A method for controlling a recirculation pump assembly is disclosed. The method includes receiving a process-dependent characteristic and determining a recirculation flow rate of adhesive that flows to the recirculation pump assembly based on the process-dependent characteristic. The method further includes determining a recirculation pump speed of the recirculation pump assembly for pumping the adhesive to a supply channel using the recirculation flow rate, and adjusting an operating speed of the recirculation pump assembly to match the recirculation pump speed. A system and storage device for performing the above method are also disclosed.

An applicator system for applying a material to a substrate is disclosed, the applicator system having a nozzle assembly (28) that includes a nozzle having a nozzle head (108). The nozzle assembly (28) also includes a baffle plate (101) including a cutout (144) that extends through the baffle plate (101), where the baffle plate (101) is received by the nozzle head (108) such that the nozzle head (108) and the baffle plate (101) define a cavity. The nozzle assembly (28) further includes a cover plate (102) attached to the nozzle head (108) such that the cover plate (102) secures the baffle plate (101) within the nozzle head (128), where an outlet passage is defined between the baffle plate (101) and the cover plate (102), the outlet passage being fluidly connected to the cavity through the cutout (144) of the baffle plate (101).

Provided are systems for dispensing a filament adhesive. The dispensing systems include a dispensing head with a barrel including one or more heating elements, and a rotatable screw received in the barrel, the rotatable screw including at least one mixing element. An inlet extends through a side of the barrel for receiving the filament adhesive. An outlet at a distal end of the barrel for dispensing the filament adhesive in molten form. The dispensing system further includes a filament adhesive having a configuration to be received into the inlet of the dispensing head. Using the provided dispensing systems, and optionally with the assistance of a computer, adhesives can be precisely applied to pre-determined locations on a substrate.

A extrusion process and apparatus for the deposition of precise, usually small amounts of extrudate (4) for adhesion to a substrate (1) comprising an extruder (2) positioned close to the substrate (1) and a jet of hot gas (6) directed onto the extrudate (1) between the extruder (2) and the substrate (1) in order to retain the adhesive properties between the extrudate (4) and the substrate (1).

Provided are dispensing devices and methods for a filament adhesive. The dispensing devices use a barrel including one or more heating elements, and a rotatable screw received in the barrel, the rotatable screw optionally including at least one mixing element. An inlet extends through a side of the barrel for receiving the filament adhesive, the inlet including a beveled nip point to prevent breakage of the filament adhesive as it is drawn into the barrel. An outlet at a distal end of the barrel for dispensing the filament adhesive in molten form. Using the provided dispensing devices, and optionally with the assistance of a computer, adhesives can be precisely applied to pre-determined locations on a substrate.

An adhesive dispensing system for applying liquid adhesive to a substrate using different nozzles with the same manifold is disclosed. The adhesive dispensing system includes a manifold having a body, a first clamp configured to engage the body of the manifold, a second clamp configured to engage the body of the manifold, and a nozzle. The first and second clamps secure the nozzle to the body of the manifold. The body of the manifold has a first contact surface that engages the first clamp and a second contact surface that engages the second clamp and the nozzle, where the second contact surface is angularly offset from the first contact surface.

The invention relates to a dosing system (1) for a dosing material having a nozzle (40), a feed channel (44) for dosing material, a discharge element (31), an actuator unit (10) that is coupled to the discharge element (31) and/or the nozzle (40) and has a piezo actuator (60), and a cooling device (2). The cooling device (2) comprises a supply device (21, 24, 26) for feeding a precooled cooling medium into a housing (11) of the dosing system (1). The cooling device (2) is configured for direct cooling of at least one subregion of the piezo actuator (60) and/or at least one subregion of a movement mechanism (14) coupled to the piezo actuator (60) by means of the precooled cooling medium.

An applicator system for applying a material to a substrate is disclosed, the applicator system having a nozzle assembly that includes a nozzle having a nozzle head. The nozzle assembly also includes a baffle plate including a cutout that extends through the baffle plate, where the baffle plate is received by the nozzle head such that the nozzle head and the baffle plate define a cavity. The nozzle assembly further includes a cover plate attached to the nozzle head such that the cover plate secures the baffle plate within the nozzle head, where an outlet passage is defined between the baffle plate and the cover plate, the outlet passage being fluidly connected to the cavity through the cutout of the baffle plate.

A device (1) and method for the production of plastic parts (2), having a first plastic feed device (3a) for feeding a first liquid plastic starting component (K1); a second plastic feed device (3b) for feeding a second liquid plastic starting component (K2); a mixing device (5) with a mixing chamber (6), wherein in the mixing chamber the liquid plastic starting components that can be fed by the plastic feed devices can be mixed to form a plastic mixture (KG); a discharge nozzle (7) for discharging the plastic mixture; and a cooling device (8) for the mixing device, wherein a drying device (9) surrounding the mixing device at least in regions is provided, wherein the drying device has a separating device (10), a drying chamber (T) formed between the separating device and the mixing device, and a desiccant feeding device (11) opening into the drying chamber are disclosed.

Systems and methods that enable printing of conformal materials and other waterproof coating materials at high resolution. An initial printing of a material on edges of a component is performed at high resolution in a first printing step, and a subsequent printing of the material on remaining surfaces of the component is applied in a second printing step, with or without curing of the material printed on the edges between the two printing steps. The printing of the material may be performed by a laser-assisted deposition or using another dispensing system to achieve a high resolution printing of the material and a high printing speed.