A substrate processing apparatus includes a processing bath, a first lid member, an outer bath, a processing liquid introduction unit, a first gas supply unit, and a second gas supply unit. The processing bath stores a processing liquid in which a substrate is immersed. The first lid member covers an upper opening of the processing bath. The outer bath is provided outside of the processing bath and a processing liquid overflowing out of the processing liquid from the processing bath flows into the outer bath. The processing liquid introduction unit is able to introduce the processing liquid stored in the outer bath into the processing bath. The first gas supply unit supplies a first inert gas to the processing liquid stored in the processing bath. The second gas supply unit supplies a second inert gas into the outer bath.

A metering device is disclosed for regulating the depth of a flowable product coating a surface movable relative to the metering device by directing an air curtain towards the surface. The metering device comprises a body having an interior chamber, an inlet for connecting the chamber to a source of gas under super-ambient pressure; and an opening communicating with the chamber and having a mouth through which gas is discharged from the chamber towards the surface to form the air curtain. A porous or reticulated membrane is secured to, or formed integrally with, the body of the device to lie in the path of the gas discharged through the mouth of the opening.

A metering device is disclosed for regulating the depth of a flowable product coating a surface movable relative to the metering device by directing an air curtain towards the surface. The metering device comprises a body having an interior chamber, an inlet for connecting the chamber to a source of gas under super-ambient pressure; and an opening communicating with the chamber and having a mouth through which gas is discharged from the chamber towards the surface to form the air curtain. A porous or reticulated membrane is secured to, or formed integrally with, the body of the device to lie in the path of the gas discharged through the mouth of the opening.

A coating method is provided which includes the steps of applying a base paint on a workpiece, blowing air at 19° C. or higher and 26° C. or lower to the applied base paint to pre-dry the base paint, applying a clear coating on the pre-dried base paint, and finally drying the workpiece with the clear coating applied thereon.

An industrial oven includes an oven chamber configured to receive a plurality of work pieces. A heater box of the oven has a heating element therein operable to heat air for delivery to the oven chamber. A circulation system of the oven is operable to force hot air from the heater box into the oven chamber. The circulation system includes a delivery manifold extending from the heater box to the oven chamber. A duct has an inlet coupled with an outlet of the delivery manifold, and the duct has a plurality of hot air outlet apertures therein for expelling hot air into the oven chamber. The duct is constructed of fabric sheet and suspended within the oven chamber.

A method of making a solution including poly(ethylene terephthalate). The method includes dissolving poly(ethylene terephthalate) in a solvent mixture to form a solution, the solvent mixture including two solvent components. A Hansen Solubility Parameter Distance between the solvent mixture and HSP coordinates having a dispersion HSP of 18.02 MPa.sup.0.5, a polar HSP of 5.56 MPa.sup.0.5, and a hydrogen bonding HSP of 14.27 MPa.sup.0.5 is less than about 2 MPa.sup.0.5.

A method of making a solution including poly(ethylene terephthalate). The method includes dissolving poly(ethylene terephthalate) in a solvent mixture to form a solution, the solvent mixture including two solvent components. A Hansen Solubility Parameter Distance between the solvent mixture and HSP coordinates having a dispersion HSP of 18.02 MPa.sup.0.5, a polar HSP of 5.56 MPa.sup.0.5, and a hydrogen bonding HSP of 14.27 MPa.sup.0.5 is less than about 2 MPa.sup.0.5.

Provided herein is a device for forming a conductive film. The device includes a deposition device and an air supply. The deposition device is configured to form a wet film having conductive nanostructures and a fluid carrier on a web. The web is moved in a first direction while forming the wet film. The air supply is disposed at a side of the web and configured to apply an air flow onto the wet film. The air flow is directed onto the wet film in a second direction perpendicular to the first direction to reorient a direction of some conductive nanostructures in the wet film to define reoriented conductive nanostructures.

The present disclosure provides an apparatus for removing bubbles in a flexible substrate. The flexible substrate includes a baseplate and a polyimide layer coated on the baseplate. The apparatus includes a chamber including a top wall, a sidewall, and a bottom wall, wherein the top wall, the sidewall, and the bottom wall define an accommodation space; a heating plate disposed in the accommodation space; and a cooling conduit embedded in at least one of the top wall and the sidewall of the chamber.

A flexible conductive film is comprised of a flexible base and a conductive layer coated on it. The flexible base uses Surlyn resin as the matrix. It uses silver nanowire as the conductive layer.