This method for painting a surface (S62) of a component (6) with a pattern includes at least the following steps consisting in applying a first coating product on at least a portion of the surface, automatically applying at least one portion of a mask (12) on a portion (Z62) of the surface, applying a second coating product and on the surface and removing the mask (12). Preferably, the mask (12) is at least partially automatically applied in the form of at least one layer (122, 124, 126) of non-atomized fluid, the layer being obtained by moving (A1) an applicator (16) delivering the non-atomized fluid along the portion (Z62) of the surface (S62) where the mask (12) is to be applied.

This method for painting a surface (S62) of a component (6) with a pattern includes at least the following steps consisting in applying a first coating product on at least a portion of the surface, automatically applying at least one portion of a mask (12) on a portion (Z62) of the surface, applying a second coating product and on the surface and removing the mask (12). Preferably, the mask (12) is at least partially automatically applied in the form of at least one layer (122, 124, 126) of non-atomized fluid, the layer being obtained by moving (A1) an applicator (16) delivering the non-atomized fluid along the portion (Z62) of the surface (S62) where the mask (12) is to be applied.

A mask frame assembly including a frame having an opening, a mask having a first end and a second end supported on the frame, and a first member disposed between the first end of the mask and the frame, the first member including a material having a coefficient of thermal expansion greater than that of the mask. A method of manufacturing a display apparatus using the mask frame assembly also is disclosed.

A mask frame assembly including a frame having an opening, a mask having a first end and a second end supported on the frame, and a first member disposed between the first end of the mask and the frame, the first member including a material having a coefficient of thermal expansion greater than that of the mask. A method of manufacturing a display apparatus using the mask frame assembly also is disclosed.

Disclosed are a screen printing stencil, a light guide plate and a display device. The screen printing stencil includes a pattern printing section arranged corresponding to a light guide plate to be printed, and at least one positioning mark hole arranged on the periphery of the pattern printing section. The light guide plate is manufactured using the screen printing stencil according to the embodiment of the invention by firstly aligning in position the pattern printing section of the screen printing stencil with the light guide plate to be printed, using the at least one positioning mark hole, and then printing on the light guide plate to be printed. A corresponding pattern of positioning marks is printed on the light guide plate in addition to the corresponding pattern. As compared with the prior art, the precision of aligning in position the screen printing stencil with the light guide plate to be printed can be improved to thereby improve the displaying quality of the display product.

Disclosed are a screen printing stencil, a light guide plate and a display device. The screen printing stencil includes a pattern printing section arranged corresponding to a light guide plate to be printed, and at least one positioning mark hole arranged on the periphery of the pattern printing section. The light guide plate is manufactured using the screen printing stencil according to the embodiment of the invention by firstly aligning in position the pattern printing section of the screen printing stencil with the light guide plate to be printed, using the at least one positioning mark hole, and then printing on the light guide plate to be printed. A corresponding pattern of positioning marks is printed on the light guide plate in addition to the corresponding pattern. As compared with the prior art, the precision of aligning in position the screen printing stencil with the light guide plate to be printed can be improved to thereby improve the displaying quality of the display product.

A method of fabricating an interposer includes: providing a carrier substrate; forming a unit redistribution layer on the carrier substrate, the unit redistribution layer including a conductive via plug and a conductive redistribution line; and removing the carrier substrate from the unit redistribution layer. The formation of the unit redistribution layer includes: forming a first photosensitive pattern layer including a first via hole pattern; forming a second photosensitive pattern layer including a second via hole pattern and a redistribution pattern on the first photosensitive pattern layer; at least partially filling insides of the first via hole pattern, the second via hole pattern, and the redistribution pattern with a conductive material; and performing planarization to make a top surface of the unit redistribution layer flat. According to the method, no undercut occurs under a conductive structure and there are no bubbles between adjacent conductive structures, thus device reliability is enhanced and pattern accuracy is realized.

A method of fabricating an interposer includes: providing a carrier substrate; forming a unit redistribution layer on the carrier substrate, the unit redistribution layer including a conductive via plug and a conductive redistribution line; and removing the carrier substrate from the unit redistribution layer. The formation of the unit redistribution layer includes: forming a first photosensitive pattern layer including a first via hole pattern; forming a second photosensitive pattern layer including a second via hole pattern and a redistribution pattern on the first photosensitive pattern layer; at least partially filling insides of the first via hole pattern, the second via hole pattern, and the redistribution pattern with a conductive material; and performing planarization to make a top surface of the unit redistribution layer flat. According to the method, no undercut occurs under a conductive structure and there are no bubbles between adjacent conductive structures, thus device reliability is enhanced and pattern accuracy is realized.

The device is a tape having a pair of parallel perforated lines running lengthwise along the center of the tape having a pressure-sensitive adhesive coating on a bottom surface of said tape whereby the tape is comprised of three sections: a first adhesive section, a non-adhesive section and a second adhesive section, with the non-adhesive section defined by the perforated lines.

The device is a tape having a pair of parallel perforated lines running lengthwise along the center of the tape having a pressure-sensitive adhesive coating on a bottom surface of said tape whereby the tape is comprised of three sections: a first adhesive section, a non-adhesive section and a second adhesive section, with the non-adhesive section defined by the perforated lines.