The present disclosure provides embodiments of improved area-selective deposition (ASD) processes and methods for selectively depositing polymer films on a variety of different target material. More specifically, the present disclosure provides improved ASD processes and related methods that use a cyclic vapor deposition process, which sequentially exposes a surface of a substrate to a polymer precursor followed by an initiator to selectively deposit a polymer thin film on a target material exposed on the substrate surface. The process of sequentially exposing the substrate surface to the precursor and the initiator can be repeated for one or more cycles of the cyclic vapor deposition process until a predetermined thickness of the polymer thin film is selectively deposited on the target material. In one embodiment, sequentially pulsed initiated chemical vapor deposition (spiCVD) is used to selectively deposit the polymer thin film on the target material.

A substrate processing method is provided. In the method, a substrate is provided. A monomer that is chemically bonded to the substrate is supplied onto the substrate. An initiator for polymerizing the monomer is supplied to the substrate having the supplied monomer thereon, thereby forming a polymer film.

Forming a two-dimensional polymeric sheet includes translating a portion of a flexible substrate through a first liquid precursor to coat the portion of the flexible substrate with the first liquid precursor, thereby yielding a precursor-coated portion of the flexible substrate. The precursor-coated portion of the flexible substrate is translated through an interface between the first liquid precursor and a second liquid precursor, thereby reacting the first liquid precursor on the precursor-coated portion of the flexible substrate with the second liquid precursor to yield a polymer-coated portion of the flexible substrate.

A method of layer-by-layer deposition for thin-film fabrication and a layer-by-layer deposition apparatus for thin-film fabrication. The method comprises the steps of at least partially immersing a substrate in a reservoir of a charged solution to deposit a layer on the substrate and spraying the substrate with an atomized charged solution to deposit a layer on the substrate.

A method of layer-by-layer deposition for thin-film fabrication and a layer-by-layer deposition apparatus for thin-film fabrication. The method comprises the steps of at least partially immersing a substrate in a reservoir of a charged solution to deposit a layer on the substrate and spraying the substrate with an atomized charged solution to deposit a layer on the substrate.

A display cover plate includes: a substrate; a first thermoplastic material layer provided on one side of the substrate; a flexible polymer layer provided on one side of the first thermoplastic material layer away from the substrate; and a hardened layer provided on one side of the flexible polymer layer away from the first thermoplastic material layer.

A display cover plate includes: a substrate; a first thermoplastic material layer provided on one side of the substrate; a flexible polymer layer provided on one side of the first thermoplastic material layer away from the substrate; and a hardened layer provided on one side of the flexible polymer layer away from the first thermoplastic material layer.

A challenge of the present invention is to provide a water-based coating composition capable of providing a design superior in depth feeling in the formation of a multilayer coating film having a so-called color clear coating film. The present invention relates to a water-based coating composition comprising a coating film-forming resin (i) and a coloring pigment dispersion (ii), wherein the coating film-forming resin (i) comprises: an acrylic resin emulsion (A) having an average particle diameter of 100 nm or less in an amount of 10 to 60% by mass in terms of the resin solid content of the coating film-forming resin (i), a water-soluble acrylic resin (B) in an amount of 5 to 40% by mass in terms of the resin solid content of the coating film-forming resin (i), and a melamine resin (C) in an amount of 20 to 40% by mass in terms of the resin solid content of the coating film-forming resin (i); and the coloring pigment dispersion (ii) comprises a coloring pigment (D) having a 90%-volume particle diameter (D90) of 100 nm or less.

The present invention relates to a method for forming a protective coating on a plant tissue following the consecutives steps of: (a) providing a plant having an external surface, wherein a portion of the external surface includes an exposed surface; (b) applying a first aqueous solution that contains a crosslinking agent to the external surface of the plant; and (c) applying to the external surface of the plant a second aqueous solution that contains a polysaccharide which is susceptible to crosslinking by the crosslinking agent, thereby forming a protective coating on the exposed surface of the plant. Further provided is a postharvest plant matter that includes a first segment covered by natural skin, and a second segment having an exposed surface that is coated by a protective coating that contains a polysaccharide with the first segment being essentially free of the protective coating.

Exemplary methods of semiconductor processing may include forming a layer of carbon-containing material on a substrate disposed within a processing region of a semiconductor processing chamber. The substrate may include an exposed region of a first dielectric material and an exposed region of a metal-containing material. The layer of carbon-containing material may be selectively formed over the exposed region of the metal-containing material. Forming the layer of carbon-containing material may include one or more cycles of providing a first molecular species that selectively couples with the metal-containing material. Forming the layer of carbon-containing material may include providing a second molecular species that selectively couples with the first molecular species. The methods may include selectively depositing a second dielectric material on the exposed region of the first dielectric material.