A surface treating apparatus that suppresses occurrence of defects is provided. A treatment solution is accumulated in a tank 15 through a treatment solution collecting port/air discharging port 13 in a lower portion of a bath 4. An air heated by the treatment solution flows toward an upper portion (portion without the treatment solution) of the tank 15 via the treatment solution collecting port/air discharging port 13 in the lower portion of the bath 4, and is discharged via an exhaust duct 17. In this way, the air that is heated and tends to flow upward in the bath 4 is discharged from the lower portion thereof and is replaced with an external air from the upper portion thereof. Accordingly, the air in the bath 4 can be maintained at a uniform temperature. Thus, the treatment solution that reaches a lower portion of a substrate 54 from an upper portion thereof can be maintained at a uniform temperature. The air is caused to flow toward the lower portion from the upper portion in the bath 4, so that the substrate 54 is pulled downward, and swinging of the substrate 54 can thus be reduced. Therefore, the substrate 54 can be less likely to contact an inlet 44 and an outlet 46.

An electronic component mounting machine is provided with a film thickness gage. The film thickness gage is provided with measurement sections. The mounting head moves to a position above the storage section and lowers the film thickness gage to cause the film thickness gage to come into contact with the flux film. In the film thickness gage, the measurement sections form measurement marks corresponding to the film thickness in the flux film. The electronic component mounting machine images the measurement marks using a mark camera, and determines the film thickness of the flux film which is actually formed based on imaging data.

An electronic component mounting machine is provided with a film thickness gage. The film thickness gage is provided with measurement sections. The mounting head moves to a position above the storage section and lowers the film thickness gage to cause the film thickness gage to come into contact with the flux film. In the film thickness gage, the measurement sections form measurement marks corresponding to the film thickness in the flux film. The electronic component mounting machine images the measurement marks using a mark camera, and determines the film thickness of the flux film which is actually formed based on imaging data.

Methods for storing and moving adhesive particulate to an adhesive melter are disclosed. An interior space of a supply hopper is filled with adhesive particulate. A transfer pump is actuated to generate a vacuum at an inlet of the transfer pump to actuate removal of the adhesive particulate from the supply hopper. A consistent minimized depth of the adhesive particulate located directly above the inlet is maintained with a shroud located within the interior space of the supply hopper. In addition, adhesive particulate can be received in an interior space of a container. An open space is maintained within the interior space of the container proximate the pump inlet, where the open space entrains gas to be drawn by the transfer pump. The transfer pump can be actuated to generate a vacuum at the pump inlet to cause removal of the adhesive particulate from the container.

Methods for storing and moving adhesive particulate to an adhesive melter are disclosed. An interior space of a supply hopper is filled with adhesive particulate. A transfer pump is actuated to generate a vacuum at an inlet of the transfer pump to actuate removal of the adhesive particulate from the supply hopper. A consistent minimized depth of the adhesive particulate located directly above the inlet is maintained with a shroud located within the interior space of the supply hopper. In addition, adhesive particulate can be received in an interior space of a container. An open space is maintained within the interior space of the container proximate the pump inlet, where the open space entrains gas to be drawn by the transfer pump. The transfer pump can be actuated to generate a vacuum at the pump inlet to cause removal of the adhesive particulate from the container.

The present invention provides a liquid level control system and method. The present invention achieves a uniformly soaking process of a substrate during different segments of a fixed time period, by using a liquid removal device to gradually remove a processing liquid from a tank. The substrate is disposed in the liquid in the tank to be wet processed. By the removal of the liquid from the tank via the liquid removal device, an area of the portion of the substrate being processed by the liquid can be gradually decreased whereby the substrate can be uniformly processed.

The present invention provides a liquid level control system and method. The present invention achieves a uniformly soaking process of a substrate during different segments of a fixed time period, by using a liquid removal device to gradually remove a processing liquid from a tank. The substrate is disposed in the liquid in the tank to be wet processed. By the removal of the liquid from the tank via the liquid removal device, an area of the portion of the substrate being processed by the liquid can be gradually decreased whereby the substrate can be uniformly processed.

A coating apparatus includes: a nozzle having a nozzle front end configured to spray a coating solution and a head configured to store the coating solution; a movement axis configured to cause the nozzle to move back and forth in a straight line; a rotating connection member configured to connect the movement axis with the nozzle and allow the nozzle to rotate; a stage disposed under the movement axis; and a cleaning means disposed at an end of the movement axis, and having a nozzle front end insertion unit in a concave shape of the nozzle front end and a base fixing the insertion unit, wherein the nozzle is fixed in a normal direction of a surface of the stage by the movement axis, moves back and forth in an extension direction of the movement axis, and rotates with respect to the movement axis.

A bulk adhesive transfer system for transferring adhesive particulate to a melter includes a bulk supply and a transfer device, which may define a hopper of the melter, a mobile bin, and/or a buffer unit. The transfer device is configured to receive unmelted adhesive particulate from the bulk supply and then be selectively docked with the melter to transfer the adhesive particulate to the melter. The bulk adhesive transfer system may also include a knife gate valve device, which includes a plurality of ports that sequentially open and close to control flow of the adhesive particulate towards the melter. The bulk adhesive transfer system simplifies refilling operations for a melter while enabling continuous operation of the melter, even when the transfer device is undocked for removal from the melter.

A bulk adhesive transfer system for transferring adhesive particulate to a melter includes a bulk supply and a transfer device, which may define a hopper of the melter, a mobile bin, and/or a buffer unit. The transfer device is configured to receive unmelted adhesive particulate from the bulk supply and then be selectively docked with the melter to transfer the adhesive particulate to the melter. The bulk adhesive transfer system may also include a knife gate valve device, which includes a plurality of ports that sequentially open and close to control flow of the adhesive particulate towards the melter. The bulk adhesive transfer system simplifies refilling operations for a melter while enabling continuous operation of the melter, even when the transfer device is undocked for removal from the melter.