A manufacturing method of an indium tin oxide (ITO) thin film based on a solution method is disclosed. The manufacturing method includes: a step of providing an array substrate; a step of obtaining a dispersion solution by mixing ITO grains, an organic small molecule phase transfer agent, and an N-chlorosuccinimide (NCs) solution; a step of obtaining uniformly assembled ITO grains by coating the dispersion solution onto a passivation layer and baking to remove the organic small molecule phase transfer agent; and a step of obtaining the ITO thin film by annealing at an inert atmosphere to refine the ITO grains.

Methods for treating cellulosic materials comprising introducing a liquid treating composition into the cellulosic material, the treating composition comprising a solution prepared from at least: (i) one or more of a copper amine complex or copper ammine complex, such as copper tetraamine carbonate, (ii) one or more of ammonia or a water-soluble amine and (iii) water; and exposing the cellulosic material provided thereby to carbon dioxide and/or carbonic acid to provide treated cellulosic material, and treated cellulosic materials prepared thereby.

A gas barrier film formed of a cured product of a mixture including a polycarboxylic acid, a polyamine compound, and a polyvalent metal compound, in which in an infrared absorption spectrum of the gas barrier film, an area ratio of an amide bond represented by B/A is equal to or less than 0.380, an area ratio of a carboxylic acid represented by C/A is equal to or less than 0.150, and an area ratio of carboxylate represented by D/A is equal to or more than 0.520.

In an embodiment, the present disclosure pertains to a method of forming a self-assembled monolayer coating on a surface of a substrate. In general, the method includes polishing the substrate, cleaning the substrate, and creating a plurality of bonding sites on the surface of the substrate for head groups of an organofunctional silane molecule to bond. In some embodiments, the creating includes at least one of a liquid-phase chemistry process or a dry plasma chemistry process. In some embodiments, the method further includes coating the substrate with a silane coating solution. In some embodiments, the coating is performed in a controlled environment. In some embodiments, the controlled environment includes an anhydrous environment free of at least one of water or moisture. In a further embodiment, the present disclosure pertains to a heat transfer composition having a coating thereon applied via the methods of the present disclosure.

One variation of a method for fabricating a dermal heatsink includes: fabricating a substrate defining an interior surface, an exterior surface opposite the interior surface, and an open network of pores extending between the interior surface and the exterior surface; activating surfaces of the substrate and walls of the open network of pores; applying a coating over the substrate to form a heatsink, the coating comprising a porous, hydrophilic material and defining a void network; removing an excess of the coating from the substrate to clear blockages within the open network of pores by the coating; hydrating the heatsink during a curing period; heating the heatsink during the curing period to increase porosity of the coating applied over surfaces of the substrate; and rinsing the heatsink with an acid to decarbonate the coating along walls of the open network of pores in the substrate.

A method for manufacturing a semiconductor device includes forming a first pattern structure having a first opening on a lower structure comprising a semiconductor substrate. The first pattern structure includes a stacked pattern and a first spacer layer covering at least a side surface of the stacked pattern. A first flowable material layer including a SiOCH material is formed on the first spacer layer to fill the first opening and cover an upper portion of the first pattern structure. A first curing process including supplying a gaseous ammonia catalyst into the first flowable material layer is performed on the first flowable material layer to form a first cured material layer that includes water. A second curing process is performed on the first cured material layer to form a first low-k dielectric material layer. The first low-k dielectric material layer is planarized to form a planarized first low-k dielectric material layer.

The invention is directed to a process for the continuous acetylation of wood elements. The process particularly combines a batchwise impregnation step, with a continuous reaction step. In order to realize this, a collection step is built-in, so as to allow batches of impregnated wood elements to be fed into a reactor in a continuous manner. Very high acetylation contents can be obtained, at a level that had not been achievable before in a continuous and non-catalyzed acetylation process.

The invention is directed to a process for the continuous acetylation of wood elements. The process particularly combines a batchwise impregnation step, with a continuous reaction step. In order to realize this, a collection step is built-in, so as to allow batches of impregnated wood elements to be fed into a reactor in a continuous manner. Very high acetylation contents can be obtained, at a level that had not been achievable before in a continuous and non-catalyzed acetylation process.

A process for obtaining a material including a textured glass substrate coated, on at least one of its textured faces, with an antireflective coating of sol-gel type based on porous silica, includes a stage of application, to the at least one textured face of the substrate, of a solution containing at least one silica precursor and at least one pore-forming agent, then a heat treatment stage targeted at consolidating the antireflective coating. Before the application stage, the glass substrate is subjected to a preheating stage, so that the at least one textured face intended to be coated with the antireflective coating has a temperature within a range extending from 30° C. to 100° C. immediately before the application stage.

Novel, lubricious antimicrobial coatings for medical devices are disclosed. The coatings provide improved lubricity and durability and are readily applied in coating processes at low temperatures that do not deform the device and preserves the antimicrobial effectiveness of the antimicrobial agent. The present invention is also directed to a novel platinum catalyst for use in such coatings. The catalyst provides for rapid curing, while inhibiting cross-linking at ambient temperatures, thereby improving the production pot life of the coatings.