A method of providing fire protection to a structure includes the step of installing an intumescent mesh on a surface of the structure such that the intumescent mesh is exposed to outdoor environmental conditions. The intumescent mesh includes a mesh with a series of openings and an intumescent coating applied to the flexible grid such that air can pass through the openings in the intumescent mesh. The intumescent coating includes expandable graphite and a polymer-based carrier; and the intumescent coating does not degrade when exposed the outdoor environmental conditions. The intumescent coating remains flexible and resists cracking and spalling from the flexible grid.

A composition for coating an overhead conductor is disclosed comprising: (i) a reflective agent; (ii) a photocatalytic agent comprising 70 wt % anatase titanium dioxide (TiO.sub.2) having an average particle size (aps)100 nm; (iii) a polyorganosiloxane binder; and (iv) a superhydrophobic agent comprising either: surface functionalised silica nanoparticles, a functional polysiloxane or a polymethylsilsesquioxane.

A composition for coating an overhead conductor is disclosed comprising: (i) a reflective agent; (ii) a photocatalytic agent comprising 70 wt % anatase titanium dioxide (TiO.sub.2) having an average particle size (aps)100 nm; (iii) a polyorganosiloxane binder; and (iv) a superhydrophobic agent comprising either: surface functionalised silica nanoparticles, a functional polysiloxane or a polymethylsilsesquioxane.

A wafer thinning tape and a preparation method thereof, and a wafer grinding method are provided. The wafer thinning tape includes a tape layer, a base film layer, and a conductive coating that are successively stacked, where the base film layer and the conductive coating constitute an antistatic base film; the raw materials of the tape layer include acrylic adhesive, curing agent, and antistatic agent, and the mass dosage of curing agent is 3%-4% that of the acrylic adhesive, and the mass dosage of antistatic agent is 1%-2% that of the acrylic adhesive; the base film layer is TPU film; the conductive coating is silver nanowire coating. The wafer thinning tape can be applied to wafer grinding, has excellent antistatic property, and can effectively inhibit the peeling static electricity; at the same time, it also has the advantages of peeling without residue and preventing water penetration.

A wafer thinning tape and a preparation method thereof, and a wafer grinding method are provided. The wafer thinning tape includes a tape layer, a base film layer, and a conductive coating that are successively stacked, where the base film layer and the conductive coating constitute an antistatic base film; the raw materials of the tape layer include acrylic adhesive, curing agent, and antistatic agent, and the mass dosage of curing agent is 3%-4% that of the acrylic adhesive, and the mass dosage of antistatic agent is 1%-2% that of the acrylic adhesive; the base film layer is TPU film; the conductive coating is silver nanowire coating. The wafer thinning tape can be applied to wafer grinding, has excellent antistatic property, and can effectively inhibit the peeling static electricity; at the same time, it also has the advantages of peeling without residue and preventing water penetration.

An ultraviolet bottom coating system including a conveyor mechanism configured to route a plurality of cans in a machine direction, wherein the plurality of cans each have a bottom surface and uncured coating material applied on the bottom surface. The system also includes at least one ultraviolet light-emitting diode (UV-LED) device configured to emit ultraviolet radiation towards the plurality of cans, wherein the ultraviolet radiation is configured to cure the uncured coating material onto the bottom surface.

An ultraviolet bottom coating system including a conveyor mechanism configured to route a plurality of cans in a machine direction, wherein the plurality of cans each have a bottom surface and uncured coating material applied on the bottom surface. The system also includes at least one ultraviolet light-emitting diode (UV-LED) device configured to emit ultraviolet radiation towards the plurality of cans, wherein the ultraviolet radiation is configured to cure the uncured coating material onto the bottom surface.