 12 approximately twice as long as it's entrance and exit openings 14, 16 are wide to permit a person to step into the booth and pass therethrough while being sprayed or misted with a sanitization or disinfection liquid, from above 18, below 20, and the sides 22 by liquid sanitizer pumped through a reticulation pipe system 24 and through nozzles 26 along the extent thereof, thereby to sanitize the person, their clothing, as well as their footwear including the soles thereof. The booth 10 includes a hand sanitization point 28 at the entrance 14 to the booth 10 so that the person who has been sanitized by passing through the booth also sanitizes their hands which have been used to cover their eyes while in the booth. The invention also provides a sanitization system and a kit for assembly of a sanitization apparatus.

The invention provides a sanitization booth 10 has side walls 12 approximately twice as long as it's entrance and exit openings 14, 16 are wide to permit a person to step into the booth and pass therethrough while being sprayed or misted with a sanitization or disinfection liquid, from above 18, below 20, and the sides 22 by liquid sanitizer pumped through a reticulation pipe system 24 and through nozzles 26 along the extent thereof, thereby to sanitize the person, their clothing, as well as their footwear including the soles thereof. The booth 10 includes a hand sanitization point 28 at the entrance 14 to the booth 10 so that the person who has been sanitized by passing through the booth also sanitizes their hands which have been used to cover their eyes while in the booth. The invention also provides a sanitization system and a kit for assembly of a sanitization apparatus.

A link chain cleaning and lubricating device, and lubricants for use therein.

Provided is a substrate processing apparatus. The substrate processing apparatus includes a swing nozzle that is arranged on one side of the support module, moves in a swing manner, and sprays a chemical solution to the substrate, a sensor arranged on one side of the swing nozzle to sense movement of the swing nozzle, an electromagnet and a magnet installed on the other side of the swing nozzle so as to be able to adjust spacing relative to each other, and a controller for receiving a sensing result of the sensor and performing a damping operation to the swing nozzle by providing power to the electromagnet to generate an attractive force or repulsive force between the electromagnet and the magnet.

A paint supply system includes: a paint supply pump; a paint tank connected to an inlet of the paint supply pump; a paint feed path connected to an outlet of the paint supply pump to feed paint to the coating machine; a paint return path configured to return the paint from the coating machine to the paint tank; and a control apparatus configured to exert feedback control on a discharge amount of the paint supply pump using control parameter values recorded on a table. On the table, the control parameter values are recorded as being classified under a plurality of levels so that the pressure of the paint at a predetermined specified location attains a target pressure more quickly when the pressure of the paint at the specified location is outside a first pressure range including the target pressure than when falling within the first pressure range.

A paint supply system includes: a paint supply pump; a paint tank connected to an inlet of the paint supply pump; a paint feed path connected to an outlet of the paint supply pump to feed paint to the coating machine; a paint return path configured to return the paint from the coating machine to the paint tank; and a control apparatus configured to exert feedback control on a discharge amount of the paint supply pump using control parameter values recorded on a table. On the table, the control parameter values are recorded as being classified under a plurality of levels so that the pressure of the paint at a predetermined specified location attains a target pressure more quickly when the pressure of the paint at the specified location is outside a first pressure range including the target pressure than when falling within the first pressure range.

A substrate processing apparatus includes a processing liquid supply mechanism 70 configured to supply a SPM liquid to a substrate; a temperature adjusting unit (heater) 303 configured to adjust a temperature of the SPM liquid at a time when the SPM liquid is supplied to the substrate from the processing liquid supply mechanism 70; an acquisition unit (temperature sensor) 80 configured to acquire temperature information of the SPM liquid on a surface of the substrate; and a control unit 18 configured to set an adjustment amount of the temperature adjusting unit (heater) 303 based on the temperature information of the SPM liquid acquired by the acquisition unit (temperature sensor) 80. The temperature adjusting unit (heater) 303 adjusts, based on the adjustment amount set by the control unit 18, the temperature of the SPM liquid at the time when the SPM liquid is supplied to the substrate.

A substrate processing apparatus includes a processing liquid supply mechanism 70 configured to supply a SPM liquid to a substrate; a temperature adjusting unit (heater) 303 configured to adjust a temperature of the SPM liquid at a time when the SPM liquid is supplied to the substrate from the processing liquid supply mechanism 70; an acquisition unit (temperature sensor) 80 configured to acquire temperature information of the SPM liquid on a surface of the substrate; and a control unit 18 configured to set an adjustment amount of the temperature adjusting unit (heater) 303 based on the temperature information of the SPM liquid acquired by the acquisition unit (temperature sensor) 80. The temperature adjusting unit (heater) 303 adjusts, based on the adjustment amount set by the control unit 18, the temperature of the SPM liquid at the time when the SPM liquid is supplied to the substrate.

A shower head water collecting device includes a water collecting hanging component, a temperature sensing element, an assembling component, a solar panel, and a temperature displaying element. The water collecting hanging component is provided for a shower head to be hung thereon and collects the water spraying from the shower head. The temperature sensing element is disposed inside the water collecting hanging component to sense the temperature of water spraying from the shower head. The assembling component is mounted on top of the water collecting hanging component. The solar panel and the temperature displaying element are disposed in the assembling component. The solar panel is electrically connected to the temperature sensing element and the temperature displaying element, wherein the solar panel harvests the light energy from the outside and converts it into electrical energy to supply power to the temperature sensing element and the temperature displaying element.