B05D7/20

DEVICE FOR MODIFYING A LINEAR SUBSTRATE
20250256297 · 2025-08-14 ·

An apparatus and method for modifying an aspect of an exterior polymer material or polymer type material of a linear substrate with a fluid. The apparatus include a variable exposure gap within which the linear substrate is exposed to the fluid. The width of the exposure gap is varied with the speed of the linear substrate traversing the exposure gap to maintain a constant exposure time of the linear substrate with the modifying fluid.

DEVICE FOR MODIFYING A LINEAR SUBSTRATE
20250256297 · 2025-08-14 ·

An apparatus and method for modifying an aspect of an exterior polymer material or polymer type material of a linear substrate with a fluid. The apparatus include a variable exposure gap within which the linear substrate is exposed to the fluid. The width of the exposure gap is varied with the speed of the linear substrate traversing the exposure gap to maintain a constant exposure time of the linear substrate with the modifying fluid.

Cable preparation and injection systems and methods

A method for preparing an electrical cable may include coupling an injection barrel to an electrical cable that includes one or more conductors surrounded by a porous insulating material. The method may also include injecting epoxy resin into a chamber of the injection barrel, and the chamber may be fluidly coupled to an end face of the porous insulating material. Additionally, the method may include pressurizing the chamber such that the epoxy resin is forced to penetrate into the end face of the porous insulating material and removing the injection barrel to expose an epoxy-injected portion of the porous insulating material.

Method and control system for applying a polymer coating material to a wire using a coating apparatus

A method of applying a polymer coating material to a wire using a coating apparatus and/or a control system. The method may include receiving coating material input to the coating apparatus at a first end of an elongate injection channel of the coating apparatus and supplying the received coating material to a coating chamber that is arranged at a second end of the injection channel. The method may include feeding wire through the coating chamber of the coating apparatus so as to apply the coating material to the wire in the coating chamber through the movement of the wire through the coating chamber.

Method and control system for applying a polymer coating material to a wire using a coating apparatus

A method of applying a polymer coating material to a wire using a coating apparatus and/or a control system. The method may include receiving coating material input to the coating apparatus at a first end of an elongate injection channel of the coating apparatus and supplying the received coating material to a coating chamber that is arranged at a second end of the injection channel. The method may include feeding wire through the coating chamber of the coating apparatus so as to apply the coating material to the wire in the coating chamber through the movement of the wire through the coating chamber.

LASER CLEANING AND ACTIVATION OF CU WIRES PRIOR TO PEEK INSULATION COATING
20250342988 · 2025-11-06 ·

A coating system may include a feed mechanism including one or more rollers configured to provide a supply of a wire conductor through a working zone with a feed rate, an extruder to coat the wire conductor with a coating as the wire conductor is fed through the working zone, and a laser processing sub-system in the working zone prior to the extruder. The laser processing sub-system may include one or more laser sources to illuminate a surface of the wire conductor with two or more laser beams as the wire conductor is fed through the working zone, where laser processing parameters associated with the laser processing sub-system are selected to activate the surface of the wire conductor for adhesion of the coating. The laser processing parameters may include intensities of the two or more laser beams, spectra of the two or more laser beams, and/or the feed rate.

LASER CLEANING AND ACTIVATION OF CU WIRES PRIOR TO PEEK INSULATION COATING
20250342988 · 2025-11-06 ·

A coating system may include a feed mechanism including one or more rollers configured to provide a supply of a wire conductor through a working zone with a feed rate, an extruder to coat the wire conductor with a coating as the wire conductor is fed through the working zone, and a laser processing sub-system in the working zone prior to the extruder. The laser processing sub-system may include one or more laser sources to illuminate a surface of the wire conductor with two or more laser beams as the wire conductor is fed through the working zone, where laser processing parameters associated with the laser processing sub-system are selected to activate the surface of the wire conductor for adhesion of the coating. The laser processing parameters may include intensities of the two or more laser beams, spectra of the two or more laser beams, and/or the feed rate.

Device for modifying a linear substrate

An apparatus and method for modifying an aspect of an exterior polymer material or polymer type material of a linear substrate with a fluid. The apparatus include a variable exposure gap within which the linear substrate is exposed to the fluid. The width of the exposure gap is varied with the speed of the linear substrate traversing the exposure gap to maintain a constant exposure time of the linear substrate with the modifying fluid.

Device for modifying a linear substrate

An apparatus and method for modifying an aspect of an exterior polymer material or polymer type material of a linear substrate with a fluid. The apparatus include a variable exposure gap within which the linear substrate is exposed to the fluid. The width of the exposure gap is varied with the speed of the linear substrate traversing the exposure gap to maintain a constant exposure time of the linear substrate with the modifying fluid.

Manufacturing insulated spherical weld gold wire for integrated circuit double-layer stacked package

The present invention discloses a method for manufacturing an insulated spherical weld gold wire for integrated circuit double-layer stacked package, which relates to the technical field of microelectronic packaging spherical weld gold wires, and specifically comprises the following steps: alloy sheet preparation; alloy rod preparation; stretching; annealing treatment; activation treatment; sputtered insulating coating; multi-winding and sub-packaging, since the polyaryletherketone insulating coating is provided on the surface of the spherical weld gold wire in a scaled integrated circuit and the double-layer stacked package of the present invention, the spherical weld gold wire is allowed to contact and cross during packaging, without affecting the product performance, cost and quality; two high-hardness and high-conductivity materials of cobalt and germanium are added, which greatly enhances the tensile strength of the material.