A hydrophobic-icephobic composition includes a monomer binder, an organic solvent, and a hydrolyzed organosilane. The hydrolyzed organosilane is represented by a formula of R.sup.1Si(OH).sub.3. The R.sup.1 group comprises an alkyl or a haloalkyl having from 3 to 40 carbons. A hydrophobic-icephobic coating over a substrate includes a polymer base and a polyorganosiloxane. The polyorganosiloxane includes (R.sup.1SiO.sub.2)- units. The R.sup.1 group includes an alkyl or a haloalkyl having from 3 to 40 carbons. One or more of the (R.sup.1SiO.sub.2)- units of the polyorganosiloxane are may be chemically bonded to the substrate.

There is provided a multilayer structure comprising a layer (A) containing an ethylene-vinyl alcohol copolymer having an ethylene unit content of 1 mol % or more and less than 20 mol %, a viscosity-average polymerization degree of 200 to 5000, and a saponification degree of 80 to 99.7 mol %, wherein a block character of ethylene units is 0.90 to 0.99; and a layer (B) containing at least one resin selected from the group consisting of a polyolefin resin, a polyester resin and a polyamide resin. Such a multilayer structure has excellent oxygen-gas barrier performance. In addition, an aqueous solution containing the ethylene-vinyl alcohol copolymer exhibits excellent viscosity stability even after long-term storage. Therefore, even after a long period of time from preparation of the aqueous solution, it can be uniformly applied to a substrate and thus, a multilayer structure having excellent oxygen-gas barrier performance can be provided.

Provided is a method for producing a coating that includes a surfacer coat and topcoat on a substrate and including applying a first coating material to an untreated substrate or a substrate coated with a cured electrodeposition coat, and applying a second coating material to the surfacer coat. The produced coating system is cured to form the coating. The first and second coating materials are compatible according to DIN EN ISO 12944-5:2008-01, and the second application takes place before the first coating material has reached drying stage 1 according to DIN 53150:2002-09, and the drying stage is determined according to EN ISO 9117-3:2010. The method is suitable for producing coatings on automobiles and commercial vehicles, such as trucks, vans, and buses.

There is provided a method of forming a metallized polymeric film comprising (1) coating a polymer film with an aqueous primer solution comprising a solution of at least one polyanion and at least one polyethyleneimine, wherein the polyanion is a polymer comprising at least partially neutralized acid groups having a weight average molecular weight of preferably at least 5000 g/mol prior to neutralization; and wherein said polyethyleneimine has a weight average molecular weight of preferably at least 25000 g/mol; and (2) depositing a metal or a metal oxide on the at least one coated side of the polymer film.

A composition that is easily applied, clear, well-bonded, and superhydrophobic is disclosed. In one aspect, the composition includes a hydrophobic fluorinated solvent, a binder comprising a hydrophobic fluorinated polymer, and hydrophobic fumed silica nanoparticles. Also disclosed is a structure including a substrate coated with the composition, as well as a method for making the composition and a method of coating a substrate with the composition.

A coating that can be easily applied, clear, well-bonded, and superhydrophobic is disclosed. In one aspect, a method for coating a substrate comprises providing a substrate having a surface, disposing a coating composition adjacent the surface, the composition comprising a hydrophobic fluorinated solvent, a binder comprising a hydrophobic fluorinated polymer, and hydrophobic fumed silica nanoparticles. Also disclosed is an article comprising a coating layer, the coating layer comprising a plurality of nanoparticles partially exposed on an outward surface thereof.

A method for forming a metal substrate with 3D decorations according to a predetermined pattern, on at least one face of the metal substrate including: determining drop size of primer for defining thickness of a 3D decoration, applying the primer according to a predetermined pattern onto at least one face of a metal substrate, applying thereto an electrostatic thermal curing powder coating comprising color, removing excess of electrostatic thermal curing powder coating such that the thermal curing coating remains only at a location on the metal substrate determined by the primer, inserting the metal substrate into a convection oven, and forming a metal substrate with 3D decorations according to the predetermined pattern on the at least one face of the metal substrate, and a system for performing the same.

Aspects of the application provide methods of producing substrates having modified surfaces. In some aspects, methods of surface modification involve treating a surface of a substrate with an organic reagent in vapor phase to form an organic layer over the surface. In some aspects, methods of forming a stable surface coating on an oxidized surface are provided.

A multi-layer coating system includes: (a) a first basecoat layer formed from a first coating composition including a free polyisocyanate and hydroxyl functional polymeric core-shell particles; (b) a second basecoat layer applied over at least a portion of the first basecoat layer, the second basecoat layer formed from a second coating composition including carboxylic acid functional polymeric core-shell particles; and (c) a topcoat layer applied over at least a portion of the second basecoat layer, the topcoat layer formed from a coating composition including least one free polyisocyanate having a weight average molecular weight of less than 600 g/mol and at least one film-forming resin in which an amount of free polyisocyanate having a weight average molecular weight of less than 600 g/mol is greater than 5 weight %, based on the total resin solids of the coating composition that forms the topcoat layer.

A semiconductor structure is provided including an electrically-conducting substrate and a layer of a two-dimensional material. The structure further includes a solid organic spacer layer arranged between the electrically-conducting substrate and the layer of the two-dimensional material.