One variation of a method for fabricating a dermal heatsink includes: fabricating a substrate defining an interior surface, an exterior surface opposite the interior surface, and an open network of pores extending between the interior surface and the exterior surface; activating surfaces of the substrate and walls of the open network of pores; applying a coating over the substrate to form a heatsink, the coating comprising a porous, hydrophilic material and defining a void network; removing an excess of the coating from the substrate to clear blockages within the open network of pores by the coating; hydrating the heatsink during a curing period; heating the heatsink during the curing period to increase porosity of the coating applied over surfaces of the substrate; and rinsing the heatsink with an acid to decarbonate the coating along walls of the open network of pores in the substrate.

A method for manufacturing a semiconductor device includes forming a first pattern structure having a first opening on a lower structure comprising a semiconductor substrate. The first pattern structure includes a stacked pattern and a first spacer layer covering at least a side surface of the stacked pattern. A first flowable material layer including a SiOCH material is formed on the first spacer layer to fill the first opening and cover an upper portion of the first pattern structure. A first curing process including supplying a gaseous ammonia catalyst into the first flowable material layer is performed on the first flowable material layer to form a first cured material layer that includes water. A second curing process is performed on the first cured material layer to form a first low-k dielectric material layer. The first low-k dielectric material layer is planarized to form a planarized first low-k dielectric material layer.

A base material adjusting method capable of removing an already-existing coating film with one time construction, which is suitable in terms of prevention of health problems of operators and in terms of environmental protection, and capable of suppressing disposal costs of waste. The base material adjusting method includes a coating film removing step of removing an already-existing coating film of a work object of the repainting operation by a wet blast method, and a rust removing step of removing rust generated after the coating film removing step by a dry blast method, and rust inhibitor is not included in slurry used in the wet blast method in the coating film removing step.

An implantable medical device includes a polymer substrate and at least one nanofiber. The polymer substrate includes a surface portion extending into the polymer substrate from a surface of the substrate. The at least one nanofiber includes a first portion and a second portion. The first portion is interpenetrated with the surface portion of the substrate, and mechanically fixed to the substrate. The second portion projects from the surface of the substrate.

In order to provide a device and a method for treating workpieces (102), in which an optimized workpiece treatment is possible, it is proposed that a treatment station (114) comprise a treatment chamber (136) that can be flooded for workpiece treatment.

In order to provide a device and a method for treating workpieces (102), in which an optimized workpiece treatment is possible, it is proposed that a treatment station (114) comprise a treatment chamber (136) that can be flooded for workpiece treatment.

In one embodiment, the present application discloses a photo-cleavable surface binding compound of the Formula I and Formula II:

##STR00001##

wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound.

In one embodiment, the present application discloses a photo-cleavable surface binding compound of the Formula I and Formula II:

##STR00001##

wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound.

The present disclosure provides a substrate treating apparatus capable of stably moving a substrate and discharging an ink at an accurate position. The substrate treating apparatus of the present disclosure comprises: a stage extending in a first direction and moving a substrate along the first direction; moving units disposed on both sides of the stage extending in the first direction, respectively, and configured to move the substrate in the first direction; and a control unit configured to align the substrate, wherein the moving unit includes a first gripper and a second gripper configured to adsorb one side and the other side of the substrate, respectively, after the first gripper adsorbs one side of the substrate, the control unit aligns the substrate, and after the substrate is aligned, the second gripper adsorbs the other side of the substrate and the substrate is moved in the first direction.

The present disclosure provides a substrate treating apparatus capable of stably moving a substrate and discharging an ink at an accurate position. The substrate treating apparatus of the present disclosure comprises: a stage extending in a first direction and moving a substrate along the first direction; moving units disposed on both sides of the stage extending in the first direction, respectively, and configured to move the substrate in the first direction; and a control unit configured to align the substrate, wherein the moving unit includes a first gripper and a second gripper configured to adsorb one side and the other side of the substrate, respectively, after the first gripper adsorbs one side of the substrate, the control unit aligns the substrate, and after the substrate is aligned, the second gripper adsorbs the other side of the substrate and the substrate is moved in the first direction.