The present disclosure provides embodiments of improved area-selective deposition (ASD) processes and methods for selectively depositing polymer films on a variety of different target material. More specifically, the present disclosure provides improved ASD processes and related methods that use a cyclic vapor deposition process, which sequentially exposes a surface of a substrate to a polymer precursor followed by an initiator to selectively deposit a polymer thin film on a target material exposed on the substrate surface. The process of sequentially exposing the substrate surface to the precursor and the initiator can be repeated for one or more cycles of the cyclic vapor deposition process until a predetermined thickness of the polymer thin film is selectively deposited on the target material. In one embodiment, sequentially pulsed initiated chemical vapor deposition (spiCVD) is used to selectively deposit the polymer thin film on the target material.

The present disclosure provides embodiments of improved area-selective deposition (ASD) processes and methods for selectively depositing polymer films on a variety of different target material. More specifically, the present disclosure provides improved ASD processes and related methods that use a cyclic vapor deposition process, which sequentially exposes a surface of a substrate to a polymer precursor followed by an initiator to selectively deposit a polymer thin film on a target material exposed on the substrate surface. The process of sequentially exposing the substrate surface to the precursor and the initiator can be repeated for one or more cycles of the cyclic vapor deposition process until a predetermined thickness of the polymer thin film is selectively deposited on the target material. In one embodiment, sequentially pulsed initiated chemical vapor deposition (spiCVD) is used to selectively deposit the polymer thin film on the target material.

A mixed powder usable for a vapor deposition process, including a first organic compound and a second organic compound, wherein the following formula (1) is satisfied:

|θ.sub.1−θ.sub.2|≥10°  (1) where θ.sub.1: a spread angle of a vapor deposition trajectory when a powder consisting of the first organic compound is vapor-deposited on a base material from a vapor deposition source, and θ.sub.2: a spread angle of a vapor deposition trajectory when a powder consisting of the second organic compound is vapor-deposited on a base material from a vapor deposition source.

A composition for coating an overhead conductor is disclosed comprising: (i) a reflective agent; (ii) a photocatalytic 0 agent comprising ≥70 wt % anatase titanium dioxide (TiO.sub.2) having an average particle size (“aps”)≤100 nm; (iii) a polyorganosiloxane binder; and (iv) a superhydrophobic agent comprising either: surface functionalised silica nanoparticles, a functional polysiloxane or a polymethylsilsesquioxane.

Provided is a powder coating device including a powder fluidization tank including a bottom member, a fixing member to which the powder fluidization tank is fixed, a coupling support member coupling and supporting the bottom member to the fixing member, and a vibration mechanism coupled to the bottom member, wherein the coupling support member includes a rubber laminate in which an elastic member and a rigid member are stacked, and is pressed by the bottom member and the fixing member.

A method for making a dense organosilicon film with improved mechanical properties, the method comprising the steps of: providing a substrate within a reaction chamber; introducing into the reaction chamber a gaseous composition comprising hydrido-dialkyl-alkoxysilane; and applying energy to the gaseous composition comprising hydrido-dialkyl-alkoxysilane in the reaction chamber to induce reaction of the gaseous composition comprising hydrido-dialkyl-alkoxysilane to deposit an organosilicon film on the substrate, wherein the organosilicon film has a dielectric constant from ˜2.70 to ˜3.50, an elastic modulus of from ˜6 to ˜36 GPa, and an at. % carbon from ˜10 to ˜36 as measured by XPS.

A method for making a dense organosilicon film with improved mechanical properties, the method comprising the steps of: providing a substrate within a reaction chamber; introducing into the reaction chamber a gaseous composition comprising hydrido-dialkyl-alkoxysilane; and applying energy to the gaseous composition comprising hydrido-dialkyl-alkoxysilane in the reaction chamber to induce reaction of the gaseous composition comprising hydrido-dialkyl-alkoxysilane to deposit an organosilicon film on the substrate, wherein the organosilicon film has a dielectric constant from ˜2.70 to ˜3.50, an elastic modulus of from ˜6 to ˜36 GPa, and an at. % carbon from ˜10 to ˜36 as measured by XPS.

The present disclosure proposes a process for producing a structured antiwear film, comprising the process steps of: a. providing a base antiwear film, b. applying a formable outer paint layer to at least part of the area of the base antiwear film, c. at least partially structuring the outer paint layer by means of a digital printing process to create a structuring of the outer paint layer, and d. curing the outer paint layer such that the outer paint layer is first partly cured, wherein UV radiation with a wavelength in a range from ≥150 nm to ≤250 nm is used for the partial curing, and wherein the outer paint layer is then cured to completion, and wherein e. the outer paint layer, before being supplied to the printing unit for partially structuring the outer paint layer and/or during the printing operation for partially structuring the outer paint layer in the printing unit, is treated with means for changing the electrostatic charge of the outer layer, in that the outer layer is electrostatically discharged.

The present disclosure proposes a process for producing a structured antiwear film, comprising the process steps of: a. providing a base antiwear film, b. applying a formable outer paint layer to at least part of the area of the base antiwear film, c. at least partially structuring the outer paint layer by means of a digital printing process to create a structuring of the outer paint layer, and d. curing the outer paint layer such that the outer paint layer is first partly cured, wherein UV radiation with a wavelength in a range from ≥150 nm to ≤250 nm is used for the partial curing, and wherein the outer paint layer is then cured to completion, and wherein e. the outer paint layer, before being supplied to the printing unit for partially structuring the outer paint layer and/or during the printing operation for partially structuring the outer paint layer in the printing unit, is treated with means for changing the electrostatic charge of the outer layer, in that the outer layer is electrostatically discharged.

A coating method applied to perform coating with liquid metal thermal grease and a heat dissipation module are provided. The coating method includes: providing liquid metal thermal grease on a surface of an electronic element, and scraping the liquid metal thermal grease by a scraper, to coat the surface of the electronic element with the liquid metal thermal grease. A surface of the scraper is roughened. According to the coating method, the surface of the electronic element is evenly coated with the liquid metal thermal grease effectively.