Patent classifications
B05C9/04
Sealant system for metal seams
A sealant system for operation with a metal workpiece comprises a frame, a cam assembly mounted to the frame, a sealant reservoir, a sealant application unit connected to the sealant reservoir, and a control module for coordinating operation of the cam assembly and the sealant reservoir, wherein the control module comprises a temperature sensor for monitoring the temperature of the sealant, an integrated heating system for heating the sealant and a controller in communication with the temperature sensor and the integrated heating system.
Substrate processing apparatus
A substrate processing apparatus includes a chamber, a substrate holding part, a substrate rotating mechanism, and a processing liquid supply part. The chamber includes a chamber body and a chamber cover, and the chamber cover is moved up and down by a chamber opening and closing mechanism. A top plate is attached to the chamber cover. While the chamber cover is in contact with the chamber body, a sealed space is formed and processing is performed. When the chamber cover is moved up, an annular opening is formed between the chamber cover and the chamber body. A cup part is positioned outside the annular opening. A processing liquid spattering from a substrate is received by the cup part.
Substrate processing apparatus
A substrate processing apparatus includes a chamber, a substrate holding part, a substrate rotating mechanism, and a processing liquid supply part. The chamber includes a chamber body and a chamber cover, and the chamber cover is moved up and down by a chamber opening and closing mechanism. A top plate is attached to the chamber cover. While the chamber cover is in contact with the chamber body, a sealed space is formed and processing is performed. When the chamber cover is moved up, an annular opening is formed between the chamber cover and the chamber body. A cup part is positioned outside the annular opening. A processing liquid spattering from a substrate is received by the cup part.
Device and method for coating of a metallic strip substrate on one side and/or on both sides
A device for coating a metal strip substrate includes a guiding apparatus for guiding the strip substrate along a movement path. A first coating apparatus coats a first main side of the strip substrate with an electrostatically charged coating powder which is in a fluidized state. The first coating apparatus is arranged under a first path section of the movement path. A second coating apparatus coats a second main side of the strip substrate with an electrostatically charged coating powder which is in a fluidized state. A redirecting unit redirects the strip substrate between the first and the second coating apparatus in such a way that the strip substrate in a second path section travels oppositely to the strip substrate in the first path section. The second coating apparatus is arranged at least partly geodetically under the second path section.
Device and method for coating of a metallic strip substrate on one side and/or on both sides
A device for coating a metal strip substrate includes a guiding apparatus for guiding the strip substrate along a movement path. A first coating apparatus coats a first main side of the strip substrate with an electrostatically charged coating powder which is in a fluidized state. The first coating apparatus is arranged under a first path section of the movement path. A second coating apparatus coats a second main side of the strip substrate with an electrostatically charged coating powder which is in a fluidized state. A redirecting unit redirects the strip substrate between the first and the second coating apparatus in such a way that the strip substrate in a second path section travels oppositely to the strip substrate in the first path section. The second coating apparatus is arranged at least partly geodetically under the second path section.
METHOD AND APPARATUS FOR INLINE COATING OF SUBSTRATES
A coating apparatus that can coat a substrate while assuring a volatile organic compound (VOC) free atmosphere outside the equipment. The coating apparatus can be used in-line, where flat materials and substrates that are typically carried along a conveyer may enter the coating apparatus without requiring the substrate to be moved into any other configuration. The coating apparatus may be configured to permit the user to perform any number of treatment steps while providing isolation between the steps. The coating apparatus can be formed by nesting one or more inner chambers inside a central chamber which may be nested inside an outer chamber. The outer chamber may be, for example, a vacuum chamber to ensure removal of VOCs.
METHOD AND APPARATUS FOR INLINE COATING OF SUBSTRATES
A coating apparatus that can coat a substrate while assuring a volatile organic compound (VOC) free atmosphere outside the equipment. The coating apparatus can be used in-line, where flat materials and substrates that are typically carried along a conveyer may enter the coating apparatus without requiring the substrate to be moved into any other configuration. The coating apparatus may be configured to permit the user to perform any number of treatment steps while providing isolation between the steps. The coating apparatus can be formed by nesting one or more inner chambers inside a central chamber which may be nested inside an outer chamber. The outer chamber may be, for example, a vacuum chamber to ensure removal of VOCs.
Substrate processing apparatus
A substrate processing apparatus includes a chamber, a substrate holding part, a substrate rotating mechanism, and a processing liquid supply part. The chamber includes a chamber body and a chamber cover, and the chamber cover is moved up and down by a chamber opening and closing mechanism. A top plate is attached to the chamber cover. While the chamber cover is in contact with the chamber body, a sealed space is formed and processing is performed. When the chamber cover is moved up, an annular opening is formed between the chamber cover and the chamber body. A cup part is positioned outside the annular opening. A processing liquid spattering from a substrate is received by the cup part.
Substrate processing apparatus
A substrate processing apparatus includes a chamber, a substrate holding part, a substrate rotating mechanism, and a processing liquid supply part. The chamber includes a chamber body and a chamber cover, and the chamber cover is moved up and down by a chamber opening and closing mechanism. A top plate is attached to the chamber cover. While the chamber cover is in contact with the chamber body, a sealed space is formed and processing is performed. When the chamber cover is moved up, an annular opening is formed between the chamber cover and the chamber body. A cup part is positioned outside the annular opening. A processing liquid spattering from a substrate is received by the cup part.
Substrate processing apparatus
A substrate processing apparatus includes a chamber, a substrate holding part, a substrate rotating mechanism, and a processing liquid supply part. The chamber includes a chamber body and a chamber cover, and the chamber cover is moved up and down by a chamber opening and closing mechanism. A top plate is attached to the chamber cover. While the chamber cover is in contact with the chamber body, a sealed space is formed and processing is performed. When the chamber cover is moved up, an annular opening is formed between the chamber cover and the chamber body. A cup part is positioned outside the annular opening. A processing liquid spattering from a substrate is received by the cup part.