A method of manufacturing a metal mask includes calendering a metal material, so as to form a metal mask substrate, where the metal mask substrate includes a surface and a plurality of grooves formed in the surface, and the grooves all extend in a direction. The surface has at least one sampling region, while at least two grooves are distributed in the sampling region, where an average area ratio of the area of the grooves within the sampling region to the area of the sampling region ranges between 45% and 68%.

A mask including: a deposition pattern portion including a plurality of deposition holes that are configured to have deposition material pass therethrough; and a dummy pattern portion outside the deposition pattern portion, wherein the dummy pattern portion includes an auxetic structure having a negative Poisson's ratio.

A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.

A device and method for lacquer transfer includes a lacquer application unit and at least one of a masking application unit and a masking removal unit, the application unit for applying lacquer to a work surface, wherein the masking application unit is configured to apply a masking to the work surface and is attached to the lacquer application unit so the masking application unit is moved in the application direction ahead of the lacquer application unit across the work surface when the lacquer application unit is moved across the work surface in the application direction. The masking removal unit can remove a previously applied masking from the work surface and is attached to the lacquer application unit such that the masking removal unit is moved in the application direction behind the lacquer application unit across the work surface when the lacquer application unit is moved across the work surface in the application direction.

A protective cover for covering a ceiling or wall mounted fixture includes an open mouth surrounded by a rim and a flexible body extending from the open mouth and surrounding an interior chamber. The interior chamber is sized and configured to accommodate the entire fixture therein. A drawstring extends about the top rim and is pulled at least at one location to close the open mouth against the mounting portion of the fixture adjacent the ceiling surface, thereby protectively encapsulating the entire fixture within the interior chamber of the cover. An adhesive material may be provided about an inner side of the top rim to help hold the top rim against the mounting portion of the fixture.

A system for forming a particle layer on a substrate may include at least one sprayer and at least two masks configured to selectively mask a substrate in a first region and second region of the substrate. The at least one sprayer may be configured to spray particles at the substrate, where the at least two masks maintain the first region and second region substantially free of the deposited material. A heater may be employed to heat the substrate as the particles are sprayed by the at least one sprayer onto the substrate.

Disclosed are a mask strip, a mask plate frame, a mask plate, and a welding method thereof. The mask strip includes a first welding region, a second welding region, and a pattern region between the first welding region and the second welding region. In addition, a bendable region is disposed both between the first welding region and the pattern region and between the second welding region and the pattern region.

A masking device for placement over an end of a work piece includes a head portion, a collar portion, and at least one pull tab. The head portion includes a closed end and an interior cavity defined in the head portion. The collar portion is coupled to the head portion opposite the closed end of the head portion. The collar portion includes a radially inner surface defining an opening. The opening is in fluid communication with the interior cavity of the head portion. The opening is narrower than the interior cavity of the head portion. The collar portion further includes a radially outer surface. The at least one pull tab is coupled to the radially outer surface of the collar portion.

A system for forming a particle layer on a substrate may include at least one sprayer and at least two masks configured to selectively mask a substrate in a first region and second region of the substrate. The at least one sprayer may be configured to spray particles at the substrate, where the at least two masks maintain the first region and second region substantially free of the deposited material. A heater may be employed to heat the substrate as the particles are sprayed by the at least one sprayer onto the substrate.

A method of manufacturing a metal mask includes calendering a metal material, so as to form a metal mask substrate, where the metal mask substrate includes a surface and a plurality of grooves formed in the surface, and the grooves all extend in a direction. The surface has at least one sampling region, while at least two grooves are distributed in the sampling region, where an average area ratio of the area of the grooves within the sampling region to the area of the sampling region ranges between 45% and 68%.