A dipping apparatus includes a squeegee device and a plate for forming a flux film out of flux. A surface of the plate has a rough surface with a nano-level arithmetically average roughness. The dipping apparatus is configured in such a way that the squeegee device and the plate are moved relatively to each other, and the flux is fed from the squeegee device to the rough surface of the plate.

A production device for a production of thermoset semifinished products comprises at least one material application unit (12) for applying a material (14) to a carrier element (16), wherein the production device further comprises at least one recording unit (18), which has at least one sensor element (20), for recording a thickness (22) of the material (14) applied to the carrier element (16).

Provided is an adhesive application system configured to apply a necessary and sufficient amount of an adhesive to a thin steel strip without causing an increase in the equipment cost. The adhesive application system comprises an adhesive application device having adhesive dispensing nozzles (26, 27) for dispensing an adhesive to an adhesive application surface of a thin steel strip; a mechanism configured to elevate and lower the adhesive application device; and adhesive supply ports (17, 18) for supplying the adhesive at a predetermined pressure to the adhesive application device, wherein the adhesive application device has an end face that is to be brought into abutment against the thin steel strip, and wherein outlets of the adhesive dispensing nozzles (26, 27) are spaced inwardly away from the end face of the adhesive application device so that the outlets of the adhesive dispensing nozzles (26, 27) are maintained at a predetermined distance from a lower surface of the thin steel strip.

An automatic wood flooring boards reparation device for applying and spreading filler over boards is provided, the device comprising an infeed unit, an outfeed unit and a filler applicator. The filler applicator applies filler over a top surface of the boards with a head comprising a main body, a spreading device and a bottom portion, each part comprising an opening for distributing filler over the board and an opening for securing a scrapper for spreading the applied filler. A tight seal is created between a filler applicator opening of the bottom portion and the top surface of the boards to avoid overspill of filler. A method for applying filler is also provided.

Device (10) for depositing particles via the liquid route including a first chamber a second chamber (12), a communication hole between the first chamber (11) and the second chamber (12), and a vent which is provided in the second chamber and which places the second chamber and a medium (200) which is external with respect to the device in communication.

Device (10) for depositing particles via the liquid route including a first chamber a second chamber (12), a communication hole between the first chamber (11) and the second chamber (12), and a vent which is provided in the second chamber and which places the second chamber and a medium (200) which is external with respect to the device in communication.

Provided is a device and a method for forming a metal plating film having a thick film thickness by a solid substitution-type electroless plating method. The present disclosure relates to a film formation device for forming a film of a first metal on a plating film of a second metal by a solid substitution-type electroless plating method, comprising: a conductive mounting base; a third metal; an insulating material; a microporous membrane; a plating bath chamber; and a pressing unit, wherein the third metal has an ionization tendency larger than ionization tendencies of the first metal and the second metal, and wherein the insulating material is installed between a base material and the third metal so as to contact respective materials of the base material and the third metal when the base material having the plating film of the second metal is installed.

Provided is a device and a method for forming a metal plating film having a thick film thickness by a solid substitution-type electroless plating method. The present disclosure relates to a film formation device for forming a film of a first metal on a plating film of a second metal by a solid substitution-type electroless plating method, comprising: a conductive mounting base; a third metal; an insulating material; a microporous membrane; a plating bath chamber; and a pressing unit, wherein the third metal has an ionization tendency larger than ionization tendencies of the first metal and the second metal, and wherein the insulating material is installed between a base material and the third metal so as to contact respective materials of the base material and the third metal when the base material having the plating film of the second metal is installed.

A device for coating a metal strip substrate includes a guiding apparatus for guiding the strip substrate along a movement path. A first coating apparatus coats a first main side of the strip substrate with an electrostatically charged coating powder which is in a fluidized state. The first coating apparatus is arranged under a first path section of the movement path. A second coating apparatus coats a second main side of the strip substrate with an electrostatically charged coating powder which is in a fluidized state. A redirecting unit redirects the strip substrate between the first and the second coating apparatus in such a way that the strip substrate in a second path section travels oppositely to the strip substrate in the first path section. The second coating apparatus is arranged at least partly geodetically under the second path section.

A sealing blade includes opposite elongated edges (30, 31) and between them a flat (32) and which is adaptable to a blade holder (17) arranged in a coating applicator (25) of a coating device (21) and into contact with a moving surface (11′). The sealing blade has a contact surface (33), which may be arranged against the moving surface and which is 5-15% of the width (W) of the sealing blade (10).